JP2005131711A - ダイヤモンド研磨粒子及びその製造方法 - Google Patents
ダイヤモンド研磨粒子及びその製造方法 Download PDFInfo
- Publication number
- JP2005131711A JP2005131711A JP2003366851A JP2003366851A JP2005131711A JP 2005131711 A JP2005131711 A JP 2005131711A JP 2003366851 A JP2003366851 A JP 2003366851A JP 2003366851 A JP2003366851 A JP 2003366851A JP 2005131711 A JP2005131711 A JP 2005131711A
- Authority
- JP
- Japan
- Prior art keywords
- diamond
- artificial diamond
- particles
- artificial
- density
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010432 diamond Substances 0.000 title claims abstract description 186
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 180
- 239000002245 particle Substances 0.000 title claims abstract description 152
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000011163 secondary particle Substances 0.000 claims abstract description 48
- 238000000034 method Methods 0.000 claims abstract description 29
- 239000011164 primary particle Substances 0.000 claims abstract description 14
- 239000002253 acid Substances 0.000 claims description 22
- 239000012535 impurity Substances 0.000 claims description 20
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 18
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 12
- 150000007513 acids Chemical class 0.000 claims description 7
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 6
- 229910017604 nitric acid Inorganic materials 0.000 claims description 6
- 238000005406 washing Methods 0.000 claims description 6
- 238000010306 acid treatment Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 41
- 238000005498 polishing Methods 0.000 abstract description 28
- 239000002002 slurry Substances 0.000 abstract description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 12
- 230000002159 abnormal effect Effects 0.000 abstract description 5
- 239000007864 aqueous solution Substances 0.000 abstract description 4
- 238000003825 pressing Methods 0.000 abstract 1
- 239000000243 solution Substances 0.000 abstract 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 18
- 239000011521 glass Substances 0.000 description 18
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 18
- 230000000052 comparative effect Effects 0.000 description 16
- 229910052799 carbon Inorganic materials 0.000 description 15
- SPSSULHKWOKEEL-UHFFFAOYSA-N 2,4,6-trinitrotoluene Chemical compound CC1=C([N+]([O-])=O)C=C([N+]([O-])=O)C=C1[N+]([O-])=O SPSSULHKWOKEEL-UHFFFAOYSA-N 0.000 description 14
- 239000000015 trinitrotoluene Substances 0.000 description 14
- 239000002360 explosive Substances 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052742 iron Inorganic materials 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 238000004880 explosion Methods 0.000 description 8
- 239000007789 gas Substances 0.000 description 8
- 239000001307 helium Substances 0.000 description 8
- 229910052734 helium Inorganic materials 0.000 description 8
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 239000011133 lead Substances 0.000 description 7
- 150000002739 metals Chemical class 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 230000003746 surface roughness Effects 0.000 description 7
- 238000010333 wet classification Methods 0.000 description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 230000002950 deficient Effects 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 230000010365 information processing Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002759 woven fabric Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- -1 organophosphates Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 229910018104 Ni-P Inorganic materials 0.000 description 1
- 229910018536 Ni—P Inorganic materials 0.000 description 1
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 239000002113 nanodiamond Substances 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
- B01J3/06—Processes using ultra-high pressure, e.g. for the formation of diamonds; Apparatus therefor, e.g. moulds or dies
- B01J3/08—Application of shock waves for chemical reactions or for modifying the crystal structure of substances
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/25—Diamond
- C01B32/28—After-treatment, e.g. purification, irradiation, separation or recovery
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Geology (AREA)
- Inorganic Chemistry (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Carbon And Carbon Compounds (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003366851A JP2005131711A (ja) | 2003-10-28 | 2003-10-28 | ダイヤモンド研磨粒子及びその製造方法 |
| US10/974,867 US20050086870A1 (en) | 2003-10-28 | 2004-10-26 | Diamond polishing particles and method of producing same |
| TW093132622A TW200516135A (en) | 2003-10-28 | 2004-10-27 | Diamond polishing particles and method of producing same |
| US12/707,904 US20100203809A1 (en) | 2003-10-28 | 2010-02-18 | Method of polishing a magnetic hard disc substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003366851A JP2005131711A (ja) | 2003-10-28 | 2003-10-28 | ダイヤモンド研磨粒子及びその製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2005131711A true JP2005131711A (ja) | 2005-05-26 |
Family
ID=34510265
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003366851A Pending JP2005131711A (ja) | 2003-10-28 | 2003-10-28 | ダイヤモンド研磨粒子及びその製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20050086870A1 (enExample) |
| JP (1) | JP2005131711A (enExample) |
| TW (1) | TW200516135A (enExample) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006006721A1 (ja) * | 2004-07-12 | 2006-01-19 | Showa Denko K.K. | テクスチャリング加工用組成物 |
| WO2007052623A1 (ja) * | 2005-10-31 | 2007-05-10 | Nihon Micro Coating Co., Ltd. | 研磨材及びその製造方法 |
| WO2009078277A1 (ja) * | 2007-12-17 | 2009-06-25 | Vision Development Co., Ltd. | 研磨材 |
| JP2009166231A (ja) * | 2007-12-17 | 2009-07-30 | Vision Development Co Ltd | 研磨材 |
| WO2009094481A3 (en) * | 2008-01-25 | 2009-10-22 | The Regents Of The University Of California | Nanodiamonds and diamond-like particles from carbonaceous material |
| JP2010106378A (ja) * | 2008-10-28 | 2010-05-13 | Vision Development Co Ltd | グラファイト系炭素とダイヤモンドとからなる粒子を含有する繊維及びそれを用いた寝具 |
| US7780504B2 (en) | 2006-12-26 | 2010-08-24 | Fuji Electric Device Technology Co., Ltd. | Method for manufacturing disk-substrates for magnetic recording media, disk-substrates for magnetic recording media, method for manufacturing magnetic recording media, magnetic recording media, and magnetic recording device |
| JP2012193106A (ja) * | 2005-06-29 | 2012-10-11 | Nippon Kayaku Co Ltd | 微細ダイヤモンドの製造方法及び微細ダイヤモンド |
| JPWO2020195999A1 (enExample) * | 2019-03-26 | 2020-10-01 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5599547B2 (ja) * | 2006-12-01 | 2014-10-01 | Ｍｉｐｏｘ株式会社 | 硬質結晶基板研磨方法及び油性研磨スラリー |
| ATE550144T1 (de) * | 2007-03-26 | 2012-04-15 | Tokyo Diamond Tools Mfg Co Ltd | Synthetischer schleifstein |
| US8932553B2 (en) * | 2009-03-09 | 2015-01-13 | Institut National De La Sante Et De La Recherche Medical (Inserm) | Method for manufacturing cubic diamond nanocrystals |
| CN104962234B (zh) * | 2015-05-13 | 2017-05-03 | 华侨大学 | 一种掺杂二氧化钛金刚石复合磨粒及其制备方法和应用 |
| US9865470B2 (en) * | 2015-06-29 | 2018-01-09 | Panasonic Corporation | Processing apparatus and processing method |
| CN115340089B (zh) * | 2022-08-24 | 2024-02-06 | 内蒙古唐合科技有限公司 | 一种人造金刚石的提纯方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE319138B (enExample) * | 1966-05-11 | 1970-01-12 | A Lovegreen | |
| EP0731490A3 (en) * | 1995-03-02 | 1998-03-11 | Ebara Corporation | Ultra-fine microfabrication method using an energy beam |
| JP4245310B2 (ja) * | 2001-08-30 | 2009-03-25 | 忠正 藤村 | 分散安定性に優れたダイヤモンド懸濁水性液、このダイヤモンドを含む金属膜及びその製造物 |
-
2003
- 2003-10-28 JP JP2003366851A patent/JP2005131711A/ja active Pending
-
2004
- 2004-10-26 US US10/974,867 patent/US20050086870A1/en not_active Abandoned
- 2004-10-27 TW TW093132622A patent/TW200516135A/zh not_active IP Right Cessation
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006006721A1 (ja) * | 2004-07-12 | 2006-01-19 | Showa Denko K.K. | テクスチャリング加工用組成物 |
| JP5221953B2 (ja) * | 2005-06-29 | 2013-06-26 | 日本化薬株式会社 | 微細ダイヤモンドの製造方法及び爆薬組成物 |
| JP2012193106A (ja) * | 2005-06-29 | 2012-10-11 | Nippon Kayaku Co Ltd | 微細ダイヤモンドの製造方法及び微細ダイヤモンド |
| WO2007052623A1 (ja) * | 2005-10-31 | 2007-05-10 | Nihon Micro Coating Co., Ltd. | 研磨材及びその製造方法 |
| JP2007119650A (ja) * | 2005-10-31 | 2007-05-17 | Nihon Micro Coating Co Ltd | 研磨材及びその製造方法 |
| US7780504B2 (en) | 2006-12-26 | 2010-08-24 | Fuji Electric Device Technology Co., Ltd. | Method for manufacturing disk-substrates for magnetic recording media, disk-substrates for magnetic recording media, method for manufacturing magnetic recording media, magnetic recording media, and magnetic recording device |
| WO2009078277A1 (ja) * | 2007-12-17 | 2009-06-25 | Vision Development Co., Ltd. | 研磨材 |
| JP2009166231A (ja) * | 2007-12-17 | 2009-07-30 | Vision Development Co Ltd | 研磨材 |
| WO2009094481A3 (en) * | 2008-01-25 | 2009-10-22 | The Regents Of The University Of California | Nanodiamonds and diamond-like particles from carbonaceous material |
| JP2010106378A (ja) * | 2008-10-28 | 2010-05-13 | Vision Development Co Ltd | グラファイト系炭素とダイヤモンドとからなる粒子を含有する繊維及びそれを用いた寝具 |
| JPWO2020195999A1 (enExample) * | 2019-03-26 | 2020-10-01 | ||
| WO2020195999A1 (ja) * | 2019-03-26 | 2020-10-01 | 株式会社ダイセル | 第１４族元素がドープされたナノダイヤモンドの製造方法及び精製方法 |
| JP7526164B2 (ja) | 2019-03-26 | 2024-07-31 | 株式会社ダイセル | 第１４族元素がドープされたナノダイヤモンドの製造方法及び精製方法 |
| US12403437B2 (en) | 2019-03-26 | 2025-09-02 | Daicel Corporation | Method for producing nanodiamonds doped with group 14 element, and method for purifying same |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200516135A (en) | 2005-05-16 |
| US20050086870A1 (en) | 2005-04-28 |
| TWI357438B (enExample) | 2012-02-01 |
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Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060811 |
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