JP2005262413A5 - - Google Patents

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Publication number
JP2005262413A5
JP2005262413A5 JP2004081768A JP2004081768A JP2005262413A5 JP 2005262413 A5 JP2005262413 A5 JP 2005262413A5 JP 2004081768 A JP2004081768 A JP 2004081768A JP 2004081768 A JP2004081768 A JP 2004081768A JP 2005262413 A5 JP2005262413 A5 JP 2005262413A5
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JP
Japan
Prior art keywords
polishing
abrasive
substrate
polishing composition
zeta potential
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004081768A
Other languages
English (en)
Japanese (ja)
Other versions
JP4286168B2 (ja
JP2005262413A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2004081768A external-priority patent/JP4286168B2/ja
Priority to JP2004081768A priority Critical patent/JP4286168B2/ja
Priority to TW094106992A priority patent/TW200613485A/zh
Priority to GB0505057A priority patent/GB2412917B/en
Priority to US11/081,560 priority patent/US20050208883A1/en
Priority to MYPI20051185A priority patent/MY141876A/en
Priority to CN2005100590654A priority patent/CN1673306B/zh
Publication of JP2005262413A publication Critical patent/JP2005262413A/ja
Publication of JP2005262413A5 publication Critical patent/JP2005262413A5/ja
Priority to US11/692,619 priority patent/US20070167116A1/en
Publication of JP4286168B2 publication Critical patent/JP4286168B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2004081768A 2004-03-22 2004-03-22 ナノスクラッチを低減する方法 Expired - Fee Related JP4286168B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2004081768A JP4286168B2 (ja) 2004-03-22 2004-03-22 ナノスクラッチを低減する方法
TW094106992A TW200613485A (en) 2004-03-22 2005-03-08 Polishing composition
GB0505057A GB2412917B (en) 2004-03-22 2005-03-11 Polishing composition
US11/081,560 US20050208883A1 (en) 2004-03-22 2005-03-17 Polishing composition
MYPI20051185A MY141876A (en) 2004-03-22 2005-03-18 Polishing composition.
CN2005100590654A CN1673306B (zh) 2004-03-22 2005-03-22 研磨液组合物
US11/692,619 US20070167116A1 (en) 2004-03-22 2007-03-28 Polishing composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004081768A JP4286168B2 (ja) 2004-03-22 2004-03-22 ナノスクラッチを低減する方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2007222603A Division JP2007301721A (ja) 2007-08-29 2007-08-29 研磨液組成物

Publications (3)

Publication Number Publication Date
JP2005262413A JP2005262413A (ja) 2005-09-29
JP2005262413A5 true JP2005262413A5 (enExample) 2007-02-15
JP4286168B2 JP4286168B2 (ja) 2009-06-24

Family

ID=35087477

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004081768A Expired - Fee Related JP4286168B2 (ja) 2004-03-22 2004-03-22 ナノスクラッチを低減する方法

Country Status (1)

Country Link
JP (1) JP4286168B2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4637003B2 (ja) * 2005-11-11 2011-02-23 花王株式会社 ハードディスク用基板の製造方法
CN102863943B (zh) 2005-08-30 2015-03-25 花王株式会社 硬盘用基板用研磨液组合物、基板的研磨方法和制造方法
JP2007257810A (ja) 2006-03-24 2007-10-04 Hoya Corp 磁気ディスク用ガラス基板の製造方法および磁気ディスクの製造方法
JP5332249B2 (ja) * 2007-06-05 2013-11-06 旭硝子株式会社 ガラス基板の研磨方法
JP2009087441A (ja) * 2007-09-28 2009-04-23 Hoya Corp 磁気ディスク用ガラス基板の製造方法および磁気ディスクの製造方法
JP5306644B2 (ja) * 2007-12-29 2013-10-02 Ｈｏｙａ株式会社 マスクブランク用基板の製造方法、多層反射膜付き基板の製造方法、及び反射型マスクブランクの製造方法、並びに反射型マスクの製造方法
JP5484782B2 (ja) * 2009-04-30 2014-05-07 花王株式会社 研磨材スラリーの製造方法
CN110283572B (zh) * 2014-03-20 2021-08-24 福吉米株式会社 研磨用组合物、研磨方法及基板的制造方法
JP6730921B2 (ja) * 2016-12-28 2020-07-29 花王株式会社 研磨液組成物の製造方法
JP6924660B2 (ja) * 2017-09-21 2021-08-25 株式会社フジミインコーポレーテッド 研磨用組成物の製造方法
JP7606316B2 (ja) * 2020-10-09 2024-12-25 花王株式会社 研磨方法
JP7519865B2 (ja) * 2020-10-09 2024-07-22 花王株式会社 研磨方法
JP7606315B2 (ja) * 2020-10-09 2024-12-25 花王株式会社 研磨方法

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