TW200518131A - Multilayer capacitor - Google Patents

Multilayer capacitor

Info

Publication number
TW200518131A
TW200518131A TW093124911A TW93124911A TW200518131A TW 200518131 A TW200518131 A TW 200518131A TW 093124911 A TW093124911 A TW 093124911A TW 93124911 A TW93124911 A TW 93124911A TW 200518131 A TW200518131 A TW 200518131A
Authority
TW
Taiwan
Prior art keywords
internal conductor
capacitor body
side face
terminal electrode
electrode disposed
Prior art date
Application number
TW093124911A
Other languages
English (en)
Other versions
TWI398885B (zh
Inventor
Masaaki Togashi
Original Assignee
Tdk Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tdk Corp filed Critical Tdk Corp
Publication of TW200518131A publication Critical patent/TW200518131A/zh
Application granted granted Critical
Publication of TWI398885B publication Critical patent/TWI398885B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/35—Feed-through capacitors or anti-noise capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
TW093124911A 2003-08-21 2004-08-19 積層電容器 TWI398885B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003297784A JP3850398B2 (ja) 2003-08-21 2003-08-21 積層コンデンサ

Publications (2)

Publication Number Publication Date
TW200518131A true TW200518131A (en) 2005-06-01
TWI398885B TWI398885B (zh) 2013-06-11

Family

ID=34191191

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093124911A TWI398885B (zh) 2003-08-21 2004-08-19 積層電容器

Country Status (5)

Country Link
US (1) US6922329B2 (zh)
JP (1) JP3850398B2 (zh)
KR (1) KR101059247B1 (zh)
CN (1) CN1585056B (zh)
TW (1) TWI398885B (zh)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7463474B2 (en) * 2002-04-15 2008-12-09 Avx Corporation System and method of plating ball grid array and isolation features for electronic components
US7576968B2 (en) * 2002-04-15 2009-08-18 Avx Corporation Plated terminations and method of forming using electrolytic plating
US7177137B2 (en) * 2002-04-15 2007-02-13 Avx Corporation Plated terminations
US6982863B2 (en) * 2002-04-15 2006-01-03 Avx Corporation Component formation via plating technology
US7152291B2 (en) 2002-04-15 2006-12-26 Avx Corporation Method for forming plated terminations
TWI277988B (en) * 2004-11-18 2007-04-01 Tdk Corp Multilayer capacitor
JP4351181B2 (ja) * 2005-03-10 2009-10-28 Ｔｄｋ株式会社 積層コンデンサ、及び、積層コンデンサの等価直列抵抗調整方法
US7697262B2 (en) * 2005-10-31 2010-04-13 Avx Corporation Multilayer ceramic capacitor with internal current cancellation and bottom terminals
US7414857B2 (en) * 2005-10-31 2008-08-19 Avx Corporation Multilayer ceramic capacitor with internal current cancellation and bottom terminals
US7088569B1 (en) * 2005-12-22 2006-08-08 Tdk Corporation Multilayer capacitor
JP4912324B2 (ja) * 2005-12-26 2012-04-11 三洋電機株式会社 電気回路装置
JP4462194B2 (ja) * 2006-01-17 2010-05-12 Ｔｄｋ株式会社 積層型貫通コンデンサアレイ
JP2007273684A (ja) * 2006-03-31 2007-10-18 Tdk Corp 積層型電子部品の製造方法
JP4293625B2 (ja) * 2006-07-13 2009-07-08 Ｔｄｋ株式会社 貫通型積層コンデンサ
JP4335237B2 (ja) * 2006-07-21 2009-09-30 Ｔｄｋ株式会社 貫通型積層コンデンサ
JP5156637B2 (ja) * 2006-10-06 2013-03-06 三洋電機株式会社 電気素子
JP4404089B2 (ja) * 2006-12-13 2010-01-27 Ｔｄｋ株式会社 貫通コンデンサアレイ
US7388738B1 (en) * 2007-03-28 2008-06-17 Tdk Corporation Multilayer capacitor
US8238116B2 (en) 2007-04-13 2012-08-07 Avx Corporation Land grid feedthrough low ESL technology
JP2010177717A (ja) * 2007-05-21 2010-08-12 Sanyo Electric Co Ltd 電気素子およびその製造方法
JP4433010B2 (ja) * 2007-08-02 2010-03-17 Ｔｄｋ株式会社 貫通コンデンサ及び貫通コンデンサの製造方法
KR100916476B1 (ko) * 2007-11-30 2009-09-08 삼성전기주식회사 적층형 칩 커패시터 및 이를 구비한 회로기판 장치
JP4475338B2 (ja) * 2008-02-14 2010-06-09 Ｔｄｋ株式会社 積層コンデンサ
JP4924490B2 (ja) * 2008-03-10 2012-04-25 Ｔｄｋ株式会社 貫通型積層コンデンサ
EP2269200B1 (en) * 2008-03-20 2014-09-24 Greatbatch Ltd. Shielded three-terminal flat-through emi/energy dissipating filter
US8446705B2 (en) * 2008-08-18 2013-05-21 Avx Corporation Ultra broadband capacitor
JP5672162B2 (ja) * 2010-07-21 2015-02-18 株式会社村田製作所 電子部品
JP2013021299A (ja) * 2011-06-16 2013-01-31 Murata Mfg Co Ltd 積層セラミック電子部品
US9349786B2 (en) * 2011-08-25 2016-05-24 King Abdullah University Of Science And Technology Fractal structures for fixed MEMS capacitors
KR101477426B1 (ko) * 2013-11-04 2014-12-29 삼성전기주식회사 기판 내장용 적층 세라믹 전자부품 및 적층 세라믹 전자부품 내장형 인쇄회로기판
JP2016127262A (ja) * 2014-12-26 2016-07-11 太陽誘電株式会社 貫通型積層セラミックコンデンサ
JP6910773B2 (ja) * 2016-09-16 2021-07-28 Tdk株式会社 電子部品
JP7359595B2 (ja) 2019-08-23 2023-10-11 太陽誘電株式会社 積層セラミックコンデンサ、回路基板及び積層セラミックコンデンサの製造方法
KR102606841B1 (ko) 2022-01-26 2023-11-29 삼화콘덴서공업 주식회사 저 esl를 가지면서 esr이 제어된 3단자형 커패시터

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5993123A (ja) 1982-11-18 1984-05-29 Matsushita Electric Ind Co Ltd 燃焼器の制御装置
JPS5993123U (ja) * 1982-12-16 1984-06-25 ティーディーケイ株式会社 チツプ状磁器コンデンサ
JPS61236110A (ja) * 1985-04-11 1986-10-21 株式会社村田製作所 積層セラミツクコンデンサ
US4814940A (en) * 1987-05-28 1989-03-21 International Business Machines Corporation Low inductance capacitor
JP3336954B2 (ja) 1998-05-21 2002-10-21 株式会社村田製作所 積層コンデンサ
JP3489728B2 (ja) * 1999-10-18 2004-01-26 株式会社村田製作所 積層コンデンサ、配線基板および高周波回路
US6292351B1 (en) * 1999-11-17 2001-09-18 Tdk Corporation Multilayer ceramic capacitor for three-dimensional mounting
JP2001210544A (ja) 2000-01-25 2001-08-03 Nec Tohoku Ltd チップ積層セラミックコンデンサ
JP3930245B2 (ja) 2000-11-14 2007-06-13 Ｔｄｋ株式会社 積層型電子部品
JP3727542B2 (ja) 2001-02-05 2005-12-14 Ｔｄｋ株式会社 積層貫通型コンデンサ
JP4682491B2 (ja) 2001-09-20 2011-05-11 株式会社村田製作所 ３端子型セラミックコンデンサ
US6496355B1 (en) * 2001-10-04 2002-12-17 Avx Corporation Interdigitated capacitor with ball grid array (BGA) terminations
JP3746989B2 (ja) * 2001-12-03 2006-02-22 Ｔｄｋ株式会社 積層コンデンサ
US6765781B2 (en) * 2001-12-03 2004-07-20 Tdk Corporation Multilayer capacitor

Also Published As

Publication number Publication date
KR20050020611A (ko) 2005-03-04
JP3850398B2 (ja) 2006-11-29
US20050041368A1 (en) 2005-02-24
US6922329B2 (en) 2005-07-26
CN1585056A (zh) 2005-02-23
JP2005072149A (ja) 2005-03-17
KR101059247B1 (ko) 2011-08-25
CN1585056B (zh) 2010-12-01
TWI398885B (zh) 2013-06-11

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