TW200503417A - Semiconductor integrated circuit device - Google Patents

Semiconductor integrated circuit device

Info

Publication number
TW200503417A
TW200503417A TW093116792A TW93116792A TW200503417A TW 200503417 A TW200503417 A TW 200503417A TW 093116792 A TW093116792 A TW 093116792A TW 93116792 A TW93116792 A TW 93116792A TW 200503417 A TW200503417 A TW 200503417A
Authority
TW
Taiwan
Prior art keywords
integrated circuit
semiconductor integrated
circuit device
resistance
output
Prior art date
Application number
TW093116792A
Other languages
English (en)
Inventor
Hidetoshi Nishikawa
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of TW200503417A publication Critical patent/TW200503417A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/10—Spot welding; Stitch welding
    • B23K11/11—Spot welding
    • B23K11/115—Spot welding by means of two electrodes placed opposite one another on both sides of the welded parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/24—Electric supply or control circuits therefor
    • B23K11/25—Monitoring devices
    • B23K11/252—Monitoring devices using digital means
    • B23K11/253—Monitoring devices using digital means the measured parameter being a displacement or a position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/30—Features relating to electrodes
    • B23K11/31—Electrode holders and actuating devices therefor
    • B23K11/314—Spot welding guns, e.g. mounted on robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/30—Features relating to electrodes
    • B23K11/31—Electrode holders and actuating devices therefor
    • B23K11/317—Equalizing; Balancing devices for electrode holders
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/0175—Coupling arrangements; Interface arrangements
    • H03K19/0185—Coupling arrangements; Interface arrangements using field effect transistors only
    • H03K19/018585—Coupling arrangements; Interface arrangements using field effect transistors only programmable

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Robotics (AREA)
  • General Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Computing Systems (AREA)
  • Physics & Mathematics (AREA)
  • Logic Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Electronic Switches (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Dram (AREA)
TW093116792A 2003-06-23 2004-06-11 Semiconductor integrated circuit device TW200503417A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003177412A JP3808060B2 (ja) 2003-06-23 2003-06-23 半導体集積回路装置

Publications (1)

Publication Number Publication Date
TW200503417A true TW200503417A (en) 2005-01-16

Family

ID=33534958

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093116792A TW200503417A (en) 2003-06-23 2004-06-11 Semiconductor integrated circuit device

Country Status (4)

Country Link
US (1) US7514963B2 (zh)
JP (1) JP3808060B2 (zh)
TW (1) TW200503417A (zh)
WO (1) WO2004114523A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5594268B2 (ja) * 2011-09-20 2014-09-24 株式会社デンソー クロック出力回路
JP2013102095A (ja) 2011-11-09 2013-05-23 Toshiba Corp 半導体集積回路装置
JP6763661B2 (ja) * 2015-12-24 2020-09-30 ラピスセミコンダクタ株式会社 発振回路
KR102591388B1 (ko) 2016-01-18 2023-10-19 엘지전자 주식회사 반도체 발광 소자를 이용한 디스플레이 장치
KR102486308B1 (ko) * 2016-06-10 2023-01-10 삼성전자주식회사 디스플레이 모듈 및 이에 대한 코팅방법
KR102481647B1 (ko) * 2018-01-31 2022-12-28 삼성전자주식회사 Led 모듈 및 조명 장치

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3226293B2 (ja) 1991-04-24 2001-11-05 株式会社日立製作所 半導体集積回路
JPH0590942A (ja) 1991-09-30 1993-04-09 Fujitsu Ltd 出力バツフア
US5218239A (en) * 1991-10-03 1993-06-08 National Semiconductor Corporation Selectable edge rate cmos output buffer circuit
JPH05191241A (ja) * 1992-01-16 1993-07-30 Fujitsu Ltd 半導体集積回路
JPH05224621A (ja) 1992-02-14 1993-09-03 Toshiba Corp 液晶パネル駆動電源用半導体装置
JPH0661828A (ja) 1992-08-13 1994-03-04 Mitsubishi Electric Corp 出力回路
JPH06268506A (ja) * 1993-03-16 1994-09-22 Mitsubishi Electric Corp 外部出力バッファ
JPH0779146A (ja) * 1993-09-08 1995-03-20 Hitachi Ltd ドライバ回路およびそれを用いた半導体集積回路
KR0137108B1 (en) 1993-06-25 1998-06-15 Hitachi Ltd Bus driving system and integrated circuit device using the same
JPH0897693A (ja) * 1994-09-20 1996-04-12 Mazda Motor Corp 出力バッファ補償回路
JP3571124B2 (ja) * 1995-09-21 2004-09-29 富士通株式会社 半導体集積回路
JP2865163B2 (ja) * 1996-09-19 1999-03-08 日本電気株式会社 安定化電源回路
JPH113157A (ja) 1997-06-11 1999-01-06 Mitsubishi Electric Corp バスドライバ回路
IT1296611B1 (it) * 1997-12-04 1999-07-14 Sgs Thomson Microelectronics Circuito di buffer di ingresso/uscita, in particolare realizzato, in tecnologia cmos, con controllo di variazione di tensione
JP3463628B2 (ja) * 1999-10-18 2003-11-05 日本電気株式会社 スルーレート調整可能な出力回路を備えた半導体回路およびその調整方法ならびに自動調整装置
ITVA20000027A1 (it) * 2000-08-10 2002-02-10 St Microelectronics Srl Buffer di uscita e metodo di pilotaggio di un buffer di uscita.
US6683482B2 (en) * 2001-08-02 2004-01-27 Agilent Technologies, Inc. Slew rate control of output drivers using PVT controlled edge rates and delays

Also Published As

Publication number Publication date
US7514963B2 (en) 2009-04-07
JP2005012717A (ja) 2005-01-13
US20060158921A1 (en) 2006-07-20
WO2004114523A1 (ja) 2004-12-29
JP3808060B2 (ja) 2006-08-09

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