TW200516135A - Diamond polishing particles and method of producing same - Google Patents

Diamond polishing particles and method of producing same

Info

Publication number
TW200516135A
TW200516135A TW093132622A TW93132622A TW200516135A TW 200516135 A TW200516135 A TW 200516135A TW 093132622 A TW093132622 A TW 093132622A TW 93132622 A TW93132622 A TW 93132622A TW 200516135 A TW200516135 A TW 200516135A
Authority
TW
Taiwan
Prior art keywords
polishing
particles
polishing particles
average particle
hard disc
Prior art date
Application number
TW093132622A
Other languages
English (en)
Chinese (zh)
Other versions
TWI357438B (enExample
Inventor
Noriyuki Kumasaka
Original Assignee
Nippon Micro Coating Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Micro Coating Kk filed Critical Nippon Micro Coating Kk
Publication of TW200516135A publication Critical patent/TW200516135A/zh
Application granted granted Critical
Publication of TWI357438B publication Critical patent/TWI357438B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
    • B01J3/06—Processes using ultra-high pressure, e.g. for the formation of diamonds; Apparatus therefor, e.g. moulds or dies
    • B01J3/08—Application of shock waves for chemical reactions or for modifying the crystal structure of substances
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00—Carbon; Compounds thereof
    • C01B32/25—Diamond
    • C01B32/28—After-treatment, e.g. purification, irradiation, separation or recovery
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Geology (AREA)
  • Inorganic Chemistry (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Carbon And Carbon Compounds (AREA)
TW093132622A 2003-10-28 2004-10-27 Diamond polishing particles and method of producing same TW200516135A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003366851A JP2005131711A (ja) 2003-10-28 2003-10-28 ダイヤモンド研磨粒子及びその製造方法

Publications (2)

Publication Number Publication Date
TW200516135A true TW200516135A (en) 2005-05-16
TWI357438B TWI357438B (enExample) 2012-02-01

Family

ID=34510265

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093132622A TW200516135A (en) 2003-10-28 2004-10-27 Diamond polishing particles and method of producing same

Country Status (3)

Country Link
US (1) US20050086870A1 (enExample)
JP (1) JP2005131711A (enExample)
TW (1) TW200516135A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI409323B (zh) * 2006-12-01 2013-09-21 日本精密研磨股份有限公司 Hard crystalline substrate grinding methods and oily grinding slurry
CN106328560A (zh) * 2015-06-29 2017-01-11 松下电器产业株式会社 加工装置以及加工方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080070482A1 (en) * 2004-07-12 2008-03-20 Showa Denko K.K. Composition for Texturing Process
WO2007001031A1 (ja) * 2005-06-29 2007-01-04 Nippon Kayaku Kabushiki Kaisha 微細ダイヤモンドの製造方法及び微細ダイヤモンド
JP4936424B2 (ja) * 2005-10-31 2012-05-23 日本ミクロコーティング株式会社 研磨材及びその製造方法
JP4838703B2 (ja) 2006-12-26 2011-12-14 富士電機株式会社 磁気記録媒体用ディスク基板の製造方法、磁気記録媒体用ディスク基板、磁気記録媒体の製造方法、磁気記録媒体、及び磁気記録装置
ATE550144T1 (de) * 2007-03-26 2012-04-15 Tokyo Diamond Tools Mfg Co Ltd Synthetischer schleifstein
JP5199011B2 (ja) * 2007-12-17 2013-05-15 ビジョン開発株式会社 研磨材
WO2009078277A1 (ja) * 2007-12-17 2009-06-25 Vision Development Co., Ltd. 研磨材
US20110020646A1 (en) * 2008-01-25 2011-01-27 West Allen J Nanodiamonds and diamond-like particles from carbonaeous material
JP4953323B2 (ja) * 2008-10-28 2012-06-13 ビジョン開発株式会社 グラファイト系炭素とダイヤモンドとからなる粒子を含有する繊維及びそれを用いた寝具
US8932553B2 (en) * 2009-03-09 2015-01-13 Institut National De La Sante Et De La Recherche Medical (Inserm) Method for manufacturing cubic diamond nanocrystals
CN104962234B (zh) * 2015-05-13 2017-05-03 华侨大学 一种掺杂二氧化钛金刚石复合磨粒及其制备方法和应用
SG11202110295XA (en) * 2019-03-26 2021-10-28 Daicel Corp Method for producing nanodiamonds doped with group 14 element, and method for purifying same
CN115340089B (zh) * 2022-08-24 2024-02-06 内蒙古唐合科技有限公司 一种人造金刚石的提纯方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE319138B (enExample) * 1966-05-11 1970-01-12 A Lovegreen
EP0731490A3 (en) * 1995-03-02 1998-03-11 Ebara Corporation Ultra-fine microfabrication method using an energy beam
JP4245310B2 (ja) * 2001-08-30 2009-03-25 忠正 藤村 分散安定性に優れたダイヤモンド懸濁水性液、このダイヤモンドを含む金属膜及びその製造物

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI409323B (zh) * 2006-12-01 2013-09-21 日本精密研磨股份有限公司 Hard crystalline substrate grinding methods and oily grinding slurry
CN106328560A (zh) * 2015-06-29 2017-01-11 松下电器产业株式会社 加工装置以及加工方法
CN106328560B (zh) * 2015-06-29 2021-05-04 松下电器产业株式会社 加工装置以及加工方法

Also Published As

Publication number Publication date
JP2005131711A (ja) 2005-05-26
US20050086870A1 (en) 2005-04-28
TWI357438B (enExample) 2012-02-01

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees