TW200500167A - Polishing pad with optimized grooves and method of forming same - Google Patents

Polishing pad with optimized grooves and method of forming same

Info

Publication number
TW200500167A
TW200500167A TW093110874A TW93110874A TW200500167A TW 200500167 A TW200500167 A TW 200500167A TW 093110874 A TW093110874 A TW 093110874A TW 93110874 A TW93110874 A TW 93110874A TW 200500167 A TW200500167 A TW 200500167A
Authority
TW
Taiwan
Prior art keywords
polishing layer
radius
outer perimeter
polishing pad
circumference
Prior art date
Application number
TW093110874A
Other languages
English (en)
Other versions
TWI317674B (en
Inventor
Gregory P Muldowney
Original Assignee
Rohm & Haas Elect Mat
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas Elect Mat filed Critical Rohm & Haas Elect Mat
Publication of TW200500167A publication Critical patent/TW200500167A/zh
Application granted granted Critical
Publication of TWI317674B publication Critical patent/TWI317674B/zh

Links

Classifications

    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
    • E02D29/00—Independent underground or underwater structures; Retaining walls
    • E02D29/02—Retaining or protecting walls
    • E02D29/0258—Retaining or protecting walls characterised by constructional features
    • E02D29/0266—Retaining or protecting walls characterised by constructional features made up of preformed elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01G—HORTICULTURE; CULTIVATION OF VEGETABLES, FLOWERS, RICE, FRUIT, VINES, HOPS OR SEAWEED; FORESTRY; WATERING
    • A01G9/00—Cultivation in receptacles, forcing-frames or greenhouses; Edging for beds, lawn or the like
    • A01G9/02—Receptacles, e.g. flower-pots or boxes; Glasses for cultivating flowers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Civil Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Paleontology (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Structural Engineering (AREA)
  • Environmental Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW093110874A 2003-04-29 2004-04-19 Polishing pad with optimized grooves and method of chemical mechanical planarizing substrate TWI317674B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/425,689 US6783436B1 (en) 2003-04-29 2003-04-29 Polishing pad with optimized grooves and method of forming same

Publications (2)

Publication Number Publication Date
TW200500167A true TW200500167A (en) 2005-01-01
TWI317674B TWI317674B (en) 2009-12-01

Family

ID=32908378

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093110874A TWI317674B (en) 2003-04-29 2004-04-19 Polishing pad with optimized grooves and method of chemical mechanical planarizing substrate

Country Status (5)

Country Link
US (1) US6783436B1 (zh)
JP (1) JP4568015B2 (zh)
KR (1) KR101093059B1 (zh)
CN (1) CN100341666C (zh)
TW (1) TWI317674B (zh)

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7516536B2 (en) * 1999-07-08 2009-04-14 Toho Engineering Kabushiki Kaisha Method of producing polishing pad
US6869343B2 (en) * 2001-12-19 2005-03-22 Toho Engineering Kabushiki Kaisha Turning tool for grooving polishing pad, apparatus and method of producing polishing pad using the tool, and polishing pad produced by using the tool
US7591713B2 (en) * 2003-09-26 2009-09-22 Shin-Etsu Handotai Co., Ltd. Polishing pad, method for processing polishing pad, and method for producing substrate using it
TWI238100B (en) * 2003-09-29 2005-08-21 Iv Technologies Co Ltd Polishing pad and fabricating method thereof
US6843711B1 (en) * 2003-12-11 2005-01-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc Chemical mechanical polishing pad having a process-dependent groove configuration
JP2005177897A (ja) * 2003-12-17 2005-07-07 Nec Electronics Corp 研磨方法および研磨装置と半導体装置製造方法
US6955587B2 (en) * 2004-01-30 2005-10-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc Grooved polishing pad and method
US6951510B1 (en) * 2004-03-12 2005-10-04 Agere Systems, Inc. Chemical mechanical polishing pad with grooves alternating between a larger groove size and a smaller groove size
US7329174B2 (en) * 2004-05-20 2008-02-12 Jsr Corporation Method of manufacturing chemical mechanical polishing pad
US6974372B1 (en) * 2004-06-16 2005-12-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad having grooves configured to promote mixing wakes during polishing
US7059949B1 (en) * 2004-12-14 2006-06-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP pad having an overlapping stepped groove arrangement
US7131895B2 (en) * 2005-01-13 2006-11-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP pad having a radially alternating groove segment configuration
US7179159B2 (en) * 2005-05-02 2007-02-20 Applied Materials, Inc. Materials for chemical mechanical polishing
JP5186738B2 (ja) * 2006-07-10 2013-04-24 富士通セミコンダクター株式会社 研磨パッドの製造方法及び被研磨体の研磨方法
US7300340B1 (en) * 2006-08-30 2007-11-27 Rohm and Haas Electronics Materials CMP Holdings, Inc. CMP pad having overlaid constant area spiral grooves
US7234224B1 (en) * 2006-11-03 2007-06-26 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Curved grooving of polishing pads
US7520798B2 (en) * 2007-01-31 2009-04-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with grooves to reduce slurry consumption
US7311590B1 (en) 2007-01-31 2007-12-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with grooves to retain slurry on the pad texture
US8257142B2 (en) * 2008-04-15 2012-09-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
US8221196B2 (en) 2007-08-15 2012-07-17 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad and methods of making and using same
TWI409868B (zh) * 2008-01-30 2013-09-21 Iv Technologies Co Ltd 研磨方法、研磨墊及研磨系統
JP2009220265A (ja) * 2008-02-18 2009-10-01 Jsr Corp 化学機械研磨パッド
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
TWI409137B (zh) * 2008-06-19 2013-09-21 Bestac Advanced Material Co Ltd 研磨墊及其微型結構形成方法
TWM352127U (en) * 2008-08-29 2009-03-01 Bestac Advanced Material Co Ltd Polishing pad
TWM352126U (en) * 2008-10-23 2009-03-01 Bestac Advanced Material Co Ltd Polishing pad
JP5544124B2 (ja) * 2009-08-18 2014-07-09 富士紡ホールディングス株式会社 研磨パッド
KR101232787B1 (ko) * 2010-08-18 2013-02-13 주식회사 엘지화학 연마 시스템용 연마 패드
US9211628B2 (en) * 2011-01-26 2015-12-15 Nexplanar Corporation Polishing pad with concentric or approximately concentric polygon groove pattern
JP5936921B2 (ja) * 2012-05-31 2016-06-22 富士紡ホールディングス株式会社 研磨パッド
CN102744676A (zh) * 2012-07-26 2012-10-24 上海宏力半导体制造有限公司 用于化学机械研磨的研磨垫以及化学机械研磨设备
TWI599447B (zh) 2013-10-18 2017-09-21 卡博特微電子公司 具有偏移同心溝槽圖樣之邊緣排除區的ｃｍｐ拋光墊
US8980749B1 (en) 2013-10-24 2015-03-17 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for chemical mechanical polishing silicon wafers
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
JP6545261B2 (ja) 2014-10-17 2019-07-17 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 付加製造プロセスを使用する、複合材料特性を有するｃｍｐパッド構造
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
TWI549781B (zh) * 2015-08-07 2016-09-21 智勝科技股份有限公司 研磨墊、研磨系統及研磨方法
CN108290267B (zh) 2015-10-30 2021-04-20 应用材料公司 形成具有期望ζ电位的抛光制品的设备与方法
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
CN105619202A (zh) * 2016-02-26 2016-06-01 上海华力微电子有限公司 一种化学机械研磨装置及其化学机械研磨方法
CN105856063B (zh) * 2016-04-22 2017-09-15 南京航空航天大学 抛光液均匀流动的抛光垫
US10857647B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings High-rate CMP polishing method
US10586708B2 (en) 2017-06-14 2020-03-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Uniform CMP polishing method
US10857648B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Trapezoidal CMP groove pattern
US10861702B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Controlled residence CMP polishing method
US10777418B2 (en) * 2017-06-14 2020-09-15 Rohm And Haas Electronic Materials Cmp Holdings, I Biased pulse CMP groove pattern
CN107414665B (zh) * 2017-07-01 2019-12-10 肖远健 一种振动复合柔性磨抛装置
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2063961A1 (en) 1969-10-13 1971-07-16 Radiotechnique Compelec Mechanico-chemical grinder for semi-con-ducting panels
US4663890A (en) * 1982-05-18 1987-05-12 Gmn Georg Muller Nurnberg Gmbh Method for machining workpieces of brittle hard material into wafers
JPS61182753A (ja) 1985-02-07 1986-08-15 Canon Inc 研摩皿
US5177908A (en) 1990-01-22 1993-01-12 Micron Technology, Inc. Polishing pad
US5020283A (en) 1990-01-22 1991-06-04 Micron Technology, Inc. Polishing pad with uniform abrasion
FR2658747B1 (fr) * 1990-02-23 1992-07-03 Cice Sa Machine a roder, et plateau de rodage a sillon a pas variable pour une telle machine.
US5329734A (en) 1993-04-30 1994-07-19 Motorola, Inc. Polishing pads used to chemical-mechanical polish a semiconductor substrate
US5650039A (en) 1994-03-02 1997-07-22 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved slurry distribution
US5690540A (en) 1996-02-23 1997-11-25 Micron Technology, Inc. Spiral grooved polishing pad for chemical-mechanical planarization of semiconductor wafers
US5645469A (en) 1996-09-06 1997-07-08 Advanced Micro Devices, Inc. Polishing pad with radially extending tapered channels
WO1998012020A1 (en) 1996-09-19 1998-03-26 Speedfam Corporation Methods and apparatus for uniform polishing of a workpiece
US5921855A (en) 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
US6273806B1 (en) * 1997-05-15 2001-08-14 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
US5888121A (en) 1997-09-23 1999-03-30 Lsi Logic Corporation Controlling groove dimensions for enhanced slurry flow
US6254456B1 (en) 1997-09-26 2001-07-03 Lsi Logic Corporation Modifying contact areas of a polishing pad to promote uniform removal rates
JPH11216663A (ja) 1998-02-03 1999-08-10 Sony Corp 研磨パッド、研磨装置および研磨方法
GB2345255B (en) 1998-12-29 2000-12-27 United Microelectronics Corp Chemical-Mechanical Polishing Pad
JP2001018163A (ja) * 1999-07-06 2001-01-23 Speedfam Co Ltd 研磨用パッド
JP2001121405A (ja) * 1999-10-25 2001-05-08 Matsushita Electric Ind Co Ltd 研磨パッド
JP2001138212A (ja) * 1999-11-15 2001-05-22 Toshiro Doi 精密研磨装置
US20020068516A1 (en) 1999-12-13 2002-06-06 Applied Materials, Inc Apparatus and method for controlled delivery of slurry to a region of a polishing device
JP2002200055A (ja) * 2000-12-28 2002-07-16 Toshiba Medical System Co Ltd 磁気共鳴イメージング装置
US6390891B1 (en) 2000-04-26 2002-05-21 Speedfam-Ipec Corporation Method and apparatus for improved stability chemical mechanical polishing
US6656019B1 (en) 2000-06-29 2003-12-02 International Business Machines Corporation Grooved polishing pads and methods of use
US6340325B1 (en) 2000-06-29 2002-01-22 International Business Machines Corporation Polishing pad grooving method and apparatus
JP4855571B2 (ja) 2000-08-31 2012-01-18 ニッタ・ハース株式会社 研磨パッド及びその研磨パッドを用いた被加工物の研磨方法

Also Published As

Publication number Publication date
JP2004358653A (ja) 2004-12-24
TWI317674B (en) 2009-12-01
KR101093059B1 (ko) 2011-12-13
KR20040093443A (ko) 2004-11-05
CN1541807A (zh) 2004-11-03
CN100341666C (zh) 2007-10-10
JP4568015B2 (ja) 2010-10-27
US6783436B1 (en) 2004-08-31

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