GB0505057D0 - Polishing composition - Google Patents

Polishing composition

Info

Publication number
GB0505057D0
GB0505057D0 GBGB0505057.0A GB0505057A GB0505057D0 GB 0505057 D0 GB0505057 D0 GB 0505057D0 GB 0505057 A GB0505057 A GB 0505057A GB 0505057 D0 GB0505057 D0 GB 0505057D0
Authority
GB
United Kingdom
Prior art keywords
polishing composition
polishing
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GBGB0505057.0A
Other versions
GB2412917B (en
GB2412917A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kao Corp
Original Assignee
Kao Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004081768A external-priority patent/JP4286168B2/en
Priority claimed from JP2004191782A external-priority patent/JP4414292B2/en
Application filed by Kao Corp filed Critical Kao Corp
Publication of GB0505057D0 publication Critical patent/GB0505057D0/en
Publication of GB2412917A publication Critical patent/GB2412917A/en
Application granted granted Critical
Publication of GB2412917B publication Critical patent/GB2412917B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Composite Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
GB0505057A 2004-03-22 2005-03-11 Polishing composition Expired - Fee Related GB2412917B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004081768A JP4286168B2 (en) 2004-03-22 2004-03-22 How to reduce nanoscratches
JP2004191782A JP4414292B2 (en) 2004-06-29 2004-06-29 Polishing speed improvement method

Publications (3)

Publication Number Publication Date
GB0505057D0 true GB0505057D0 (en) 2005-04-20
GB2412917A GB2412917A (en) 2005-10-12
GB2412917B GB2412917B (en) 2009-06-10

Family

ID=34525537

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0505057A Expired - Fee Related GB2412917B (en) 2004-03-22 2005-03-11 Polishing composition

Country Status (5)

Country Link
US (2) US20050208883A1 (en)
CN (1) CN1673306B (en)
GB (1) GB2412917B (en)
MY (1) MY141876A (en)
TW (1) TW200613485A (en)

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WO2005123857A1 (en) * 2004-06-22 2005-12-29 Asahi Glass Company, Limited Polishing method for glass substrate, and glass substrate
CN101180379B (en) 2005-03-25 2013-07-24 气体产品与化学公司 Dihydroxy enol compounds used in chemical mechanical polishing compositions having metal ion oxidizers
CN102863943B (en) * 2005-08-30 2015-03-25 花王株式会社 Polishing composition for hard disk substrate, polishing method and manufacture method of substrate
JP2007103463A (en) * 2005-09-30 2007-04-19 Sumitomo Electric Ind Ltd POLISHING SLURRY, SURFACE TREATMENT METHOD OF GaxIn1-xAsyP1-y CRYSTAL, AND GaxIn1-xAsyP1-y CRYSTAL SUBSTRATE
US20070122546A1 (en) * 2005-11-25 2007-05-31 Mort Cohen Texturing pads and slurry for magnetic heads
EP1813656A3 (en) * 2006-01-30 2009-09-02 FUJIFILM Corporation Metal-polishing liquid and chemical mechanical polishing method using the same
US20070176142A1 (en) * 2006-01-31 2007-08-02 Fujifilm Corporation Metal- polishing liquid and chemical-mechanical polishing method using the same
JP2007207908A (en) * 2006-01-31 2007-08-16 Fujifilm Corp Polishing agent for barrier layer
JP2007214518A (en) * 2006-02-13 2007-08-23 Fujifilm Corp Metal polishing liquid
US7902072B2 (en) * 2006-02-28 2011-03-08 Fujifilm Corporation Metal-polishing composition and chemical-mechanical polishing method
JP2007257811A (en) 2006-03-24 2007-10-04 Hoya Corp Method of manufacturing glass substrate for magnetic disk, and method of manufacturing magnetic disk
TWI411667B (en) * 2006-04-28 2013-10-11 Kao Corp Polishing composition for magnetic disk substrate
SG173361A1 (en) * 2006-07-12 2011-08-29 Cabot Microelectronics Corp Cmp method for metal-containing substrates
TWI386468B (en) * 2006-12-20 2013-02-21 Saint Gobain Ceramics Methods for machining inorganic, non-metallic workpieces
DE102007008232A1 (en) * 2007-02-20 2008-08-21 Evonik Degussa Gmbh Dispersion containing ceria and colloidal silica
EP2437285A2 (en) * 2007-03-26 2012-04-04 JSR Corporation Chemical mechanical polishing method for semiconductor device using an aqueous dispersion
DE102007035992A1 (en) * 2007-05-25 2008-11-27 Evonik Degussa Gmbh Ceria, silica or phyllosilicate and amino acid-containing dispersion
DE102007062572A1 (en) * 2007-12-22 2009-06-25 Evonik Degussa Gmbh Cerium oxide and colloidal silica containing dispersion
JP5472585B2 (en) * 2008-05-22 2014-04-16 Ｊｓｒ株式会社 Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
JP5297321B2 (en) * 2008-10-07 2013-09-25 Ｈｏｙａ株式会社 Manufacturing method of glass substrate for magnetic disk
WO2011058952A1 (en) * 2009-11-11 2011-05-19 株式会社クラレ Slurry for chemical mechanical polishing and polishing method for substrate using same
JP5819589B2 (en) * 2010-03-10 2015-11-24 株式会社フジミインコーポレーテッド Method using polishing composition
WO2011121913A1 (en) * 2010-03-29 2011-10-06 コニカミノルタオプト株式会社 Method for producing glass substrate for information recording medium
US9039914B2 (en) * 2012-05-23 2015-05-26 Cabot Microelectronics Corporation Polishing composition for nickel-phosphorous-coated memory disks
WO2013188296A1 (en) * 2012-06-11 2013-12-19 Cabot Microelectronics Corporation Composition and method for polishing molybdenum
US9358659B2 (en) 2013-03-04 2016-06-07 Cabot Microelectronics Corporation Composition and method for polishing glass
CN105229097B (en) * 2013-05-15 2017-11-17 巴斯夫欧洲公司 Chemical-mechanical polishing compositions comprising polyethyleneimine
KR20160009579A (en) * 2013-05-15 2016-01-26 바스프 에스이 Chemical-mechanical polishing compositions comprising one or more polymers selected from the group consisting of n-vinyl-homopolymers and n-vinyl copolymers
US10106704B2 (en) * 2014-03-20 2018-10-23 Fujimi Incorporated Polishing composition, polishing method, and method for producing substrate
CN103937414B (en) * 2014-04-29 2018-03-02 杰明纳微电子股份有限公司 A kind of precise polishing solution of hard disc of computer disk substrate
JP2016124915A (en) * 2014-12-26 2016-07-11 株式会社フジミインコーポレーテッド Polishing composition, polishing method and method for producing ceramic parts
US9631122B1 (en) * 2015-10-28 2017-04-25 Cabot Microelectronics Corporation Tungsten-processing slurry with cationic surfactant
SG11201809942WA (en) 2016-06-07 2018-12-28 Cabot Microelectronics Corp Chemical-mechanical processing slurry and methods for processing a nickel substrate surface
US11154960B2 (en) 2016-07-29 2021-10-26 Kuraray Co., Ltd. Polishing pad and polishing method using same
CN109280492A (en) * 2017-07-21 2019-01-29 天津西美科技有限公司 A kind of inp wafer polishing fluid
JP6924660B2 (en) * 2017-09-21 2021-08-25 株式会社フジミインコーポレーテッド Method for manufacturing polishing composition
WO2019188747A1 (en) * 2018-03-28 2019-10-03 株式会社フジミインコーポレーテッド Gallium compound semiconductor substrate polishing composition
CN111303772A (en) * 2020-02-25 2020-06-19 山西烁科晶体有限公司 Ultrafast low-loss silicon carbide substrate polishing solution and preparation method thereof
JP2022180055A (en) * 2021-05-24 2022-12-06 信越化学工業株式会社 Polishing composition

Family Cites Families (20)

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Publication number Priority date Publication date Assignee Title
CH603879B5 (en) * 1975-02-28 1978-08-31 Ciba Geigy Ag
KR100761636B1 (en) * 1996-09-30 2007-09-27 히다치 가세고교 가부시끼가이샤 A Cerium Oxide Particle
DE19846491A1 (en) * 1998-10-09 2000-04-13 Vahle Paul Kg Current rail manufacturing method involves fitting and compression steps and application of lateral pressure to force base body material behind reverse protrusions during or after compression
US6440856B1 (en) * 1999-09-14 2002-08-27 Jsr Corporation Cleaning agent for semiconductor parts and method for cleaning semiconductor parts
EP1243611B1 (en) * 1999-11-22 2006-02-08 JSR Corporation Composited particles and aqueous dispersions for chemical mechanical polishing
DE10040039A1 (en) * 2000-08-11 2002-02-21 Daimler Chrysler Ag Change gear assembly
JPWO2002067309A1 (en) * 2001-02-20 2004-06-24 日立化成工業株式会社 Polishing agent and substrate polishing method
JP4231632B2 (en) * 2001-04-27 2009-03-04 花王株式会社 Polishing liquid composition
US6790768B2 (en) * 2001-07-11 2004-09-14 Applied Materials Inc. Methods and apparatus for polishing substrates comprising conductive and dielectric materials with reduced topographical defects
MY133305A (en) * 2001-08-21 2007-11-30 Kao Corp Polishing composition
JP3899456B2 (en) * 2001-10-19 2007-03-28 株式会社フジミインコーポレーテッド Polishing composition and polishing method using the same
JPWO2003038883A1 (en) * 2001-10-31 2005-02-24 日立化成工業株式会社 Polishing liquid and polishing method
US6776810B1 (en) * 2002-02-11 2004-08-17 Cabot Microelectronics Corporation Anionic abrasive particles treated with positively charged polyelectrolytes for CMP
US7010939B2 (en) * 2002-06-05 2006-03-14 Hoya Corporation Glass substrate for data recording medium and manufacturing method thereof
GB2393186B (en) * 2002-07-31 2006-02-22 Kao Corp Polishing composition
DE10238463A1 (en) * 2002-08-22 2004-03-04 Degussa Ag Stabilized, aqueous silicon dioxide dispersion
JP2004152785A (en) * 2002-10-28 2004-05-27 Shibaura Mechatronics Corp Abrasive composition for copper diffusion preventive film and method for manufacturing semiconductor device
US6803353B2 (en) * 2002-11-12 2004-10-12 Atofina Chemicals, Inc. Copper chemical mechanical polishing solutions using sulfonated amphiprotic agents
US7071105B2 (en) * 2003-02-03 2006-07-04 Cabot Microelectronics Corporation Method of polishing a silicon-containing dielectric
CN1307079C (en) * 2003-09-30 2007-03-28 明基电通股份有限公司 Panel display

Also Published As

Publication number Publication date
TW200613485A (en) 2006-05-01
CN1673306B (en) 2011-08-10
MY141876A (en) 2010-07-16
GB2412917B (en) 2009-06-10
US20050208883A1 (en) 2005-09-22
GB2412917A (en) 2005-10-12
CN1673306A (en) 2005-09-28
US20070167116A1 (en) 2007-07-19

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20130311