TW200507232A - Bonding method and bonding device - Google Patents

Bonding method and bonding device

Info

Publication number
TW200507232A
TW200507232A TW093119860A TW93119860A TW200507232A TW 200507232 A TW200507232 A TW 200507232A TW 093119860 A TW093119860 A TW 093119860A TW 93119860 A TW93119860 A TW 93119860A TW 200507232 A TW200507232 A TW 200507232A
Authority
TW
Taiwan
Prior art keywords
bonded object
bonding
holding member
bonding surface
bonded
Prior art date
Application number
TW093119860A
Other languages
English (en)
Inventor
Tsuyoshi Aruga
Junichi Hagihara
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200507232A publication Critical patent/TW200507232A/zh

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Classifications

    • H—ELECTRICITY
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    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
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TW093119860A 2003-07-02 2004-06-30 Bonding method and bonding device TW200507232A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003270304A JP2005026608A (ja) 2003-07-02 2003-07-02 接合方法および接合装置

Publications (1)

Publication Number Publication Date
TW200507232A true TW200507232A (en) 2005-02-16

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Application Number Title Priority Date Filing Date
TW093119860A TW200507232A (en) 2003-07-02 2004-06-30 Bonding method and bonding device

Country Status (7)

Country Link
US (1) US20070105459A1 (zh)
EP (1) EP1641036A4 (zh)
JP (1) JP2005026608A (zh)
KR (1) KR100691759B1 (zh)
CN (1) CN100356538C (zh)
TW (1) TW200507232A (zh)
WO (1) WO2005004225A1 (zh)

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CN101779270B (zh) * 2007-08-10 2013-06-12 株式会社尼康 基板贴合装置及基板贴合方法
JP4288297B1 (ja) * 2008-01-09 2009-07-01 三菱重工業株式会社 圧力制御装置および圧力制御方法
US20100089978A1 (en) * 2008-06-11 2010-04-15 Suss Microtec Inc Method and apparatus for wafer bonding
US8950459B2 (en) 2009-04-16 2015-02-10 Suss Microtec Lithography Gmbh Debonding temporarily bonded semiconductor wafers
CN102460677A (zh) * 2009-04-16 2012-05-16 休斯微技术股份有限公司 用于临时晶片接合和剥离的改进装置
JP4831842B2 (ja) 2009-10-28 2011-12-07 三菱重工業株式会社 接合装置制御装置および多層接合方法
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JP2005026608A (ja) 2005-01-27
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EP1641036A1 (en) 2006-03-29
WO2005004225A1 (ja) 2005-01-13
US20070105459A1 (en) 2007-05-10
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KR20060028439A (ko) 2006-03-29
CN1698190A (zh) 2005-11-16

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