TW200501210A - Heat processing method and heat processing apparatus - Google Patents

Heat processing method and heat processing apparatus

Info

Publication number
TW200501210A
TW200501210A TW093109126A TW93109126A TW200501210A TW 200501210 A TW200501210 A TW 200501210A TW 093109126 A TW093109126 A TW 093109126A TW 93109126 A TW93109126 A TW 93109126A TW 200501210 A TW200501210 A TW 200501210A
Authority
TW
Taiwan
Prior art keywords
heat processing
processing method
processing apparatus
heating means
container
Prior art date
Application number
TW093109126A
Other languages
English (en)
Other versions
TWI288946B (en
Inventor
Takanori Saito
Kazuhide Serizawa
Takashi Ichikawa
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200501210A publication Critical patent/TW200501210A/zh
Application granted granted Critical
Publication of TWI288946B publication Critical patent/TWI288946B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Muffle Furnaces And Rotary Kilns (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW093109126A 2003-04-01 2004-04-01 Heat processing method and heat processing apparatus TWI288946B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003097672A JP3910151B2 (ja) 2003-04-01 2003-04-01 熱処理方法及び熱処理装置

Publications (2)

Publication Number Publication Date
TW200501210A true TW200501210A (en) 2005-01-01
TWI288946B TWI288946B (en) 2007-10-21

Family

ID=33156650

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093109126A TWI288946B (en) 2003-04-01 2004-04-01 Heat processing method and heat processing apparatus

Country Status (7)

Country Link
US (1) US7537448B2 (zh)
EP (1) EP1610363A4 (zh)
JP (1) JP3910151B2 (zh)
KR (1) KR100748820B1 (zh)
CN (1) CN100395871C (zh)
TW (1) TWI288946B (zh)
WO (1) WO2004090959A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI548822B (zh) * 2012-01-09 2016-09-11 Sumitomo Electric Industries An air spring for a vehicle and a trolley using the air spring

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JP4475136B2 (ja) 2005-02-18 2010-06-09 東京エレクトロン株式会社 処理システム、前処理装置及び記憶媒体
JP4607678B2 (ja) * 2005-06-15 2011-01-05 東京エレクトロン株式会社 熱処理装置、ヒータ及びヒータの製造方法
JP5117856B2 (ja) 2005-08-05 2013-01-16 株式会社日立国際電気 基板処理装置、冷却ガス供給ノズルおよび半導体装置の製造方法
US20070181062A1 (en) * 2006-02-07 2007-08-09 Kim Il-Kyoung Semiconductor device manufacturing apparatus including temperature measuring unit
JP4331768B2 (ja) * 2007-02-28 2009-09-16 東京エレクトロン株式会社 熱処理炉及び縦型熱処理装置
JP2011029211A (ja) * 2007-11-05 2011-02-10 Eagle Industry Co Ltd 加熱装置
JP5658463B2 (ja) 2009-02-27 2015-01-28 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
CN101532125B (zh) * 2009-04-21 2011-05-11 四川师范大学 多温段同时退火的真空退火装置
JP5500914B2 (ja) * 2009-08-27 2014-05-21 株式会社半導体エネルギー研究所 レーザ照射装置
JP5589878B2 (ja) * 2011-02-09 2014-09-17 東京エレクトロン株式会社 成膜装置
JP2012195565A (ja) * 2011-02-28 2012-10-11 Hitachi Kokusai Electric Inc 基板処理装置、基板処理方法及び半導体装置の製造方法
JP6345134B2 (ja) * 2015-02-23 2018-06-20 東京エレクトロン株式会社 冷却装置及びこれを用いた熱処理装置、並びに冷却方法
KR102542626B1 (ko) 2016-01-05 2023-06-15 삼성전자주식회사 전자 빔 노광 방법
JP2019186335A (ja) * 2018-04-06 2019-10-24 東京エレクトロン株式会社 基板処理装置と基板処理方法
US11127607B2 (en) * 2019-11-11 2021-09-21 Xia Tai Xin Semiconductor (Qing Dao) Ltd. Heat processing system
CN111916340B (zh) * 2020-08-06 2021-09-28 长江存储科技有限责任公司 晶圆处理装置
WO2022040164A1 (en) * 2020-08-18 2022-02-24 Mattson Technology, Inc. Rapid thermal processing system with cooling system
CN113564310A (zh) * 2021-06-30 2021-10-29 昆山溢阳潮热处理有限公司 一种基于金属热处理加工用工件快速循环降温装置
US20230060692A1 (en) * 2021-08-30 2023-03-02 Taiwan Semiconductor Manufacturing Company Ltd. Annealing apparatus and method of operating the same

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US6402508B2 (en) 1999-12-09 2002-06-11 Tokyo Electron Limited Heat and cooling treatment apparatus and substrate processing system
JP3435111B2 (ja) 1999-12-15 2003-08-11 株式会社半導体先端テクノロジーズ 半導体ウェハ熱処理装置
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JP4365017B2 (ja) * 2000-08-23 2009-11-18 東京エレクトロン株式会社 熱処理装置の降温レート制御方法および熱処理装置
TW459339B (en) 2000-12-14 2001-10-11 United Microelectronics Corp Shallow trench isolation process for preventing the corner form exposing
JP3405723B2 (ja) 2000-12-18 2003-05-12 聯華電子股▲ふん▼有限公司 加熱炉加工ガス処理システムに使用される接合装置及びその使用方法
JP3447707B2 (ja) * 2001-03-02 2003-09-16 三菱電機株式会社 熱処理装置およびこれを用いた熱処理方法
JP2002373890A (ja) 2001-06-13 2002-12-26 Hitachi Kokusai Electric Inc 基板処理装置
KR100431657B1 (ko) * 2001-09-25 2004-05-17 삼성전자주식회사 웨이퍼의 처리 방법 및 처리 장치, 그리고 웨이퍼의 식각방법 및 식각 장치
JP3912208B2 (ja) * 2002-02-28 2007-05-09 東京エレクトロン株式会社 熱処理装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI548822B (zh) * 2012-01-09 2016-09-11 Sumitomo Electric Industries An air spring for a vehicle and a trolley using the air spring

Also Published As

Publication number Publication date
EP1610363A1 (en) 2005-12-28
WO2004090959A1 (ja) 2004-10-21
JP2004304096A (ja) 2004-10-28
EP1610363A4 (en) 2008-05-14
KR20050109465A (ko) 2005-11-21
KR100748820B1 (ko) 2007-08-13
US7537448B2 (en) 2009-05-26
TWI288946B (en) 2007-10-21
CN1771584A (zh) 2006-05-10
JP3910151B2 (ja) 2007-04-25
US20070095288A1 (en) 2007-05-03
CN100395871C (zh) 2008-06-18

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees