WO2004093107A3 - Monolithic multi-layer capacitor with improved lead-out structure - Google Patents

Monolithic multi-layer capacitor with improved lead-out structure Download PDF

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Publication number
WO2004093107A3
WO2004093107A3 PCT/US2004/011531 US2004011531W WO2004093107A3 WO 2004093107 A3 WO2004093107 A3 WO 2004093107A3 US 2004011531 W US2004011531 W US 2004011531W WO 2004093107 A3 WO2004093107 A3 WO 2004093107A3
Authority
WO
WIPO (PCT)
Prior art keywords
layer capacitor
electrodes
internal electrode
out structure
external electrodes
Prior art date
Application number
PCT/US2004/011531
Other languages
French (fr)
Other versions
WO2004093107A2 (en
Inventor
John D Prymak
Michael S Randall
Original Assignee
Kemet Electronics Corp
John D Prymak
Michael S Randall
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kemet Electronics Corp, John D Prymak, Michael S Randall filed Critical Kemet Electronics Corp
Publication of WO2004093107A2 publication Critical patent/WO2004093107A2/en
Publication of WO2004093107A3 publication Critical patent/WO2004093107A3/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/01—Form of self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)

Abstract

A multi-layer capacitor with reduced ESL and internal electrodes for same. The multi-layer capacitor comprises a monolithic capacitor body comprising first polarity external electrodes (7) and second polarity external electrodes (7') on an exterior of the body. A first internal electrode (1) comprises first diverging lead-out electrodes (3) in electrical contact with the first polarity external electrodes (7). A second internal electrode (1') comprises second diverging lead-out electrodes (3') in electrical contact with the second polarity external electrodes (7'). The first internal electrode (1) and the second internal electrode (1') are in parallel spaced-apart relationship with a dielectric therebetween.
PCT/US2004/011531 2003-04-15 2004-04-15 Monolithic multi-layer capacitor with improved lead-out structure WO2004093107A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/413,656 US6906907B2 (en) 2003-04-15 2003-04-15 Monolithic multi-layer capacitor with improved lead-out structure
US10/413,656 2003-04-15

Publications (2)

Publication Number Publication Date
WO2004093107A2 WO2004093107A2 (en) 2004-10-28
WO2004093107A3 true WO2004093107A3 (en) 2008-01-03

Family

ID=33158585

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/011531 WO2004093107A2 (en) 2003-04-15 2004-04-15 Monolithic multi-layer capacitor with improved lead-out structure

Country Status (2)

Country Link
US (1) US6906907B2 (en)
WO (1) WO2004093107A2 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4507566B2 (en) * 2003-11-14 2010-07-21 株式会社村田製作所 Multilayer capacitor
JP2006013380A (en) * 2004-06-29 2006-01-12 Tdk Corp Laminated capacitor
JP5049560B2 (en) * 2005-11-17 2012-10-17 サムソン エレクトロ−メカニックス カンパニーリミテッド． Multilayer chip capacitor
US20070193675A1 (en) * 2006-02-22 2007-08-23 Abhijit Gurav Process of manufacturing a multilayer device and device manufactured thereby
US20080012127A1 (en) * 2006-06-28 2008-01-17 Inpaq Technology Co., Ltd. Insulation structure for multilayer passive elements and fabrication method thereof
EP1993228B1 (en) * 2007-05-18 2012-05-23 Huawei Technologies Co., Ltd. Message sending method, message sending device and message transmission system
US20130107419A1 (en) 2011-10-28 2013-05-02 Kemet Electronics Corporation Multilayered ceramic capacitor with improved lead frame attachment
USD668659S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
USD680119S1 (en) * 2011-11-15 2013-04-16 Connectblue Ab Module
USD692896S1 (en) * 2011-11-15 2013-11-05 Connectblue Ab Module
USD668658S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
USD680545S1 (en) * 2011-11-15 2013-04-23 Connectblue Ab Module
USD689053S1 (en) * 2011-11-15 2013-09-03 Connectblue Ab Module
ES2447216B1 (en) * 2012-09-11 2015-03-10 Segura Javier Luis Lopez High speed loading and unloading electricity storage device
KR101452070B1 (en) * 2012-12-20 2014-10-16 삼성전기주식회사 Multi-layered ceramic capacitor and method of manufacturing the same
US9875848B2 (en) 2015-12-21 2018-01-23 Qualcomm Incorporated MIM capacitor and method of making the same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0712142A2 (en) * 1994-11-09 1996-05-15 Dale Electronics, Inc. Electronic thick film component multiple terminal and method of making the same
US6407904B1 (en) * 1999-05-10 2002-06-18 Murata Manufacturing Co., Ltd. Multi-layer capacitor
JP2002299152A (en) * 2001-03-29 2002-10-11 Kyocera Corp Capacitor
US20030026058A1 (en) * 2001-08-06 2003-02-06 Intel Corporation Layered polymer on aluminum stacked capacitor
JP2004140211A (en) * 2002-10-18 2004-05-13 Murata Mfg Co Ltd Multilayer capacitor

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3514678A (en) * 1968-12-24 1970-05-26 Sprague Electric Co Flat pack capacitor
US4814940A (en) * 1987-05-28 1989-03-21 International Business Machines Corporation Low inductance capacitor
JPH06251993A (en) * 1993-02-22 1994-09-09 Rohm Co Ltd Chip type electronic part assembly
JP3489728B2 (en) * 1999-10-18 2004-01-26 株式会社村田製作所 Multilayer capacitors, wiring boards and high frequency circuits
JP3788329B2 (en) * 2001-11-29 2006-06-21 株式会社村田製作所 Capacitor array

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0712142A2 (en) * 1994-11-09 1996-05-15 Dale Electronics, Inc. Electronic thick film component multiple terminal and method of making the same
US6407904B1 (en) * 1999-05-10 2002-06-18 Murata Manufacturing Co., Ltd. Multi-layer capacitor
JP2002299152A (en) * 2001-03-29 2002-10-11 Kyocera Corp Capacitor
US20030026058A1 (en) * 2001-08-06 2003-02-06 Intel Corporation Layered polymer on aluminum stacked capacitor
JP2004140211A (en) * 2002-10-18 2004-05-13 Murata Mfg Co Ltd Multilayer capacitor

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 2003, no. 02 5 February 2003 (2003-02-05) *
PATENT ABSTRACTS OF JAPAN vol. 2003, no. 12 5 December 2003 (2003-12-05) *

Also Published As

Publication number Publication date
WO2004093107A2 (en) 2004-10-28
US6906907B2 (en) 2005-06-14
US20040207971A1 (en) 2004-10-21

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