CN102294646A - 研磨头及化学机械研磨机台 - Google Patents
研磨头及化学机械研磨机台 Download PDFInfo
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- CN102294646A CN102294646A CN2010102178496A CN201010217849A CN102294646A CN 102294646 A CN102294646 A CN 102294646A CN 2010102178496 A CN2010102178496 A CN 2010102178496A CN 201010217849 A CN201010217849 A CN 201010217849A CN 102294646 A CN102294646 A CN 102294646A
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Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102909651A (zh) * | 2012-10-12 | 2013-02-06 | 上海华力微电子有限公司 | 用于化学研磨装置的研磨头及其化学研磨装置 |
CN103878697A (zh) * | 2014-03-06 | 2014-06-25 | 浙江工业大学 | 一种多级研抛盘的磨料导流机构 |
CN104942697A (zh) * | 2014-03-24 | 2015-09-30 | 盛美半导体设备(上海)有限公司 | 晶圆研磨头及晶圆吸附方法 |
CN106312797A (zh) * | 2016-09-21 | 2017-01-11 | 中国科学院上海光学精密机械研究所 | 调节光学元件边缘区域压强分布的抛光组件 |
CN109531404A (zh) * | 2018-11-30 | 2019-03-29 | 上海华力微电子有限公司 | 一种用于化学机械研磨的研磨系统及研磨方法 |
CN109605210A (zh) * | 2019-01-23 | 2019-04-12 | 长江存储科技有限责任公司 | 一种研磨头及化学机械研磨设备 |
CN111941269A (zh) * | 2013-12-11 | 2020-11-17 | 台湾积体电路制造股份有限公司 | 化学机械抛光系统和抛光衬底的方法 |
CN111975469A (zh) * | 2020-08-28 | 2020-11-24 | 上海华力微电子有限公司 | 化学机械研磨的方法及研磨系统 |
CN112476231A (zh) * | 2020-11-26 | 2021-03-12 | 华虹半导体(无锡)有限公司 | 化学机械研磨工艺的研磨头清洗方法 |
CN113084692A (zh) * | 2021-04-27 | 2021-07-09 | 上海芯物科技有限公司 | 化学机械研磨方法以及化学机械研磨设备 |
Citations (5)
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US5868896A (en) * | 1996-11-06 | 1999-02-09 | Micron Technology, Inc. | Chemical-mechanical planarization machine and method for uniformly planarizing semiconductor wafers |
US6015337A (en) * | 1995-07-20 | 2000-01-18 | Ebara Corporation | Polishing apparatus |
CN1500028A (zh) * | 2001-03-30 | 2004-05-26 | 拉姆研究公司 | 用于边缘抛光均匀性控制的设备 |
CN1809444A (zh) * | 2003-06-18 | 2006-07-26 | 株式会社荏原制作所 | 基片抛光设备和基片抛光方法 |
CN101590624A (zh) * | 2008-05-26 | 2009-12-02 | 中芯国际集成电路制造(北京)有限公司 | 化学机械研磨方法及研磨装置 |
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2010
- 2010-06-23 CN CN2010102178496A patent/CN102294646A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6015337A (en) * | 1995-07-20 | 2000-01-18 | Ebara Corporation | Polishing apparatus |
US5868896A (en) * | 1996-11-06 | 1999-02-09 | Micron Technology, Inc. | Chemical-mechanical planarization machine and method for uniformly planarizing semiconductor wafers |
CN1500028A (zh) * | 2001-03-30 | 2004-05-26 | 拉姆研究公司 | 用于边缘抛光均匀性控制的设备 |
CN1809444A (zh) * | 2003-06-18 | 2006-07-26 | 株式会社荏原制作所 | 基片抛光设备和基片抛光方法 |
CN101590624A (zh) * | 2008-05-26 | 2009-12-02 | 中芯国际集成电路制造(北京)有限公司 | 化学机械研磨方法及研磨装置 |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102909651A (zh) * | 2012-10-12 | 2013-02-06 | 上海华力微电子有限公司 | 用于化学研磨装置的研磨头及其化学研磨装置 |
CN111941269A (zh) * | 2013-12-11 | 2020-11-17 | 台湾积体电路制造股份有限公司 | 化学机械抛光系统和抛光衬底的方法 |
US11407083B2 (en) | 2013-12-11 | 2022-08-09 | Taiwan Semiconductor Manufacturing Co., Ltd. | Polishing head, chemical-mechanical polishing system and method for polishing substrate |
CN103878697A (zh) * | 2014-03-06 | 2014-06-25 | 浙江工业大学 | 一种多级研抛盘的磨料导流机构 |
CN104942697A (zh) * | 2014-03-24 | 2015-09-30 | 盛美半导体设备(上海)有限公司 | 晶圆研磨头及晶圆吸附方法 |
CN104942697B (zh) * | 2014-03-24 | 2019-02-19 | 盛美半导体设备(上海)有限公司 | 晶圆研磨头及晶圆吸附方法 |
CN106312797A (zh) * | 2016-09-21 | 2017-01-11 | 中国科学院上海光学精密机械研究所 | 调节光学元件边缘区域压强分布的抛光组件 |
CN109531404A (zh) * | 2018-11-30 | 2019-03-29 | 上海华力微电子有限公司 | 一种用于化学机械研磨的研磨系统及研磨方法 |
CN109605210A (zh) * | 2019-01-23 | 2019-04-12 | 长江存储科技有限责任公司 | 一种研磨头及化学机械研磨设备 |
CN111975469A (zh) * | 2020-08-28 | 2020-11-24 | 上海华力微电子有限公司 | 化学机械研磨的方法及研磨系统 |
CN112476231A (zh) * | 2020-11-26 | 2021-03-12 | 华虹半导体(无锡)有限公司 | 化学机械研磨工艺的研磨头清洗方法 |
CN113084692A (zh) * | 2021-04-27 | 2021-07-09 | 上海芯物科技有限公司 | 化学机械研磨方法以及化学机械研磨设备 |
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Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Effective date: 20121122 |
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Effective date of registration: 20121122 Address after: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Applicant after: Semiconductor Manufacturing International (Shanghai) Corporation Applicant after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Applicant before: Semiconductor Manufacturing International (Shanghai) Corporation |
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Application publication date: 20111228 |