MY141876A - Polishing composition. - Google Patents

Polishing composition.

Info

Publication number
MY141876A
MY141876A MYPI20051185A MYPI20051185A MY141876A MY 141876 A MY141876 A MY 141876A MY PI20051185 A MYPI20051185 A MY PI20051185A MY PI20051185 A MYPI20051185 A MY PI20051185A MY 141876 A MY141876 A MY 141876A
Authority
MY
Malaysia
Prior art keywords
polishing composition
silica particles
substrate
polishing
optical
Prior art date
Application number
MYPI20051185A
Inventor
Hiroyuki Yoshida
Yuichi Honma
Shigeaki Takashina
Toshiya Hagihara
Original Assignee
Kao Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004081768A external-priority patent/JP4286168B2/en
Priority claimed from JP2004191782A external-priority patent/JP4414292B2/en
Application filed by Kao Corp filed Critical Kao Corp
Publication of MY141876A publication Critical patent/MY141876A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Composite Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

THE PRESENT INVENTION RELATES TO A POLISHING COMPOSITION CONTAINING AN AQUEOUS MEDIUM AND SILICA PARTICLES, WHEREIN THE SILICA PARTICLES IN THE POLISHING COMPOSITION HAS A ZETA POTENTIAL OF FROM -15 TO 40 MV; A METHOD FOR MANUFACTURING A SUBSTRATE INCLUDING THE STEP OF POLISHING A SUBSTRATE TO BE POLISHED WITH A POLISHING COMPOSITION CONTAINING AN AQUEOUS MEDIUM AND SILICA PARTICLES, WHEREIN THE SILICA PARTICLES IN THE POLISHING COMPOSITION HAS A ZETA POTENTIAL OF FROM -15 TO 40 MV; AND A METHOD FOR REDUCING SCRATCHES ON A SUBSTRATE TO BE POLISHED WITH A POLISHING COMPOSITION CONTAINING AN AQUEOUS MEDIUM AND SILICA PARTICLES, INCLUDING THE STEP OF ADJUSTING A ZETA POTENTIAL OF SILICA PARTICLES IN THE POLISHING COMPOSITION TO -15 TO 40 MV. THE POLISHING COMPOSITION CAN BE FAVORABLY USED IN POLISHING THE SUBSTRATE FOR PRECISION PARTS, INCLUDING SUBSTRATES FOR MAGNETIC RECORDING MEDIA SUCH AS MAGNETIC DISCS, OPTICAL DISCS AND OPTO-MAGNETIC DISCS; PHOTOMASK SUBSTRATES; OPTICAL LENSES; OPTICAL MIRRORS; OPTICAL PRISMS; SEMICONDUCTOR SUBSTRATES; AND THE LIKE.
MYPI20051185A 2004-03-22 2005-03-18 Polishing composition. MY141876A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004081768A JP4286168B2 (en) 2004-03-22 2004-03-22 How to reduce nanoscratches
JP2004191782A JP4414292B2 (en) 2004-06-29 2004-06-29 Polishing speed improvement method

Publications (1)

Publication Number Publication Date
MY141876A true MY141876A (en) 2010-07-16

Family

ID=34525537

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20051185A MY141876A (en) 2004-03-22 2005-03-18 Polishing composition.

Country Status (5)

Country Link
US (2) US20050208883A1 (en)
CN (1) CN1673306B (en)
GB (1) GB2412917B (en)
MY (1) MY141876A (en)
TW (1) TW200613485A (en)

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US10792785B2 (en) 2016-06-07 2020-10-06 Cabot Microelectronics Corporation Chemical-mechanical processing slurry and methods for processing a nickel substrate surface

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JP2007103463A (en) * 2005-09-30 2007-04-19 Sumitomo Electric Ind Ltd POLISHING SLURRY, SURFACE TREATMENT METHOD OF GaxIn1-xAsyP1-y CRYSTAL, AND GaxIn1-xAsyP1-y CRYSTAL SUBSTRATE
US20070122546A1 (en) * 2005-11-25 2007-05-31 Mort Cohen Texturing pads and slurry for magnetic heads
EP1813656A3 (en) * 2006-01-30 2009-09-02 FUJIFILM Corporation Metal-polishing liquid and chemical mechanical polishing method using the same
JP2007207908A (en) * 2006-01-31 2007-08-16 Fujifilm Corp Polishing agent for barrier layer
US20070176142A1 (en) * 2006-01-31 2007-08-02 Fujifilm Corporation Metal- polishing liquid and chemical-mechanical polishing method using the same
JP2007214518A (en) * 2006-02-13 2007-08-23 Fujifilm Corp Metal polishing liquid
US7902072B2 (en) * 2006-02-28 2011-03-08 Fujifilm Corporation Metal-polishing composition and chemical-mechanical polishing method
JP2007257810A (en) * 2006-03-24 2007-10-04 Hoya Corp Method of manufacturing glass substrate for magnetic disk, and method of manufacturing magnetic disk
TWI411667B (en) * 2006-04-28 2013-10-11 Kao Corp Polishing composition for magnetic disk substrate
MY153666A (en) * 2006-07-12 2015-03-13 Cabot Microelectronics Corporations Cmp method for metal-containing substrates
EP2121244B1 (en) * 2006-12-20 2013-07-10 Saint-Gobain Ceramics & Plastics, Inc. Methods for machining inorganic, non-metallic workpieces
DE102007008232A1 (en) * 2007-02-20 2008-08-21 Evonik Degussa Gmbh Dispersion containing ceria and colloidal silica
JP5403262B2 (en) * 2007-03-26 2014-01-29 Ｊｓｒ株式会社 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method for semiconductor device
DE102007035992A1 (en) * 2007-05-25 2008-11-27 Evonik Degussa Gmbh Ceria, silica or phyllosilicate and amino acid-containing dispersion
DE102007062572A1 (en) * 2007-12-22 2009-06-25 Evonik Degussa Gmbh Cerium oxide and colloidal silica containing dispersion
JP5472585B2 (en) * 2008-05-22 2014-04-16 Ｊｓｒ株式会社 Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
JP5297321B2 (en) * 2008-10-07 2013-09-25 Ｈｏｙａ株式会社 Manufacturing method of glass substrate for magnetic disk
KR101359092B1 (en) * 2009-11-11 2014-02-05 가부시키가이샤 구라레 Slurry for chemical mechanical polishing and polishing method for substrate using same
JP5819589B2 (en) * 2010-03-10 2015-11-24 株式会社フジミインコーポレーテッド Method using polishing composition
WO2011121913A1 (en) * 2010-03-29 2011-10-06 コニカミノルタオプト株式会社 Method for producing glass substrate for information recording medium
US9039914B2 (en) * 2012-05-23 2015-05-26 Cabot Microelectronics Corporation Polishing composition for nickel-phosphorous-coated memory disks
CN104395425A (en) * 2012-06-11 2015-03-04 嘉柏微电子材料股份公司 Composition and method for polishing molybdenum
US9358659B2 (en) 2013-03-04 2016-06-07 Cabot Microelectronics Corporation Composition and method for polishing glass
SG11201509225VA (en) * 2013-05-15 2015-12-30 Basf Se Chemical-mechanical polishing compositions comprising one or more polymers selected from the group consisting of n-vinyl-homopolymers and n-vinyl copolymers
US9862862B2 (en) * 2013-05-15 2018-01-09 Basf Se Chemical-mechanical polishing compositions comprising polyethylene imine
KR102298256B1 (en) * 2014-03-20 2021-09-07 가부시키가이샤 후지미인코퍼레이티드 Polishing composition, polishing method, and method for producing substrate
CN103937414B (en) * 2014-04-29 2018-03-02 杰明纳微电子股份有限公司 A kind of precise polishing solution of hard disc of computer disk substrate
JP2016124915A (en) * 2014-12-26 2016-07-11 株式会社フジミインコーポレーテッド Polishing composition, polishing method and method for producing ceramic parts
US9631122B1 (en) * 2015-10-28 2017-04-25 Cabot Microelectronics Corporation Tungsten-processing slurry with cationic surfactant
WO2018021428A1 (en) 2016-07-29 2018-02-01 株式会社クラレ Polishing pad and polishing method using same
CN109280492A (en) * 2017-07-21 2019-01-29 天津西美科技有限公司 A kind of inp wafer polishing fluid
JP6924660B2 (en) * 2017-09-21 2021-08-25 株式会社フジミインコーポレーテッド Method for manufacturing polishing composition
EP3780069A4 (en) 2018-03-28 2022-04-06 Fujimi Incorporated Gallium compound semiconductor substrate polishing composition
CN111303772A (en) * 2020-02-25 2020-06-19 山西烁科晶体有限公司 Ultrafast low-loss silicon carbide substrate polishing solution and preparation method thereof
JP2022180055A (en) * 2021-05-24 2022-12-06 信越化学工業株式会社 Polishing composition

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10792785B2 (en) 2016-06-07 2020-10-06 Cabot Microelectronics Corporation Chemical-mechanical processing slurry and methods for processing a nickel substrate surface

Also Published As

Publication number Publication date
GB0505057D0 (en) 2005-04-20
GB2412917A (en) 2005-10-12
CN1673306A (en) 2005-09-28
GB2412917B (en) 2009-06-10
US20070167116A1 (en) 2007-07-19
US20050208883A1 (en) 2005-09-22
TW200613485A (en) 2006-05-01
CN1673306B (en) 2011-08-10

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