BR0100051A - Dispositivo eletrônico - Google Patents

Dispositivo eletrônico

Info

Publication number
BR0100051A
BR0100051A BR0100051-9A BR0100051A BR0100051A BR 0100051 A BR0100051 A BR 0100051A BR 0100051 A BR0100051 A BR 0100051A BR 0100051 A BR0100051 A BR 0100051A
Authority
BR
Brazil
Prior art keywords
printed
electronic device
circuit board
chamber
dissipation
Prior art date
Application number
BR0100051-9A
Other languages
English (en)
Other versions
BRPI0100051B1 (pt
Inventor
Marcos Schwarz
Original Assignee
Brasil Compressores Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brasil Compressores Sa filed Critical Brasil Compressores Sa
Priority to BRPI0100051A priority Critical patent/BRPI0100051B1/pt
Priority to PCT/BR2002/000005 priority patent/WO2002056659A1/en
Priority to SK852-2003A priority patent/SK287825B6/sk
Priority to CNB028035771A priority patent/CN100459837C/zh
Priority to JP2002557180A priority patent/JP4410466B2/ja
Priority to MXPA03006187A priority patent/MXPA03006187A/es
Priority to US10/250,989 priority patent/US20040075986A1/en
Priority to DE60207989T priority patent/DE60207989T2/de
Priority to AT02729402T priority patent/ATE313242T1/de
Priority to EP02729402A priority patent/EP1360884B1/en
Priority to ES02729402T priority patent/ES2256471T3/es
Publication of BR0100051A publication Critical patent/BR0100051A/pt
Priority to US11/464,434 priority patent/US7576988B2/en
Priority to JP2008000639A priority patent/JP2008135771A/ja
Publication of BRPI0100051B1 publication Critical patent/BRPI0100051B1/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Casings For Electric Apparatus (AREA)
  • Liquid Crystal Substances (AREA)
  • Glass Compositions (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

"DISPOSITIVO ELETRôNICO". Descreve-se um dispositivo eletrônico (1) que compreende um invólucro (2) compreendendo uma câmara (4) fechada e uma placa de circuito impresso (3), a placa de circuito impresso (3) sendo posicionada na câmara (4) definindo uma câmara de dissipação (4'), a placa de circuito impresso (3) compreendendo pelo menos um componente eletrônico (5a) posicionado na câmara de dissipação (4'), a câmara (4') compreendendo um preenchimento (7) simultaneamente em contato com o componente eletrônico (5a), a placa de circuito impresso (3) e um filme de dissipação (10).
BRPI0100051A 2001-01-11 2001-01-11 gabinete de dispositivo eletrônico BRPI0100051B1 (pt)

Priority Applications (13)

Application Number Priority Date Filing Date Title
BRPI0100051A BRPI0100051B1 (pt) 2001-01-11 2001-01-11 gabinete de dispositivo eletrônico
DE60207989T DE60207989T2 (de) 2001-01-11 2002-01-11 Elektronische einrichtung
AT02729402T ATE313242T1 (de) 2001-01-11 2002-01-11 Elektronische einrichtung
CNB028035771A CN100459837C (zh) 2001-01-11 2002-01-11 电子装置
JP2002557180A JP4410466B2 (ja) 2001-01-11 2002-01-11 電子装置
MXPA03006187A MXPA03006187A (es) 2001-01-11 2002-01-11 Dispositivo electronico.
US10/250,989 US20040075986A1 (en) 2001-01-11 2002-01-11 Electronic device
PCT/BR2002/000005 WO2002056659A1 (en) 2001-01-11 2002-01-11 An electronic device
SK852-2003A SK287825B6 (sk) 2001-01-11 2002-01-11 An electronic device
EP02729402A EP1360884B1 (en) 2001-01-11 2002-01-11 An electronic device
ES02729402T ES2256471T3 (es) 2001-01-11 2002-01-11 Dispositivo electronico.
US11/464,434 US7576988B2 (en) 2001-01-11 2006-08-14 Electronic device
JP2008000639A JP2008135771A (ja) 2001-01-11 2008-01-07 電子装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
BRPI0100051A BRPI0100051B1 (pt) 2001-01-11 2001-01-11 gabinete de dispositivo eletrônico

Publications (2)

Publication Number Publication Date
BR0100051A true BR0100051A (pt) 2002-09-24
BRPI0100051B1 BRPI0100051B1 (pt) 2016-11-29

Family

ID=36776505

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0100051A BRPI0100051B1 (pt) 2001-01-11 2001-01-11 gabinete de dispositivo eletrônico

Country Status (11)

Country Link
US (2) US20040075986A1 (pt)
EP (1) EP1360884B1 (pt)
JP (2) JP4410466B2 (pt)
CN (1) CN100459837C (pt)
AT (1) ATE313242T1 (pt)
BR (1) BRPI0100051B1 (pt)
DE (1) DE60207989T2 (pt)
ES (1) ES2256471T3 (pt)
MX (1) MXPA03006187A (pt)
SK (1) SK287825B6 (pt)
WO (1) WO2002056659A1 (pt)

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DE10352705A1 (de) * 2003-11-12 2005-06-23 Diehl Bgt Defence Gmbh & Co. Kg Schaltungsanordnung
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WO2008050541A1 (fr) * 2006-10-27 2008-05-02 Murata Manufacturing Co., Ltd. Dispositif d'antenne
JP4333756B2 (ja) * 2007-03-13 2009-09-16 セイコーエプソン株式会社 放熱部材、電気光学装置及び電子機器
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US20090103267A1 (en) * 2007-10-17 2009-04-23 Andrew Dean Wieland Electronic assembly and method for making the electronic assembly
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CN101415316B (zh) * 2008-08-21 2011-04-20 华为终端有限公司 一种电子设备及其制造方法
US8477499B2 (en) * 2009-06-05 2013-07-02 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
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US9414530B1 (en) * 2012-12-18 2016-08-09 Amazon Technologies, Inc. Altering thermal conductivity in devices
JP6278695B2 (ja) * 2013-12-26 2018-02-14 株式会社デンソー 電子制御ユニット、および、これを用いた電動パワーステアリング装置
CN105814978B (zh) 2014-01-08 2018-06-22 恩菲斯能源公司 双重绝缘散热器
JP6198068B2 (ja) 2014-11-19 2017-09-20 株式会社デンソー 電子装置
JP6201966B2 (ja) 2014-11-25 2017-09-27 株式会社デンソー 電子装置
BR202014032719Y1 (pt) * 2014-12-26 2020-04-07 Embraco Ind De Compressores E Solucoes Em Refrigeracao Ltda gabinete de dispositivo eletrônico
JP6462730B2 (ja) * 2015-01-29 2019-01-30 京セラ株式会社 回路基板および電子装置
JP6693706B2 (ja) * 2015-04-06 2020-05-13 株式会社デンソー 電子制御装置
JP2016219599A (ja) * 2015-05-20 2016-12-22 株式会社リコー 電子機器および熱拡散体
US10120423B1 (en) * 2015-09-09 2018-11-06 Amazon Technologies, Inc. Unibody thermal enclosure
JP6528620B2 (ja) * 2015-09-15 2019-06-12 株式会社オートネットワーク技術研究所 回路構成体および電気接続箱
US10356948B2 (en) * 2015-12-31 2019-07-16 DISH Technologies L.L.C. Self-adjustable heat spreader system for set-top box assemblies
JP2017188597A (ja) * 2016-04-07 2017-10-12 アズビル株式会社 基板ユニットおよび基板ユニットの製造方法
CN106211553B (zh) * 2016-07-28 2019-04-19 Oppo广东移动通信有限公司 Pcb板组件及具有其的移动终端
CN206472427U (zh) 2016-09-28 2017-09-05 华为技术有限公司 电子设备散热结构及电子设备
AU2017362062B2 (en) * 2016-11-16 2023-03-23 Integra Lifesciences Enterprises, Lllp Ultrasonic surgical handpiece
CN106877629A (zh) * 2017-02-17 2017-06-20 华为技术有限公司 一种插脚散热的电源适配器
CN107172840B (zh) * 2017-06-08 2022-11-15 歌尔科技有限公司 一种云台Camera惯性测量单元隔热固定结构
JP6622785B2 (ja) * 2017-12-19 2019-12-18 ファナック株式会社 電子部品ユニット
US10849217B2 (en) * 2018-07-02 2020-11-24 Aptiv Technologies Limited Electrical-circuit assembly with heat-sink
US11121058B2 (en) 2019-07-24 2021-09-14 Aptiv Technologies Limited Liquid cooled module with device heat spreader
US20220217870A1 (en) * 2019-09-06 2022-07-07 Hewlett-Packard Development Company, L.P. Circuit boards for electronic devices
DE102019215696A1 (de) * 2019-10-11 2021-04-15 Continental Teves Ag & Co. Ohg Elektronikeinheit mit verbesserter Kühlung
CN115298900A (zh) * 2020-02-07 2022-11-04 株式会社Kmw 电子元件的散热装置
WO2021158026A1 (ko) * 2020-02-07 2021-08-12 주식회사 케이엠더블유 전장소자의 방열장치
US11382205B2 (en) 2020-09-16 2022-07-05 Aptiv Technologies Limited Heatsink shield with thermal-contact dimples for thermal-energy distribution in a radar assembly
JP7521353B2 (ja) * 2020-09-25 2024-07-24 富士通オプティカルコンポーネンツ株式会社 光通信モジュール
WO2022252019A1 (zh) * 2021-05-31 2022-12-08 华为数字能源技术有限公司 一种电源适配器以及电子设备系统
CN114071919B (zh) * 2021-11-16 2023-08-18 中国电子科技集团公司第二十九研究所 一种高密度集成的大功率电子模块

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Also Published As

Publication number Publication date
DE60207989T2 (de) 2006-08-24
BRPI0100051B1 (pt) 2016-11-29
CN1484936A (zh) 2004-03-24
CN100459837C (zh) 2009-02-04
SK8522003A3 (en) 2003-12-02
JP2008135771A (ja) 2008-06-12
MXPA03006187A (es) 2004-11-12
DE60207989D1 (de) 2006-01-19
US7576988B2 (en) 2009-08-18
JP2004517503A (ja) 2004-06-10
EP1360884B1 (en) 2005-12-14
ES2256471T3 (es) 2006-07-16
EP1360884A1 (en) 2003-11-12
WO2002056659A1 (en) 2002-07-18
SK287825B6 (sk) 2011-11-04
US20040075986A1 (en) 2004-04-22
JP4410466B2 (ja) 2010-02-03
ATE313242T1 (de) 2005-12-15
US20070127217A1 (en) 2007-06-07

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Legal Events

Date Code Title Description
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B09B Patent application refused [chapter 9.2 patent gazette]

Free format text: INDEFIRO O PEDIDO DE ACORDO COM O 8O COMBINADO COM O ART. 13 DA LPI

B12B Appeal against refusal [chapter 12.2 patent gazette]
B25A Requested transfer of rights approved

Owner name: MULTIBRAS S.A. ELETRODOMESTICOS (BR/SP)

B25D Requested change of name of applicant approved

Owner name: WHIRLPOOL S.A. (BR/SP)

B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 29/11/2016, OBSERVADAS AS CONDICOES LEGAIS.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time
B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)