SK287825B6 - An electronic device - Google Patents
An electronic device Download PDFInfo
- Publication number
- SK287825B6 SK287825B6 SK852-2003A SK8522003A SK287825B6 SK 287825 B6 SK287825 B6 SK 287825B6 SK 8522003 A SK8522003 A SK 8522003A SK 287825 B6 SK287825 B6 SK 287825B6
- Authority
- SK
- Slovakia
- Prior art keywords
- circuit board
- printed circuit
- filler
- chamber
- heat
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Glass Compositions (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
- Liquid Crystal Substances (AREA)
- Casings For Electric Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BRPI0100051A BRPI0100051B1 (pt) | 2001-01-11 | 2001-01-11 | gabinete de dispositivo eletrônico |
PCT/BR2002/000005 WO2002056659A1 (fr) | 2001-01-11 | 2002-01-11 | Dispositif electronique |
Publications (2)
Publication Number | Publication Date |
---|---|
SK8522003A3 SK8522003A3 (en) | 2003-12-02 |
SK287825B6 true SK287825B6 (sk) | 2011-11-04 |
Family
ID=36776505
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SK852-2003A SK287825B6 (sk) | 2001-01-11 | 2002-01-11 | An electronic device |
Country Status (11)
Country | Link |
---|---|
US (2) | US20040075986A1 (fr) |
EP (1) | EP1360884B1 (fr) |
JP (2) | JP4410466B2 (fr) |
CN (1) | CN100459837C (fr) |
AT (1) | ATE313242T1 (fr) |
BR (1) | BRPI0100051B1 (fr) |
DE (1) | DE60207989T2 (fr) |
ES (1) | ES2256471T3 (fr) |
MX (1) | MXPA03006187A (fr) |
SK (1) | SK287825B6 (fr) |
WO (1) | WO2002056659A1 (fr) |
Families Citing this family (49)
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US6731503B2 (en) * | 2001-08-10 | 2004-05-04 | Black & Decker Inc. | Electrically isolated module |
DE10235047A1 (de) * | 2002-07-31 | 2004-02-12 | Endress + Hauser Gmbh + Co. Kg | Elektronikgehäuse mit integriertem Wärmeverteiler |
DE10315299A1 (de) * | 2003-04-04 | 2004-10-14 | Hella Kg Hueck & Co. | Gehäuse |
DE10352705A1 (de) * | 2003-11-12 | 2005-06-23 | Diehl Bgt Defence Gmbh & Co. Kg | Schaltungsanordnung |
KR100677620B1 (ko) * | 2005-11-22 | 2007-02-02 | 삼성전자주식회사 | 전자기기의 냉각 방법 및 냉각 효율이 향상된 전자기기 |
WO2008050541A1 (fr) * | 2006-10-27 | 2008-05-02 | Murata Manufacturing Co., Ltd. | Dispositif d'antenne |
JP4333756B2 (ja) * | 2007-03-13 | 2009-09-16 | セイコーエプソン株式会社 | 放熱部材、電気光学装置及び電子機器 |
DE102007043886A1 (de) * | 2007-09-14 | 2009-04-09 | Continental Automotive Gmbh | Elektrisches Gerät für den Einsatz in stark schwingenden Umgebungen und Dämpfungsglied |
US20090103267A1 (en) * | 2007-10-17 | 2009-04-23 | Andrew Dean Wieland | Electronic assembly and method for making the electronic assembly |
US20090269367A1 (en) * | 2008-04-23 | 2009-10-29 | Samuel Bogoch | Methods and compounds for mitigating pathogenic outbreaks using replikin count cycles |
CN101415316B (zh) * | 2008-08-21 | 2011-04-20 | 华为终端有限公司 | 一种电子设备及其制造方法 |
US8477499B2 (en) | 2009-06-05 | 2013-07-02 | Laird Technologies, Inc. | Assemblies and methods for dissipating heat from handheld electronic devices |
CN101573022B (zh) * | 2009-06-17 | 2011-08-31 | 杭州华三通信技术有限公司 | 密闭盒体中的散热结构装置及其加工方法 |
JP5071447B2 (ja) * | 2009-07-14 | 2012-11-14 | 株式会社デンソー | 電子制御装置 |
DE102009029260A1 (de) * | 2009-09-08 | 2011-03-10 | Robert Bosch Gmbh | Elektronikeinheit und Verfahren zum Herstellen derselben |
US8264854B2 (en) | 2009-11-12 | 2012-09-11 | Roche Diagnostics Operations, Inc. | Consumer electronic device with elastomeric mat |
US8358506B2 (en) * | 2010-08-27 | 2013-01-22 | Direct Grid Technologies, LLC | Mechanical arrangement for use within galvanically-isolated, low-profile micro-inverters for solar power installations |
US9317079B2 (en) * | 2011-03-29 | 2016-04-19 | Echostar Uk Holdings Limited | Media content device with customized panel |
JP5353992B2 (ja) * | 2011-10-31 | 2013-11-27 | 株式会社豊田自動織機 | 電動コンプレッサ |
US8587945B1 (en) * | 2012-07-27 | 2013-11-19 | Outlast Technologies Llc | Systems structures and materials for electronic device cooling |
US9414530B1 (en) | 2012-12-18 | 2016-08-09 | Amazon Technologies, Inc. | Altering thermal conductivity in devices |
JP6278695B2 (ja) * | 2013-12-26 | 2018-02-14 | 株式会社デンソー | 電子制御ユニット、および、これを用いた電動パワーステアリング装置 |
WO2015105849A1 (fr) * | 2014-01-08 | 2015-07-16 | Enphase Energy, Inc. | Dissipateur thermique double et isolé |
JP6198068B2 (ja) | 2014-11-19 | 2017-09-20 | 株式会社デンソー | 電子装置 |
JP6201966B2 (ja) | 2014-11-25 | 2017-09-27 | 株式会社デンソー | 電子装置 |
BR202014032719Y1 (pt) * | 2014-12-26 | 2020-04-07 | Embraco Ind De Compressores E Solucoes Em Refrigeracao Ltda | gabinete de dispositivo eletrônico |
EP3252810B1 (fr) * | 2015-01-29 | 2020-01-08 | Kyocera Corporation | Carte de circuit imprimé et dispositif électronique |
JP6693706B2 (ja) * | 2015-04-06 | 2020-05-13 | 株式会社デンソー | 電子制御装置 |
JP2016219599A (ja) * | 2015-05-20 | 2016-12-22 | 株式会社リコー | 電子機器および熱拡散体 |
US10120423B1 (en) * | 2015-09-09 | 2018-11-06 | Amazon Technologies, Inc. | Unibody thermal enclosure |
JP6528620B2 (ja) * | 2015-09-15 | 2019-06-12 | 株式会社オートネットワーク技術研究所 | 回路構成体および電気接続箱 |
US10356948B2 (en) * | 2015-12-31 | 2019-07-16 | DISH Technologies L.L.C. | Self-adjustable heat spreader system for set-top box assemblies |
JP2017188597A (ja) * | 2016-04-07 | 2017-10-12 | アズビル株式会社 | 基板ユニットおよび基板ユニットの製造方法 |
CN106211553B (zh) * | 2016-07-28 | 2019-04-19 | Oppo广东移动通信有限公司 | Pcb板组件及具有其的移动终端 |
CN206472427U (zh) | 2016-09-28 | 2017-09-05 | 华为技术有限公司 | 电子设备散热结构及电子设备 |
EP3799810B1 (fr) * | 2016-11-16 | 2024-01-24 | Integra LifeSciences Enterprises, LLLP | Pièce à main chirurgicale à ultrasons |
CN106877629A (zh) * | 2017-02-17 | 2017-06-20 | 华为技术有限公司 | 一种插脚散热的电源适配器 |
CN107172840B (zh) * | 2017-06-08 | 2022-11-15 | 歌尔科技有限公司 | 一种云台Camera惯性测量单元隔热固定结构 |
JP6622785B2 (ja) * | 2017-12-19 | 2019-12-18 | ファナック株式会社 | 電子部品ユニット |
US10849217B2 (en) * | 2018-07-02 | 2020-11-24 | Aptiv Technologies Limited | Electrical-circuit assembly with heat-sink |
US11121058B2 (en) | 2019-07-24 | 2021-09-14 | Aptiv Technologies Limited | Liquid cooled module with device heat spreader |
WO2021045787A1 (fr) * | 2019-09-06 | 2021-03-11 | Hewlett-Packard Development Company, L.P. | Cartes de circuit imprimé pour dispositifs électroniques |
DE102019215696A1 (de) * | 2019-10-11 | 2021-04-15 | Continental Teves Ag & Co. Ohg | Elektronikeinheit mit verbesserter Kühlung |
JP7349030B2 (ja) * | 2020-02-07 | 2023-09-21 | ケーエムダブリュ・インコーポレーテッド | 電装素子の放熱装置 |
KR102505905B1 (ko) * | 2020-02-07 | 2023-03-06 | 주식회사 케이엠더블유 | 전장소자의 방열장치 |
US11382205B2 (en) | 2020-09-16 | 2022-07-05 | Aptiv Technologies Limited | Heatsink shield with thermal-contact dimples for thermal-energy distribution in a radar assembly |
JP7521353B2 (ja) * | 2020-09-25 | 2024-07-24 | 富士通オプティカルコンポーネンツ株式会社 | 光通信モジュール |
EP4319495A4 (fr) * | 2021-05-31 | 2024-05-08 | Huawei Digital Power Technologies Co., Ltd. | Système d'adaptateur d'alimentation et de dispositif électronique |
CN114071919B (zh) * | 2021-11-16 | 2023-08-18 | 中国电子科技集团公司第二十九研究所 | 一种高密度集成的大功率电子模块 |
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US4445274A (en) * | 1977-12-23 | 1984-05-01 | Ngk Insulators, Ltd. | Method of manufacturing a ceramic structural body |
US4612978A (en) * | 1983-07-14 | 1986-09-23 | Cutchaw John M | Apparatus for cooling high-density integrated circuit packages |
US5060114A (en) * | 1990-06-06 | 1991-10-22 | Zenith Electronics Corporation | Conformable pad with thermally conductive additive for heat dissipation |
US5245508A (en) * | 1990-08-21 | 1993-09-14 | International Business Machines Corporation | Close card cooling method |
FR2669178B1 (fr) * | 1990-11-09 | 1996-07-26 | Merlin Gerin | Coffre et carte electronique a drain thermique et procede de fabrication d'une telle carte. |
US5206792A (en) * | 1991-11-04 | 1993-04-27 | International Business Machines Corporation | Attachment for contacting a heat sink with an integrated circuit chip and use thereof |
US5319244A (en) * | 1991-12-13 | 1994-06-07 | International Business Machines Corporation | Triazine thin film adhesives |
US5311402A (en) * | 1992-02-14 | 1994-05-10 | Nec Corporation | Semiconductor device package having locating mechanism for properly positioning semiconductor device within package |
DE9203252U1 (de) * | 1992-03-11 | 1992-05-07 | TELEFUNKEN SYSTEMTECHNIK GMBH, 7900 Ulm | Anordnung zur Kühlung |
US5323292A (en) * | 1992-10-06 | 1994-06-21 | Hewlett-Packard Company | Integrated multi-chip module having a conformal chip/heat exchanger interface |
US5321582A (en) * | 1993-04-26 | 1994-06-14 | Cummins Engine Company, Inc. | Electronic component heat sink attachment using a low force spring |
US5777847A (en) * | 1995-09-27 | 1998-07-07 | Nec Corporation | Multichip module having a cover wtih support pillar |
US6054198A (en) * | 1996-04-29 | 2000-04-25 | Parker-Hannifin Corporation | Conformal thermal interface material for electronic components |
DE19624475A1 (de) * | 1996-06-19 | 1998-01-02 | Kontron Elektronik | Vorrichtung zum Temperieren elektronischer Bauteile |
CN2404300Y (zh) * | 1998-07-01 | 2000-11-01 | 深圳市华为电器股份有限公司 | 带有功率元件和散热器的电源装置 |
US6195267B1 (en) * | 1999-06-23 | 2001-02-27 | Ericsson Inc. | Gel structure for combined EMI shielding and thermal control of microelectronic assemblies |
US6487073B2 (en) * | 1999-12-01 | 2002-11-26 | Cool Options, Inc. | Thermally conductive electronic device case |
-
2001
- 2001-01-11 BR BRPI0100051A patent/BRPI0100051B1/pt not_active IP Right Cessation
-
2002
- 2002-01-11 DE DE60207989T patent/DE60207989T2/de not_active Expired - Lifetime
- 2002-01-11 AT AT02729402T patent/ATE313242T1/de active
- 2002-01-11 WO PCT/BR2002/000005 patent/WO2002056659A1/fr active IP Right Grant
- 2002-01-11 EP EP02729402A patent/EP1360884B1/fr not_active Expired - Lifetime
- 2002-01-11 ES ES02729402T patent/ES2256471T3/es not_active Expired - Lifetime
- 2002-01-11 SK SK852-2003A patent/SK287825B6/sk not_active IP Right Cessation
- 2002-01-11 MX MXPA03006187A patent/MXPA03006187A/es active IP Right Grant
- 2002-01-11 CN CNB028035771A patent/CN100459837C/zh not_active Expired - Fee Related
- 2002-01-11 JP JP2002557180A patent/JP4410466B2/ja not_active Expired - Fee Related
- 2002-01-11 US US10/250,989 patent/US20040075986A1/en not_active Abandoned
-
2006
- 2006-08-14 US US11/464,434 patent/US7576988B2/en not_active Expired - Fee Related
-
2008
- 2008-01-07 JP JP2008000639A patent/JP2008135771A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
SK8522003A3 (en) | 2003-12-02 |
EP1360884B1 (fr) | 2005-12-14 |
BRPI0100051B1 (pt) | 2016-11-29 |
DE60207989D1 (de) | 2006-01-19 |
EP1360884A1 (fr) | 2003-11-12 |
CN1484936A (zh) | 2004-03-24 |
BR0100051A (pt) | 2002-09-24 |
JP4410466B2 (ja) | 2010-02-03 |
JP2004517503A (ja) | 2004-06-10 |
US7576988B2 (en) | 2009-08-18 |
US20070127217A1 (en) | 2007-06-07 |
JP2008135771A (ja) | 2008-06-12 |
DE60207989T2 (de) | 2006-08-24 |
MXPA03006187A (es) | 2004-11-12 |
ES2256471T3 (es) | 2006-07-16 |
WO2002056659A1 (fr) | 2002-07-18 |
CN100459837C (zh) | 2009-02-04 |
ATE313242T1 (de) | 2005-12-15 |
US20040075986A1 (en) | 2004-04-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC4A | Assignment and transfer of rights |
Owner name: MULTIBRAS S.A. ELETRODOMESTICOS, SAO PAULO, SP, BR Free format text: FORMER OWNER: EMPRESA BRASILEIRA DE COMPRESSORES S.A. - EMBRACO, JOINVILLE, SC, BR Effective date: 20190506 Owner name: EMBRACO INDUSTRIA DE COMPRESSORES E SOLUCOES E, BR Free format text: FORMER OWNER: WHIRLPOOL S.A., SAO PAULO, SP, BR Effective date: 20190506 |
|
TC4A | Change of owner's name |
Owner name: WHIRLPOOL S.A., SAO PAULO, SP, BR Effective date: 20190506 |
|
MM4A | Patent lapsed due to non-payment of maintenance fees |
Effective date: 20200111 |