TW200302847A - Curable organic resin composition - Google Patents

Curable organic resin composition Download PDF

Info

Publication number
TW200302847A
TW200302847A TW091132072A TW91132072A TW200302847A TW 200302847 A TW200302847 A TW 200302847A TW 091132072 A TW091132072 A TW 091132072A TW 91132072 A TW91132072 A TW 91132072A TW 200302847 A TW200302847 A TW 200302847A
Authority
TW
Taiwan
Prior art keywords
resin composition
organic resin
composition
component
weight
Prior art date
Application number
TW091132072A
Other languages
English (en)
Other versions
TWI312356B (en
Inventor
Makoto Iwai
Keiji Wakita
Akihiko Shirahata
Original Assignee
Dow Corning Toray Silicone
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Silicone filed Critical Dow Corning Toray Silicone
Publication of TW200302847A publication Critical patent/TW200302847A/zh
Application granted granted Critical
Publication of TWI312356B publication Critical patent/TWI312356B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C08K5/5475—Silicon-containing compounds containing nitrogen containing at least one C≡N bond
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/4009—Two or more macromolecular compounds not provided for in one single group of groups C08G18/42 - C08G18/64
    • C08G18/4045—Mixtures of compounds of group C08G18/58 with other macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/54—Polycondensates of aldehydes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/54—Polycondensates of aldehydes
    • C08G18/542—Polycondensates of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/58—Epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/61—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/64—Macromolecular compounds not provided for by groups C08G18/42 - C08G18/63
    • C08G18/6415—Macromolecular compounds not provided for by groups C08G18/42 - C08G18/63 having nitrogen
    • C08G18/6438—Polyimides or polyesterimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • C08G18/6505—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen the low-molecular compounds being compounds of group C08G18/32 or polyamines of C08G18/38
    • C08G18/6523—Compounds of group C08G18/3225 or C08G18/3271 or polyamines of C08G18/38
    • C08G18/6529—Compounds of group C08G18/3225 or polyamines of C08G18/38
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/71—Monoisocyanates or monoisothiocyanates
    • C08G18/718—Monoisocyanates or monoisothiocyanates containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/548—Silicon-containing compounds containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C08K5/5465—Silicon-containing compounds containing nitrogen containing at least one C=N bond
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31609—Particulate metal or metal compound-containing
    • Y10T428/31612—As silicone, silane or siloxane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31616—Next to polyester [e.g., alkyd]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31623—Next to polyamide or polyimide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31627—Next to aldehyde or ketone condensation product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31688—Next to aldehyde or ketone condensation product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31786—Of polyester [e.g., alkyd, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31942—Of aldehyde or ketone condensation product

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Description

0) 0)200302847 玖、發明說明 (發明說明應敘明：發明所屬之技術領域、先前技術、内容、實施方式及圖式簡單說明） 【發明的技術領域】 本發明係揭示關於硬化性有機組合物。細言之，係關於 成形性優良、當硬化之時對於金屬等之底材黏著性優越之 硬化性有機樹脂組合物。 【先前技藝】 先前，環氧樹脂如與含環氧基之有機矽烷、含氨基之有 機燒氧基石夕烧或、含魏基有機烧氧基石夕烧混合，可增強黏著 性’係被眾所皆知之事。例如特開昭6 3 - 3 0 9 5 6 6號中提議 於環氧樹脂粉狀塗料中混合有機矽烷偶合劑之^環氧丙氧 基丙基曱基二乙氧基石夕烧，N -苯基·γ -氨基丙基三曱氧基石夕 燒’ γ-巯基丙基三曱氧基矽烷等以增強塗料組合物之黏著 性。且、特開平2_ 1 8 5 5 84號公報中提議於環氧樹脂中添加 Υ -織基丙基三甲氧基矽烷之黏著劑組合物。然而含環氧基 之燒氧基矽烷而混合出之組合物，對於金屬等之底材之黏 著性未必充分。根據用途是無法使用的。再者，含氨基之 有機烧氧基矽烷或含巯基有機烷氧基矽烷之混合組合物 存在著顯著失去了環氧樹脂原本硬化性問題。 另一方面，含硫氰基之有機烷氧基矽烷及此含硫氰基之 有機烧氧基石夕烧混合出之有機橡朦組合物係被知曉的。例 如特開平4-277534號公報中提議在乙丙二烯橡膠（EPDM) 裡混合硫氰基丙基三甲氧基矽烷之組合物。該組合物於有 機過氧化物存在下硫化後物理性質的惡化微少；可成為 t %永久變形率微小之橡膠成形品。並且特開平5-214171 200302847 (2) 號公報中提議在天然橡膠（NR)、苯乙烯丁二烯橡膠 (SBR)、EPDM等可能硫化之有機橡膠裡混合硫氰基丙基三 甲氧基矽烷之組合物。該組合物於硫存在下如硫化可成為 物理性質的惡化微少之橡膠成形品。但是由於含硫氰基之 有機烷氧基矽烷中混合有機樹脂之下，改良後之該有機樹 脂之成形性及對金屬等之底材的黏著性之有機樹脂組合 物是不為所知的。 【發明所欲解決之問題】 本發明者們之專注努力下之成果，發現若於環氧樹脂裡 混合含硫氰基之有機烷氧基矽烷下將可解決上述之問 題。此外，發現了若於酚醛樹脂、醯亞胺樹脂等之熱固性 有機樹脂裡混合含硫氰基之有機烷氧基矽烷，即可增強該 黏著性以達到本發明。 換句話說本發明之目的係提供卓越的成形性、當硬化之 時熱固性有機樹脂組合物此物不喪失其硬化性而硬化、對 於金屬等底材之黏著性優越之硬化性有機樹脂組合物。 【解決問題之手段】 本發明係揭示關於一種硬化性有機樹脂組合物，其特徵 在於包含（A)硬化性有機樹脂（100重量部）及（B)—般式： X-R^SiCORqnR^.n (式中 X是 NCS-或 SCN-; R1 是亞烷基或 烷撐氧基亞烷基；R2及R3是一價烴基；η是1、2或3)表示 之含硫氰基之有機烷氧基矽烷或含異硫氰基之有機烷氧 基矽烷（0.01〜100重量部）。 【發明之實施型態】 200302847 (3) 其說明係（A)硬化性有機樹脂於常溫呈現液體或固體， 藉由加熱、紫外線、放射線、電子射線等之高熱能線照射 等若能硬化之有機樹脂即為良好。雖該種類是未被限制 的，但於加熱下硬化之有機樹脂（熱固性有機樹脂）是合乎 理想的。做為該硬化有機樹脂可例舉為環氧樹脂、酚醛樹 脂、甲醛樹脂、二曱苯樹脂、二曱苯-甲醛樹脂、酮·曱醛 樹脂、呋喃樹脂、尿醛樹脂、醯亞胺樹脂、三聚氰胺樹脂、 醇酸樹脂、不飽和聚脂樹脂、苯胺樹脂、磺胺樹脂、矽樹 脂。其中，環氧樹脂、酚醛樹脂及醯亞胺樹脂是合乎理想 的。 (B)成分係本發明組合物之一種特徵成分，其具有增強 本發明組合物之成形性、增強對於金屬等的底材之黏著性 的功能。該（B)成分為一般式：X-R^SiCOR^nR^.n (式中X 是NCS-或SCN- ; R1是亞烷基或烷撐氧基亞烷基；R2及R3 是一價烴基；η是1、2或3)表示之含硫氰基之有機烷氧基 矽烷或含異硫氰基之有機烷氧基矽烷。 上述一般式中，就做為R1之亞烷基而言，可例示為亞甲 基、次乙基、曱基亞曱基、亞丙基、曱基次乙基、丁烯基。 再者，就做為R1之烷撐氧基亞烷基而言，可例示為亞曱羥 基亞甲基、亞曱經基次乙基、乙烯經基次乙基、乙稀經基 亞丙基。就做為R2及R3之一價烴基而言，可例示為甲基、 乙基、丙基、異丙基等之院基；乙烤基、稀丙基、丁稀基 等之鏈烯基；苯基、曱苯基、二曱苯基等之芳基。η是1、 2或3，較佳為2及3。 200302847
就做為該（B)成分之含硫氰基之有機烷氧基矽烷或含異 硫氰基之有機烷氧基矽烷而言，可例示為如下之化合物。 NCS(CH2)3Si(OCH3)3 NCS(CH2)3Si(OCH2CH3)3 NCS(CH2)3Si[OCH(CH3)2]3 NCS(CH2)3Si[0(CH2)2CH3]3 NCS(CH2)3Si[0(CH2)3CH3]3 NCSCH2CH(CH3)CH2Si(OCH3)3 NCSCH2CH(CHT)CH2Si(OCH2CH3)3 SCN(CH2)3Si(OCH3)3 SCN(CH2)3Si(OCH2CH3)3 SCN(CH2)3Si[OCH(CH3)2]3 SCNCH2CH(CH3)CH2Si(OCH3)3 SCNCH2CH(CH3)CH2Si(OCH2CH3)3 SCNCH2CH(CH3)CH2Si[OCH(CH3)2]3 SCNCH2CH(CH3)CH2Si[0(CH2)3CH3]3 NCS(CH2)3SiCH3(OCH3)2 NCS(CH2)3SiCH3(OCH2CH3)2 NCS(CH2)3Si(OC6H5)3 NCSCH2CH(CH3)CH2SiCH3(OCH3)3 相對於100重量部之（A)成分，（B)成分之混合量為 0.01〜100重量部之範圍内，較佳為0.1〜50重量部之範圍 内。因若過少即會令金屬等之底材之黏著性低落；若過多 即會令機械強度低落。 200302847
(5) 本發明組合物係包含上述之（A)成分及（B)成分。但該些 成分包括於（A)成分裡添加混合之各種眾所皆知之添加 劑。例如為促進（A)成分硬化可混合硬化劑或硬化催化 劑、無機填充物、光增感劑、增塑劑、撓性賦予劑。在此 若顯示硬化劑或硬化催化劑一例，可例示為一級或二級之 氨基化合物、三級胺化合物、鋁或鍅等有機金屬化合物、 磷化氫等之有機磷化合物、硼配合物、有機銨鹽、有機硫 鹽、有機過氧化物等。就做為一種無機填充物而言，可例 示為玻璃纖維、石綿、氧化鋁纖維、為氧化鋁及二氧化矽 成分之陶瓷纖維、硼化纖維、氧化鍅纖維、碳化矽纖維、 金屬纖維、聚酯纖維、一芳香族聚醯胺纖維、尼龍纖維、 苯酚纖維、天然之動植物纖維等之纖維狀填充物；熔融二 氧化矽、沉澱二氧化矽、氣相法白炭黑、燃燒二氧化矽、 氧化鋅、燃燒黏土、炭黑、玻璃珠、氧化鋁、滑石、氧化 #弓、黏土、氫氧化铭、硫酸鋇、二氧化鈦、氮化銘、碳化 矽、氧化鎂、氧化鈹、高嶺土、雲母、氧化锆等之粉粒體 狀填充物。就做為一種增塑劑或撓性賦予劑而言，可例示 為高級脂肪酸金屬鹽、酯蠟、矽油、有機功能基含有矽油、 矽橡膠、有機橡膠。 本發明組合物係包含上述之（A)成分及（B)成分。必要之 應對係藉由均等混合上述之添加劑即可容易製造。就做為 一種為製造本發明組合物之裝置而言，可例示為連續混合 撥壓機、1 〇 s s m i X e r、捏合混合機、m i X i n g r ο 11等。且、從 本發明組合物中取得成形品係以做為（A)成分的成形方法
-10- 200302847
(6) 其先前眾所皆知之方法。例如可以適用於壓模方法、傳遞 模塑法、注射成形方法、鑄封成形方法、鑄塑成形方法、 塗覆成形方法等。 如同以上本發明之組合物係卓越的成形性、對於金屬等 之底材接著性優越。因此，活用其如此之特質，例如就做 為一有用之封閉劑或黏著劑，被使用於電器、電子零件。 【實施例】 以下係以實施例來詳細說明本發明組合物。此外，其實 施例中之黏度係2 5 °C之數值。且硬化性有機樹脂組合物之 成形性、黏著性、黏度變化率係以下示之方法評價。 〇成形性 硬化性有機樹脂組合物加壓下，其流動性係由螺旋流動 之測定來評價。螺旋流動係以EMMI規格（EMM 1-1-66)做為 基準方法來測定。 〇黏著性（A) 將其硬化性有機樹脂組合物，夾於兩片錄板（長度5 c m、 寬度1 cm、厚度0.5 mm)之間。於既定溫度、壓力之下壓 縮成形，製成鎳板與硬化性有機樹脂組合物之硬化物所整 體化之黏著實驗物體。將該實驗物體之兩片鎳板之端部各 自固定於拉伸試驗機之夾具，於50mm /分之拉伸速度下向 垂直方向拉伸，剝下有機樹脂組合物之硬化物與鎳板。緊 接之以肉眼觀察硬化性有機樹脂組合物之硬化物與鎳板 之斷裂面之斷裂狀態。結果係如下所揭示。 ◎符號：黏著性極為良好（於硬化性有機樹脂之硬化物 200302847 ⑺ 層遭破壞。凝聚破壞率1〇〇%以上） 〇符號：黏著性良好（一部分界面已分裂。凝聚破壞率 9 5 %以上） X符號：黏著性不良（於硬化性有機樹脂之硬化物及鎳 板之界面分裂。凝聚破壞率5 〇 %以下） 黏著性（B) 將其硬化性有機樹脂組合物，夾於兩片鎳板（長度5 c m、 寬度1 cm、厚度0· 5 mm)之間。於既定溫度、壓力之下壓 縮成形，製成_鎳板與硬化性有機樹脂組合物之硬化物所整 體化之黏著實驗物體。再者，同於上述，製成銅板與硬化 性有機樹脂組合物之硬化物其整體化之黏著實驗物體。將 該些實驗物體之兩片金屬板之端部各自固定於拉伸試驗 機之夾具，於50 mm/分之拉伸速度下向垂直方向拉伸，剝 下硬化性有機樹脂組合物之硬化物與金屬板。此時，測定 必要之分裂應力，做為黏著力（Kgf/cm2)。 〇黏度變化率 將製造後之硬化性有機樹脂組合物於23 t：下放置24小 時，測定黏度之增加程度，做為黏度變化率。黏度變化率 =(24小時放置後的硬化性有機樹脂組合物之黏度-製造後 立即之硬化性有機樹脂組合物之黏度）xl00/製造後立即的 硬化性有機樹脂組合物之黏度。 【實施例1】 3 5重量部之盼搭樹脂（三井化學股份有限公幻製造：苯 酚漆用酚醛樹脂、MILEX XLC-3L、軟化點70°C、170當量 200302847
之羥基）、3重量部之3 -硫氰基丙基三甲氧基矽烷 {NCS(CH2)3Si(OCH3)3}、65重量部之熔融石英粉末、4重 量部之環六亞甲基四胺及1重量部之加洛巴壌以9 0 °C加熱 滾壓來混煉，製造出硬化性酚醛樹脂組合物。粉碎該組合 物，將該組合物夾於兩片鎳板（長度5 c m、寬度1 c m、厚 度0.5 mm)之間，於溫度175°C、壓力70 kg/cm2、加熱3分 鐘之條件下壓縮成形。其後，以1 8 0 °C加熱2小時完成硬 化，製造出鎳板及酚醛樹脂組合物之硬化物成整體化之黏 著實驗物體。關·於該實驗物體對硬化性有機樹脂之鎳板的 黏著性係藉前述黏著實驗（A)中所記載之方法來測定，其 結果揭不於表1。 【比較實例1】 於實施例1，以3 -環氧丙氧基丙基三曱氧基矽烷取代3 -硫氰基丙基三曱氧基矽烷來混合之外，皆與實施例1相同 地來製造苯酚漆用酚醛樹脂。對於該組合物之鎳板的黏著 性與實施例1之測定相同，其結果一併記於表1。 【比較實例2】 於實施例1，除3 -硫氰基丙基三曱氧基矽烷無混合之 外，皆與實施例1相同地來製造苯酚漆用酚醛樹脂。對於 該組合物之鎳板的黏著性與實施例1之測定相同，其結果 一併記於表1。 【表1】
測定項目 實施例1 比較實例1 比較實例2 黏著性(A) ◎ X X -13- 200302847
【實施例2】 其包含單位40摩爾％之CH3Si03/2、單位10摩爾％之 C6H5(CH3)Si02/2、單位 40摩 _ %之 C6H5Si03/2及單位 10摩 爾％之（C6H5)2Si02/2，直接連結於矽原子之含有5重量％羥 基之1 3重量部的曱基苯基聚矽氧烷樹脂及1 3重量部之正 甲酚漆用酚醛環氧樹脂（日本化藥股份有限公司製造： EOCN- 1 02 0、軟化點80 °C、220當量之環氧樹脂）、2重量部 之3-硫氰基丙基三曱氧基矽烷{NCS(CH2)3SiCH3(OCH3)2}、74 重量部之熔@ 英粉末、0 · 9 0重量部之鋁乙酸丙銅配位基 及1重量部之加洛巴蠟以9 0 °C加熱滾壓來混煉，製造出熱 固性環氧樹脂組合物。測定該熱固性樹脂組合物之螺旋流 動。緊接之將該熱固性樹脂組合物夾於兩片鎳板（長度5 cm、寬度lcm、厚度0.5 mm)之間，於溫度175 °C、壓力70 kg/cm2、加熱2分鐘之條件下壓縮成形。其後，以180°C加 熱1 2小時完成硬化，製造出鎳板及硬化性樹脂組合物之硬 化物成整體化之黏著實驗物體。關於該實驗物體對硬化性 樹脂組合物之鎳板的黏著性係藉前述黏著實驗（A)中所記 載之方法來測定，其結果揭示於表2。 【實施例3】 於實施例2，以3-異硫氰基丙基三曱氧基矽烷 {SCN(CH2)3Si(OCH3)3}取代3-硫氰基丙基曱基二曱氧基矽 烷3 -硫氰基丙基三曱氧基矽烷來混合之外，皆與實施例2 相同地來製造熱固性環氧樹脂組合物。該組合物之螺旋流 動及對鎳板之黏著性與實施例2之測定相同，其該些結果 -14- 200302847 (ίο) 揭示於表2。 【比較實例3】 於實施例2 ，以3- Μ基丙基三甲氧基石夕烧
{HS(CH2)3Si(OCH3)3}取代3-硫氰基丙基甲基二曱氧基石夕 烷來混合之外，皆與實施例2相同地來製造熱固性環氧樹 脂組合物。以前述黏著實驗（A)裡$己載之方法來測定該組 合物之對鎳板之黏著性與螺旋流動，該些結果一併記於表 2 〇 【比較實例4 1 於實施例2 ’除3 -硫氰基丙基曱基一曱氧基秒烧無混人 之外，皆與實施例2相同地來製造熱固性環氧樹脂組人 物。該組合物之成形性（螺旋流動）及對鎳板之黏著性與實 施例2之測定相同，該些結果一併記於表2。 【表2】
測定項目 實施例2 實施例3 比較實例3 比較實例4 螺旋流動(英对） 42 39 21 13 黏著性(A) ◎ 〇 〇 X 【實施例4】 3 5重量部之丁烯二酸聚醯亞胺-三氮雜苯型之熱固性聚 亞胺樹脂（MITSUBISHI GAS CHEMICAL股份有限公司製 造）、4重量部之3-硫氰基丙基三曱氧基矽烷 {NCS(CH2)3Si(OCH3)3}、65重量部之熔融石英粉末、1重 量部之加洛巴堪及0 · 3 2重量部之苯甲酸鋁以9 0 °C加熱滾 -15- 200302847
(11) 壓來混煉，製造出熱固性醯亞胺樹脂組合物。測定該組合 物之螺旋流動。緊接之將該組合物夾於兩片鎳板（長度5 cm、寬度lcm、厚度0.5mm)之間，於溫度220 °C、壓力70 kg/cm2、加熱4分鐘之條件下壓縮成形。其後，以23 0°C加 熱3小時完成硬化，製造出鎳板及熱固性醯亞胺樹脂組合 物之硬化物成整體化之黏著實驗物體。關於該實驗物體對 熱固性醯亞胺樹脂組合物之鎳板的黏著性係藉前述黏著 實驗（A)中所記載之方法來測定，其結果揭示於表3。 【比較實例5 l· 於實施例4，除3 -硫氰基丙基三曱氧基矽烷無混合之 外，皆與實施例4相同地來製造熱固性醯亞胺樹脂組合 物。該組合物之螺旋流動及對鎳板之黏著性與實施例4之 測定相同，該些結果一併記於表3。 【表3】
測定項目 實施例4 比較實例5 螺旋流動(英忖） 52 43 黏著牲(A) ◎ X 【實施例5】 7 5重量部之正曱酚漆用酚醛環氧樹脂（日本化藥股份有 限公司製造·· EOCN- 1 020、軟化點80°C、220當量之環氧 樹脂）、2 6 0重量部之容融二氧化石夕、1重量部之加洛巴4鼠、 3 5重量部之苯酚漆用酚醛樹脂（三井化學股份有限公司製 造：MILEX XLC-3L、軟化點70°C、170當量之羥基）、0.6 -16- 200302847 (12)
重量部之三苯基構、5重量部之3 -硫氰基丙基三甲氧基石夕 烧{N C S ( C Η 2 ) 3 S i (Ο C Η 3) 3}，以9 0 °C加熱滾壓來混煉，製造 出熱固性環氧樹脂組合物。測定該組合物之螺旋流動。緊 接之，將該組合物夾於兩片鎳板（長度5 cm、寬度1 cm、 厚度0.5 mm)之間’於溫度150C、壓力70 kg/cm2、加熱3 分鐘之條件下壓縮成形。其後，以1 8 0 °C加熱4小時完成硬 化，製造出鎳板及熱固性環氧組合物之硬化物成整體化之 黏著實驗物體。關於該實驗物體對熱固性環氧樹脂組合物 之鎳板的黏著性係藉前述黏著實驗（A)中所記載之方法來 測定，其結果揭示於表4。 【比較實例6】 於實施例5，以3 -環氧丙氧基丙基三甲氧基矽烷取代3 -硫氰基丙基三曱氧基矽烷來混合之外，皆與實施例5相同 地來製造熱固性環氧樹脂組合物。以前述黏著實驗（A)裡 記載之方法來測定該組合物對鎳板之黏著性與螺旋流 動，該些結果一併記於表4。 【比較實例7】 於實施例5,除3-硫氰基丙基三曱氧基矽烷{NCS(CH2}3Si(OCH3}3}無混 合之外，皆與實施例5相同地來製造熱固性環氧樹脂組合 物。 該組合物以前述黏著實驗（A)裡記載之方法來測定該組 合物對#板之黏著性與螺旋流動，該些結果一併記於表4。 -17- 200302847
(13) 【表4】 測定項目 實施例5 比較實例6 比較實例7 螺旋流動(英吋） 55 53 52 黏著性(A) ◎ X X 【實施例6】 於室溫中將20重量部之液體環氧樹脂（UNION CARBIDE 公司製造：ERL-4221)、22重量部之液體酸脫水物（3及4-甲基己烧及泥鄰苯二曱酸酐）、0.3重量部之鋅酸錫、2重量 一一 * —夺-. 部之3-硫氰基丙基三甲氧基矽烷{NCS(CH2)3Si(〇CH3)3}充— 分混合後消泡以製造熱固性液體環氧樹脂組合物。測定該 組合物之黏度變化率。緊接之，將該組合物夾於兩片鎳板 或兩片銅板（各長度5 cm、寬度1 cm、厚度0· 5 mm)之間， 於溫度120°C、壓力70 kg/cm2、加熱3分鐘之條件下壓縮成 形。其後’以1 5 0 °c加熱3小時完成硬化，製造出鎳板或銅 板與熱固性環氧組合物之硬化物成整體化之黏著實驗物 y 體。關於該些實驗物體係藉前述黏著實驗（B)中所記載之一 方法來測定，其結果揭示於表5。 _ 【比較實例8】 於實施例6,以3-巯基丙基三甲氧基矽烷取代3·硫氰基丙 基二甲氧基矽烷來混合之外，皆與實施例6相同地來製造 熱固性環氧樹脂組合物。以前述黏著實驗（B)裡記載之方 法來測定該組合物之黏著性與黏度變化率，該些結果一併 記於表5。 【比較實例9】 -18- 200302847 (14) 於貫施例6 ’以3-¾氧丙氧基丙基二甲氧基碎烧取代3-硫氰基丙基三甲氧基矽烷來混合之外，皆與實施例6相同 地來製造熱固性環氧樹脂組合物。以前述黏著實驗（B)裡 記載之方法來測定該組合物之黏著性與黏度變化率，該些 結果一併記於表5。 【比較實例1 0】 於實施例6，除3 -硫氰基丙基三曱氧基矽烷無混合之 外，皆與實施例6相同地來製造熱固性環氧樹脂組合物。 與實施例6同樣使其硬化。以前述黏著實驗（B)裡記載之方 法來測定該組合物之黏著性與黏度變化率，該些結果一併 記於表5。 【表5】 測定項目 實施例6 比較實例8 比較實例9 比較實例10 黏度變化倍率 2 無能測定 13 4 (膠凝作用） 黏著性(B)(kgf/cm2) 鎳板 182 85 62 59 銅板 121 89 52 53 【發明之功效】 本發明之一種硬化性有機樹脂組合物，其包含（A)成分 及（B)成分。特別是因含有（B)成分之一般式： X-Ri-SUOR^nR^-n (式中 X是 NCS-或 SCN- ; R1是亞烷基或 200302847
(15) 烷撐氧基亞烷基；R2及R3是一價烴基；η是1、2或3)表示 之含硫氰基之有機烷氧基矽烷或含異硫氰基之有機烷氧 基矽烷（0.01〜100重量部），使其具有卓越的成形性、當硬 化之時熱固性有機樹脂此物不喪失其硬化性而硬化、對於 金屬等之底材之黏著性優越之特徵。 -20-

Claims (1)

  1. 200302847 拾、申請專利範圍 1 . 一種硬化性有機樹脂組合物，其特徵在於包含：（A)硬 化性有機樹脂（100重量部）；及（B) —般式： X-RLSiCOR^nR^-n (式中 X是 NCS -或 SCN-; R1是亞烷 基或烷撐氧基亞烷基；R2及R3是一價烴基；η是1、2或 3)表示之含硫氰基之有機烷氧基矽烷或含異硫氰基之 有機烷氧基矽烷（〇·〇1〜100重量部）。 2. 如申請專利範圍第1項之硬化性有機樹脂組合物，其中 (Α)成分係_戴®性有機樹脂。 3. 如申請專利範圍第1至2項中任一項之硬化性有機樹脂 組合物，其中（A)成分係紛酸樹脂。 4. 如申請專利範圍第1至2項中任一項之硬化性有機樹脂 組合物，其中（A)成分係環氧樹脂。 5. 如申請專利範圍第1至2項中任一項之硬化性有機樹脂 組合物，其中（A)成分係醯亞胺樹脂。 6. 如申請專利範圍第1項之硬化性有機樹脂組合物，其中 (B)成分係3-硫氰基丙基三曱氧基矽烷。 7. 如申請專利範圍第1項之硬化性有機樹脂組合物，其中 (B)成分係3-硫氰基丙基曱基二曱氧基矽烷。 8. 如申請專利範圍第1項之硬化性有機樹脂組合物，其中 (B)成分係3-異硫氰基丙基三曱氧基矽烷。 200302847 陸、（一）、本案指定代表圖為:第 圖 (二）、本代表圖之元件代表符號簡單說明： 柒、本案若有化學式時，請揭示最能顯示發明特徵的化學 式:
TW091132072A 2001-10-29 2002-10-29 Thermalsetting organic resin composition TWI312356B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001330914 2001-10-29

Publications (2)

Publication Number Publication Date
TW200302847A true TW200302847A (en) 2003-08-16
TWI312356B TWI312356B (en) 2009-07-21

Family

ID=19146566

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091132072A TWI312356B (en) 2001-10-29 2002-10-29 Thermalsetting organic resin composition

Country Status (8)

Country Link
US (1) US7446137B2 (zh)
EP (1) EP1448694B1 (zh)
KR (1) KR100856162B1 (zh)
CN (1) CN1282697C (zh)
AT (1) ATE444988T1 (zh)
DE (1) DE60233962D1 (zh)
TW (1) TWI312356B (zh)
WO (1) WO2003037976A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI660008B (zh) * 2014-08-26 2019-05-21 日商琳得科股份有限公司 硬化性組合物、硬化性組合物之製造方法、硬化物、硬化性組合物之使用方法以及光裝置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5471397B2 (ja) * 2009-12-15 2014-04-16 住友ベークライト株式会社 光電気混載基板および電子機器
AU2020271379A1 (en) 2019-04-07 2021-12-02 Sea Ark Technologies Ltd. Emergency flotation device using compressed gas

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AR207457A1 (es) 1974-01-10 1976-10-08 Degussa Mezcla adhesiva de caucho para mejorar la adhesividad de mezclas vulcanizables de textiles o tejidos metalicos despues del vulcanizado
US4234636A (en) 1978-12-28 1980-11-18 Phillips Petroleum Company Thermoplastic elastomeric composition, product and method of manufacture
DE2933346C2 (de) 1979-08-17 1982-07-01 Degussa Ag, 6000 Frankfurt Silan/Füllstoff-Präparationen, Verfahren zu deren Herstellung und Anwendung derselben
DE3305373C2 (de) 1983-02-17 1985-07-11 Degussa Ag, 6000 Frankfurt Elastische Formmasse, Verfahren zum Herstellen und Verformen und Verwendung derselben
JPS63309566A (ja) 1987-06-12 1988-12-16 Nitto Electric Ind Co Ltd エポキシ樹脂粉体塗料
JP2671277B2 (ja) 1989-01-11 1997-10-29 東芝ケミカル株式会社 金属張積層板用接着剤
DE4100217A1 (de) * 1991-01-07 1992-07-09 Degussa Mit peroxiden vulkanisierbare formmassen und ein verfahren zur herstellung
DE4128203C1 (zh) 1991-08-26 1993-05-13 Degussa Ag, 6000 Frankfurt, De
JP3479084B2 (ja) * 1996-06-26 2003-12-15 株式会社ブリヂストン ゴム組成物
EP1428829B1 (en) * 2001-09-21 2009-02-18 Dow Corning Toray Co., Ltd. Process for preparation of thiocyanato-bearing organoalkoxysilanes

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI660008B (zh) * 2014-08-26 2019-05-21 日商琳得科股份有限公司 硬化性組合物、硬化性組合物之製造方法、硬化物、硬化性組合物之使用方法以及光裝置

Also Published As

Publication number Publication date
DE60233962D1 (de) 2009-11-19
US20040249090A1 (en) 2004-12-09
KR20040063917A (ko) 2004-07-14
US7446137B2 (en) 2008-11-04
WO2003037976A1 (en) 2003-05-08
CN1282697C (zh) 2006-11-01
ATE444988T1 (de) 2009-10-15
CN1578808A (zh) 2005-02-09
KR100856162B1 (ko) 2008-09-03
TWI312356B (en) 2009-07-21
EP1448694B1 (en) 2009-10-07
EP1448694A1 (en) 2004-08-25

Similar Documents

Publication Publication Date Title
EP0707042B1 (en) Epoxy resin molding material for sealing electronic parts and sealed semiconductor device using the same
TWI383025B (zh) Hardened silicone compositions and electronic parts
KR101244203B1 (ko) 경화성 실리콘 조성물 및 이로부터 제조한 경화품
KR20070007255A (ko) 경화성 실리콘 조성물 및 이의 경화된 제품
TW202009272A (zh) 半導體封裝用熱固性樹脂組合物和半導體裝置
JP2010509088A (ja) 立体成型品及びその製造方法並びにその用途
JP2009155370A (ja) モーター封止用エポキシ樹脂成形材料及び成形品
TWI814868B (zh) 半導體封裝用熱固性樹脂組合物及半導體裝置
TW200302847A (en) Curable organic resin composition
KR930003695B1 (ko) 반도체밀봉용 수지조성물
JPH0747622B2 (ja) エポキシ樹脂組成物及びその硬化物
CN1906226A (zh) 固化性硅氧烷组合物及其固化产物
JPH0617026A (ja) 自己接着性シリコーン組成物
TWI425048B (zh) 可固化環氧樹脂組合物、其固化體及其用途
JP2009197188A (ja) 油面接着性室温硬化型オルガノポリシロキサン組成物及びその硬化物
JPH01299852A (ja) ゴム組成物
JPH0680142B2 (ja) フエノ−ル系樹脂組成物
JP4087218B2 (ja) 硬化性有機樹脂組成物
KR100895944B1 (ko) 실리콘 실란트
JPH0697324A (ja) 樹脂封止型半導体装置
JPS61100417A (ja) ゴム製品の成型加硫方法
JPH0578450A (ja) 電気・電子部品封止用樹脂組成物
JPH03170524A (ja) 硬化性エポキシ樹脂組成物
JPH03275710A (ja) 硬化性エポキシ樹脂組成物
JPH04108851A (ja) 硬化性エポキシ樹脂組成物

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees