EP1360884A1 - Dispositif electronique - Google Patents

Dispositif electronique

Info

Publication number
EP1360884A1
EP1360884A1 EP02729402A EP02729402A EP1360884A1 EP 1360884 A1 EP1360884 A1 EP 1360884A1 EP 02729402 A EP02729402 A EP 02729402A EP 02729402 A EP02729402 A EP 02729402A EP 1360884 A1 EP1360884 A1 EP 1360884A1
Authority
EP
European Patent Office
Prior art keywords
heat
envelope
components
printed
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP02729402A
Other languages
German (de)
English (en)
Other versions
EP1360884B1 (fr
Inventor
Marcos Guilherme Schwarz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Empresa Brasileira de Compressores SA
Original Assignee
Empresa Brasileira de Compressores SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Empresa Brasileira de Compressores SA filed Critical Empresa Brasileira de Compressores SA
Publication of EP1360884A1 publication Critical patent/EP1360884A1/fr
Application granted granted Critical
Publication of EP1360884B1 publication Critical patent/EP1360884B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Glass Compositions (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Liquid Crystal Substances (AREA)
  • Casings For Electric Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
EP02729402A 2001-01-11 2002-01-11 Dispositif electronique Expired - Lifetime EP1360884B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
BR0100051 2001-01-11
BRPI0100051A BRPI0100051B1 (pt) 2001-01-11 2001-01-11 gabinete de dispositivo eletrônico
PCT/BR2002/000005 WO2002056659A1 (fr) 2001-01-11 2002-01-11 Dispositif electronique

Publications (2)

Publication Number Publication Date
EP1360884A1 true EP1360884A1 (fr) 2003-11-12
EP1360884B1 EP1360884B1 (fr) 2005-12-14

Family

ID=36776505

Family Applications (1)

Application Number Title Priority Date Filing Date
EP02729402A Expired - Lifetime EP1360884B1 (fr) 2001-01-11 2002-01-11 Dispositif electronique

Country Status (11)

Country Link
US (2) US20040075986A1 (fr)
EP (1) EP1360884B1 (fr)
JP (2) JP4410466B2 (fr)
CN (1) CN100459837C (fr)
AT (1) ATE313242T1 (fr)
BR (1) BRPI0100051B1 (fr)
DE (1) DE60207989T2 (fr)
ES (1) ES2256471T3 (fr)
MX (1) MXPA03006187A (fr)
SK (1) SK287825B6 (fr)
WO (1) WO2002056659A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2747532B1 (fr) * 2005-11-22 2016-12-21 Samsung Electronics Co., Ltd. Procede de refroidissement de dispositif electronique et dispositif electronique a efficacite de refroidissement amelioree

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DE10352705A1 (de) * 2003-11-12 2005-06-23 Diehl Bgt Defence Gmbh & Co. Kg Schaltungsanordnung
WO2008050541A1 (fr) * 2006-10-27 2008-05-02 Murata Manufacturing Co., Ltd. Dispositif d'antenne
JP4333756B2 (ja) * 2007-03-13 2009-09-16 セイコーエプソン株式会社 放熱部材、電気光学装置及び電子機器
DE102007043886A1 (de) * 2007-09-14 2009-04-09 Continental Automotive Gmbh Elektrisches Gerät für den Einsatz in stark schwingenden Umgebungen und Dämpfungsglied
US20090103267A1 (en) * 2007-10-17 2009-04-23 Andrew Dean Wieland Electronic assembly and method for making the electronic assembly
US20090269367A1 (en) * 2008-04-23 2009-10-29 Samuel Bogoch Methods and compounds for mitigating pathogenic outbreaks using replikin count cycles
CN101415316B (zh) * 2008-08-21 2011-04-20 华为终端有限公司 一种电子设备及其制造方法
US8477499B2 (en) 2009-06-05 2013-07-02 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
CN101573022B (zh) * 2009-06-17 2011-08-31 杭州华三通信技术有限公司 密闭盒体中的散热结构装置及其加工方法
JP5071447B2 (ja) * 2009-07-14 2012-11-14 株式会社デンソー 電子制御装置
DE102009029260A1 (de) * 2009-09-08 2011-03-10 Robert Bosch Gmbh Elektronikeinheit und Verfahren zum Herstellen derselben
US8264854B2 (en) 2009-11-12 2012-09-11 Roche Diagnostics Operations, Inc. Consumer electronic device with elastomeric mat
US8358506B2 (en) * 2010-08-27 2013-01-22 Direct Grid Technologies, LLC Mechanical arrangement for use within galvanically-isolated, low-profile micro-inverters for solar power installations
US9317079B2 (en) * 2011-03-29 2016-04-19 Echostar Uk Holdings Limited Media content device with customized panel
JP5353992B2 (ja) * 2011-10-31 2013-11-27 株式会社豊田自動織機 電動コンプレッサ
US8587945B1 (en) * 2012-07-27 2013-11-19 Outlast Technologies Llc Systems structures and materials for electronic device cooling
US9414530B1 (en) 2012-12-18 2016-08-09 Amazon Technologies, Inc. Altering thermal conductivity in devices
JP6278695B2 (ja) * 2013-12-26 2018-02-14 株式会社デンソー 電子制御ユニット、および、これを用いた電動パワーステアリング装置
WO2015105849A1 (fr) * 2014-01-08 2015-07-16 Enphase Energy, Inc. Dissipateur thermique double et isolé
JP6198068B2 (ja) 2014-11-19 2017-09-20 株式会社デンソー 電子装置
JP6201966B2 (ja) 2014-11-25 2017-09-27 株式会社デンソー 電子装置
BR202014032719Y1 (pt) * 2014-12-26 2020-04-07 Embraco Ind De Compressores E Solucoes Em Refrigeracao Ltda gabinete de dispositivo eletrônico
EP3252810B1 (fr) * 2015-01-29 2020-01-08 Kyocera Corporation Carte de circuit imprimé et dispositif électronique
JP6693706B2 (ja) * 2015-04-06 2020-05-13 株式会社デンソー 電子制御装置
JP2016219599A (ja) * 2015-05-20 2016-12-22 株式会社リコー 電子機器および熱拡散体
US10120423B1 (en) * 2015-09-09 2018-11-06 Amazon Technologies, Inc. Unibody thermal enclosure
JP6528620B2 (ja) * 2015-09-15 2019-06-12 株式会社オートネットワーク技術研究所 回路構成体および電気接続箱
US10356948B2 (en) * 2015-12-31 2019-07-16 DISH Technologies L.L.C. Self-adjustable heat spreader system for set-top box assemblies
JP2017188597A (ja) * 2016-04-07 2017-10-12 アズビル株式会社 基板ユニットおよび基板ユニットの製造方法
CN106211553B (zh) * 2016-07-28 2019-04-19 Oppo广东移动通信有限公司 Pcb板组件及具有其的移动终端
CN206472427U (zh) 2016-09-28 2017-09-05 华为技术有限公司 电子设备散热结构及电子设备
EP3799810B1 (fr) * 2016-11-16 2024-01-24 Integra LifeSciences Enterprises, LLLP Pièce à main chirurgicale à ultrasons
CN106877629A (zh) * 2017-02-17 2017-06-20 华为技术有限公司 一种插脚散热的电源适配器
CN107172840B (zh) * 2017-06-08 2022-11-15 歌尔科技有限公司 一种云台Camera惯性测量单元隔热固定结构
JP6622785B2 (ja) * 2017-12-19 2019-12-18 ファナック株式会社 電子部品ユニット
US10849217B2 (en) * 2018-07-02 2020-11-24 Aptiv Technologies Limited Electrical-circuit assembly with heat-sink
US11121058B2 (en) 2019-07-24 2021-09-14 Aptiv Technologies Limited Liquid cooled module with device heat spreader
WO2021045787A1 (fr) * 2019-09-06 2021-03-11 Hewlett-Packard Development Company, L.P. Cartes de circuit imprimé pour dispositifs électroniques
DE102019215696A1 (de) * 2019-10-11 2021-04-15 Continental Teves Ag & Co. Ohg Elektronikeinheit mit verbesserter Kühlung
JP7349030B2 (ja) * 2020-02-07 2023-09-21 ケーエムダブリュ・インコーポレーテッド 電装素子の放熱装置
KR102505905B1 (ko) * 2020-02-07 2023-03-06 주식회사 케이엠더블유 전장소자의 방열장치
US11382205B2 (en) 2020-09-16 2022-07-05 Aptiv Technologies Limited Heatsink shield with thermal-contact dimples for thermal-energy distribution in a radar assembly
JP7521353B2 (ja) * 2020-09-25 2024-07-24 富士通オプティカルコンポーネンツ株式会社 光通信モジュール
EP4319495A4 (fr) * 2021-05-31 2024-05-08 Huawei Digital Power Technologies Co., Ltd. Système d'adaptateur d'alimentation et de dispositif électronique
CN114071919B (zh) * 2021-11-16 2023-08-18 中国电子科技集团公司第二十九研究所 一种高密度集成的大功率电子模块

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See references of WO02056659A1 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2747532B1 (fr) * 2005-11-22 2016-12-21 Samsung Electronics Co., Ltd. Procede de refroidissement de dispositif electronique et dispositif electronique a efficacite de refroidissement amelioree

Also Published As

Publication number Publication date
SK8522003A3 (en) 2003-12-02
EP1360884B1 (fr) 2005-12-14
BRPI0100051B1 (pt) 2016-11-29
DE60207989D1 (de) 2006-01-19
CN1484936A (zh) 2004-03-24
BR0100051A (pt) 2002-09-24
JP4410466B2 (ja) 2010-02-03
JP2004517503A (ja) 2004-06-10
US7576988B2 (en) 2009-08-18
US20070127217A1 (en) 2007-06-07
JP2008135771A (ja) 2008-06-12
DE60207989T2 (de) 2006-08-24
MXPA03006187A (es) 2004-11-12
ES2256471T3 (es) 2006-07-16
WO2002056659A1 (fr) 2002-07-18
SK287825B6 (sk) 2011-11-04
CN100459837C (zh) 2009-02-04
ATE313242T1 (de) 2005-12-15
US20040075986A1 (en) 2004-04-22

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