TW200511591A - Solution to thermal budget - Google Patents
Solution to thermal budgetInfo
- Publication number
- TW200511591A TW200511591A TW093122086A TW93122086A TW200511591A TW 200511591 A TW200511591 A TW 200511591A TW 093122086 A TW093122086 A TW 093122086A TW 93122086 A TW93122086 A TW 93122086A TW 200511591 A TW200511591 A TW 200511591A
- Authority
- TW
- Taiwan
- Prior art keywords
- fabricating
- solution
- process phases
- thermal budget
- optical detector
- Prior art date
Links
- 238000000034 method Methods 0.000 abstract 6
- 230000003287 optical effect Effects 0.000 abstract 5
- 238000004377 microelectronic Methods 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12004—Combinations of two or more optical elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/12—Halides
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/84—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1203—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
- H01L31/035236—Superlattices; Multiple quantum well structures
- H01L31/035254—Superlattices; Multiple quantum well structures including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table, e.g. Si-SiGe superlattices
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Crystallography & Structural Chemistry (AREA)
- Nanotechnology (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Biophysics (AREA)
- Electromagnetism (AREA)
- Life Sciences & Earth Sciences (AREA)
- Inorganic Chemistry (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Optical Integrated Circuits (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Solid State Image Pick-Up Elements (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US48932103P | 2003-07-23 | 2003-07-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200511591A true TW200511591A (en) | 2005-03-16 |
Family
ID=34102851
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093122086A TW200511591A (en) | 2003-07-23 | 2004-07-23 | Solution to thermal budget |
Country Status (7)
Country | Link |
---|---|
US (2) | US20050016446A1 (zh) |
EP (1) | EP1658519A4 (zh) |
JP (1) | JP2006529055A (zh) |
KR (1) | KR20060040711A (zh) |
CN (1) | CN100468102C (zh) |
TW (1) | TW200511591A (zh) |
WO (1) | WO2005010949A2 (zh) |
Families Citing this family (15)
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US7109051B2 (en) * | 2004-11-15 | 2006-09-19 | Freescale Semiconductor, Inc. | Method of integrating optical devices and electronic devices on an integrated circuit |
KR100641470B1 (ko) * | 2004-12-29 | 2006-11-01 | 동부일렉트로닉스 주식회사 | 저전압 씨모오스 소자 제조방법 |
JP4543956B2 (ja) * | 2005-02-18 | 2010-09-15 | ソニー株式会社 | 半導体装置およびそれを用いた電子機器 |
JP2007214538A (ja) * | 2006-01-11 | 2007-08-23 | Renesas Technology Corp | 半導体装置およびその製造方法 |
US7611914B1 (en) * | 2006-06-16 | 2009-11-03 | The United States Of America As Represented By The Director, National Security Agency | Method of fabricating turning mirror using sacrificial spacer layer and device made therefrom |
DE102006031995B4 (de) * | 2006-07-11 | 2013-02-28 | Carl Zeiss Smt Gmbh | Linsenrohlinge und Linsenelemente sowie Verfahren zu deren Herstellung |
US7738753B2 (en) * | 2008-06-30 | 2010-06-15 | International Business Machines Corporation | CMOS compatible integrated dielectric optical waveguide coupler and fabrication |
DE102009047873B4 (de) * | 2009-09-30 | 2018-02-01 | GLOBALFOUNDRIES Dresden Module One Ltd. Liability Company & Co. KG | Optischer Signalaustausch in einem Halbleiterbauelement unter Anwendung monolithischer optoelektronischer Komponenten |
CN102315266B (zh) * | 2010-06-30 | 2013-08-28 | 中国科学院微电子研究所 | 半导体结构及其制造方法 |
US8513037B2 (en) * | 2010-12-03 | 2013-08-20 | Bae Systems Information And Electronic Systems Integration Inc. | Method of integrating slotted waveguide into CMOS process |
CN103137467A (zh) * | 2011-11-24 | 2013-06-05 | 联华电子股份有限公司 | 移除氧化层的半导体制作工艺 |
US8960999B1 (en) | 2014-03-28 | 2015-02-24 | Gudpod Holdings, Llc | System for mixing beverages and method of doing the same |
CN105589131B (zh) * | 2016-01-19 | 2018-09-28 | 中国电子科技集团公司第二十三研究所 | 一种用于光波导的硅片沟槽刻蚀方法 |
EP3490000B1 (en) * | 2017-11-24 | 2023-01-04 | ams AG | Near-infrared photodetector semiconductor device |
US11428646B2 (en) * | 2020-08-28 | 2022-08-30 | Openlight Photonics, Inc. | Loss monitoring in photonic circuit fabrication |
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US20030113085A1 (en) | 2001-12-14 | 2003-06-19 | Applied Materials, Inc., A Delaware Corporation | HDP-CVD film for uppercladding application in optical waveguides |
US6624077B2 (en) | 2001-12-17 | 2003-09-23 | Applied Materials, Inc. | Integrated circuit waveguide |
US6767751B2 (en) * | 2002-05-28 | 2004-07-27 | Silicon Light Machines, Inc. | Integrated driver process flow |
US7120847B2 (en) * | 2002-06-26 | 2006-10-10 | Intellon Corporation | Powerline network flood control restriction |
US7072534B2 (en) | 2002-07-22 | 2006-07-04 | Applied Materials, Inc. | Optical ready substrates |
US7043106B2 (en) | 2002-07-22 | 2006-05-09 | Applied Materials, Inc. | Optical ready wafers |
US20050072979A1 (en) | 2002-07-22 | 2005-04-07 | Applied Materials, Inc. | Optical-ready wafers |
AU2003273221A1 (en) * | 2002-07-22 | 2004-02-09 | Applied Materials Inc. | Optical-ready substrates with optical waveguide circuits and microelectronic circuits |
US7110629B2 (en) * | 2002-07-22 | 2006-09-19 | Applied Materials, Inc. | Optical ready substrates |
US7402897B2 (en) * | 2002-08-08 | 2008-07-22 | Elm Technology Corporation | Vertical system integration |
-
2004
- 2004-07-07 US US10/885,863 patent/US20050016446A1/en not_active Abandoned
- 2004-07-22 KR KR1020067001509A patent/KR20060040711A/ko not_active Application Discontinuation
- 2004-07-22 CN CNB2004800274256A patent/CN100468102C/zh not_active Expired - Fee Related
- 2004-07-22 EP EP04778916A patent/EP1658519A4/en not_active Withdrawn
- 2004-07-22 US US10/896,754 patent/US7101725B2/en not_active Expired - Fee Related
- 2004-07-22 JP JP2006521246A patent/JP2006529055A/ja active Pending
- 2004-07-22 WO PCT/US2004/023624 patent/WO2005010949A2/en active Application Filing
- 2004-07-23 TW TW093122086A patent/TW200511591A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
US7101725B2 (en) | 2006-09-05 |
WO2005010949A3 (en) | 2006-02-16 |
CN100468102C (zh) | 2009-03-11 |
KR20060040711A (ko) | 2006-05-10 |
WO2005010949A2 (en) | 2005-02-03 |
EP1658519A4 (en) | 2007-07-18 |
JP2006529055A (ja) | 2006-12-28 |
US20050016446A1 (en) | 2005-01-27 |
EP1658519A2 (en) | 2006-05-24 |
US20050054131A1 (en) | 2005-03-10 |
CN1947042A (zh) | 2007-04-11 |
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