TW200505628A - Substrate polishing apparatus and substrate polishing method - Google Patents

Substrate polishing apparatus and substrate polishing method

Info

Publication number
TW200505628A
TW200505628A TW093117630A TW93117630A TW200505628A TW 200505628 A TW200505628 A TW 200505628A TW 093117630 A TW093117630 A TW 093117630A TW 93117630 A TW93117630 A TW 93117630A TW 200505628 A TW200505628 A TW 200505628A
Authority
TW
Taiwan
Prior art keywords
substrate
polishing
substrate polishing
film thickness
polishing apparatus
Prior art date
Application number
TW093117630A
Other languages
English (en)
Other versions
TWI322059B (en
Inventor
Tetsuji Togawa
Koichi Fukaya
Mitsuo Tada
Taro Takahashi
Yasunari Suto
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of TW200505628A publication Critical patent/TW200505628A/zh
Application granted granted Critical
Publication of TWI322059B publication Critical patent/TWI322059B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW093117630A 2003-06-18 2004-06-18 Substrate polishing apparatus and substrate polishing method TWI322059B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003174144A JP2005011977A (ja) 2003-06-18 2003-06-18 基板研磨装置および基板研磨方法

Publications (2)

Publication Number Publication Date
TW200505628A true TW200505628A (en) 2005-02-16
TWI322059B TWI322059B (en) 2010-03-21

Family

ID=33534780

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093117630A TWI322059B (en) 2003-06-18 2004-06-18 Substrate polishing apparatus and substrate polishing method

Country Status (7)

Country Link
US (2) US7670206B2 (zh)
JP (1) JP2005011977A (zh)
KR (1) KR101090951B1 (zh)
CN (1) CN1809444B (zh)
DE (2) DE112004003157B3 (zh)
TW (1) TWI322059B (zh)
WO (1) WO2004113020A1 (zh)

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TWI459167B (zh) * 2007-01-18 2014-11-01 Studer Ag Fritz 用於控制可動工具的方法，系統以及電腦可讀取媒體
TWI569919B (zh) * 2012-04-26 2017-02-11 應用材料股份有限公司 於拋光之現場監測期間針對資料濾波之線性預測
TWI626121B (zh) * 2013-11-27 2018-06-11 美商應用材料股份有限公司 於使用預測濾波器之基板研磨時用於調整研磨速率之電腦程式產品、電腦實施方法與研磨系統
TWI649799B (zh) * 2014-06-23 2019-02-01 美商應用材料股份有限公司 導電溝槽深度之感應監控
US10350723B2 (en) 2016-09-16 2019-07-16 Applied Materials, Inc. Overpolishing based on electromagnetic inductive monitoring of trench depth
US11414776B2 (en) 2018-12-10 2022-08-16 Industrial Technology Research Institute Electrochemical processing device and method for operating electrochemical processing device

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US7854646B2 (en) 2010-12-21
US7670206B2 (en) 2010-03-02
US20100112901A1 (en) 2010-05-06
DE112004003157B3 (de) 2018-06-21
KR20060023143A (ko) 2006-03-13
TWI322059B (en) 2010-03-21
JP2005011977A (ja) 2005-01-13
WO2004113020A1 (en) 2004-12-29
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DE112004001051T5 (de) 2006-05-04
KR101090951B1 (ko) 2011-12-08

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