SK16922000A3 - Spôsob pokovovania substrátov - Google Patents
Spôsob pokovovania substrátov Download PDFInfo
- Publication number
- SK16922000A3 SK16922000A3 SK1692-2000A SK16922000A SK16922000A3 SK 16922000 A3 SK16922000 A3 SK 16922000A3 SK 16922000 A SK16922000 A SK 16922000A SK 16922000 A3 SK16922000 A3 SK 16922000A3
- Authority
- SK
- Slovakia
- Prior art keywords
- conductive polymer
- substrates
- electrically conductive
- polymer
- solution
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 43
- 239000000758 substrate Substances 0.000 title claims abstract description 28
- 229910052751 metal Inorganic materials 0.000 title abstract description 19
- 239000002184 metal Substances 0.000 title abstract description 19
- 239000011248 coating agent Substances 0.000 title abstract description 3
- 238000000576 coating method Methods 0.000 title abstract description 3
- 239000000243 solution Substances 0.000 claims abstract description 38
- 229920000642 polymer Polymers 0.000 claims abstract description 31
- 229920001940 conductive polymer Polymers 0.000 claims abstract description 27
- 238000001465 metallisation Methods 0.000 claims abstract description 13
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 7
- 238000004519 manufacturing process Methods 0.000 claims abstract description 5
- 239000012266 salt solution Substances 0.000 claims abstract description 4
- 238000007747 plating Methods 0.000 claims description 11
- 230000008961 swelling Effects 0.000 claims description 8
- 239000002904 solvent Substances 0.000 claims description 6
- 150000001879 copper Chemical class 0.000 claims description 4
- 230000001680 brushing effect Effects 0.000 claims description 3
- 239000003638 chemical reducing agent Substances 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 2
- 239000003960 organic solvent Substances 0.000 claims description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 abstract description 23
- 229910052763 palladium Inorganic materials 0.000 abstract description 10
- 229910052718 tin Inorganic materials 0.000 abstract description 7
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical class [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 abstract description 2
- GKWLILHTTGWKLQ-UHFFFAOYSA-N 2,3-dihydrothieno[3,4-b][1,4]dioxine Chemical compound O1CCOC2=CSC=C21 GKWLILHTTGWKLQ-UHFFFAOYSA-N 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 21
- HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Inorganic materials [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 20
- 239000010949 copper Substances 0.000 description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 15
- 229910052802 copper Inorganic materials 0.000 description 15
- 239000007864 aqueous solution Substances 0.000 description 14
- 238000001035 drying Methods 0.000 description 10
- 229920000307 polymer substrate Polymers 0.000 description 8
- 239000002253 acid Substances 0.000 description 7
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 239000000178 monomer Substances 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 6
- 238000007254 oxidation reaction Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000003792 electrolyte Substances 0.000 description 5
- 238000009713 electroplating Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 230000001590 oxidative effect Effects 0.000 description 4
- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 229940005642 polystyrene sulfonic acid Drugs 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 239000008262 pumice Substances 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 239000003381 stabilizer Substances 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N Furan Chemical compound C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 2
- 239000003929 acidic solution Substances 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 239000003995 emulsifying agent Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000029142 excretion Effects 0.000 description 2
- 235000012054 meals Nutrition 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 239000007800 oxidant agent Substances 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- 229920000137 polyphosphoric acid Polymers 0.000 description 2
- 239000012286 potassium permanganate Substances 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 150000003460 sulfonic acids Chemical class 0.000 description 2
- 238000005496 tempering Methods 0.000 description 2
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 1
- QSQFARNGNIZGAW-UHFFFAOYSA-N 2-methylsulfonyloxyethyl methanesulfonate Chemical compound CS(=O)(=O)OCCOS(C)(=O)=O QSQFARNGNIZGAW-UHFFFAOYSA-N 0.000 description 1
- UBDHSURDYAETAL-UHFFFAOYSA-N 8-aminonaphthalene-1,3,6-trisulfonic acid Chemical compound OS(=O)(=O)C1=CC(S(O)(=O)=O)=C2C(N)=CC(S(O)(=O)=O)=CC2=C1 UBDHSURDYAETAL-UHFFFAOYSA-N 0.000 description 1
- 239000004604 Blowing Agent Substances 0.000 description 1
- 101100072264 Caenorhabditis elegans ife-2 gene Proteins 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- RSPISYXLHRIGJD-UHFFFAOYSA-N OOOO Chemical compound OOOO RSPISYXLHRIGJD-UHFFFAOYSA-N 0.000 description 1
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000003637 basic solution Substances 0.000 description 1
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000009996 mechanical pre-treatment Methods 0.000 description 1
- 239000003002 pH adjusting agent Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000151 polyglycol Polymers 0.000 description 1
- 239000010695 polyglycol Substances 0.000 description 1
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 238000011946 reduction process Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000001119 stannous chloride Substances 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- -1 suitable are Chemical class 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229930192474 thiophene Natural products 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2013—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by mechanical pretreatment, e.g. grinding, sanding
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/26—Roughening, e.g. by etching using organic liquids
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Inorganic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Laminated Bodies (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Chemical Treatment Of Metals (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19822075A DE19822075C2 (de) | 1998-05-16 | 1998-05-16 | Verfahren zur metallischen Beschichtung von Substraten |
| PCT/EP1999/003322 WO1999060189A2 (de) | 1998-05-16 | 1999-05-14 | Verfahren zur metallischen beschichtung von substraten |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SK16922000A3 true SK16922000A3 (sk) | 2001-07-10 |
Family
ID=7868037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SK1692-2000A SK16922000A3 (sk) | 1998-05-16 | 1999-05-14 | Spôsob pokovovania substrátov |
Country Status (22)
| Country | Link |
|---|---|
| US (1) | US6589593B1 (xx) |
| EP (1) | EP1088121B1 (xx) |
| JP (1) | JP4044286B2 (xx) |
| KR (1) | KR100541893B1 (xx) |
| CN (1) | CN1299548C (xx) |
| AT (1) | ATE213510T1 (xx) |
| AU (1) | AU4261899A (xx) |
| CA (1) | CA2331757A1 (xx) |
| DE (2) | DE19822075C2 (xx) |
| HK (1) | HK1035385A1 (xx) |
| HU (1) | HUP0102325A3 (xx) |
| IL (1) | IL139422A (xx) |
| IS (1) | IS5704A (xx) |
| NO (1) | NO20005778L (xx) |
| PL (1) | PL345093A1 (xx) |
| RO (1) | RO119837B1 (xx) |
| RU (1) | RU2214075C2 (xx) |
| SK (1) | SK16922000A3 (xx) |
| TR (1) | TR200003369T2 (xx) |
| WO (1) | WO1999060189A2 (xx) |
| YU (1) | YU71000A (xx) |
| ZA (1) | ZA200006623B (xx) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10007435A1 (de) * | 2000-02-18 | 2001-08-23 | Enthone Omi Deutschland Gmbh | Verfahren zum Galvanisieren eines mit einem elektrisch leitenden Polymer beschichteten Werkstücks |
| EP1191127B1 (de) * | 2000-09-26 | 2004-10-13 | Enthone-OMI (Deutschland) GmbH | Verfahren zur selektiven Metallisierung dielektrischer Materialien |
| WO2002031214A1 (de) | 2000-10-09 | 2002-04-18 | Hueck Folien | Metallisierte folie und verfahren zu deren herstellung sowie deren anwendung |
| KR20020079075A (ko) * | 2001-04-13 | 2002-10-19 | 이진규 | 폴리메틸실세스퀴옥산 공중합체와 이를 이용한 저유전성절연막 및 그 제조방법 |
| US20060009029A1 (en) * | 2004-07-06 | 2006-01-12 | Agency For Science, Technology And Research | Wafer level through-hole plugging using mechanical forming technique |
| DE102004042111A1 (de) * | 2004-08-30 | 2006-03-09 | Ovd Kinegram Ag | Mehrschichtiger Körper mit unterschiedlich mikrostrukturierten Bereichen mit elektrisch leitfähiger Beschichtung |
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| US7649439B2 (en) * | 2006-08-18 | 2010-01-19 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Flexible thin metal film thermal sensing system |
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| JP5236648B2 (ja) * | 2006-09-07 | 2013-07-17 | エンソン インコーポレイテッド | 電解めっき銅金属配線で絶縁性基板の表面を金属配線するための方法 |
| FR2934609B1 (fr) * | 2008-07-30 | 2011-07-22 | Jet Metal Technologies | Procede non eletrolytique de metallisation en ligne de substrats par projection avec traitement de surface prealable et dispositif pour la mise en oeuvre du procede. |
| JP5491022B2 (ja) * | 2008-12-10 | 2014-05-14 | 株式会社日立国際電気 | 基板処理装置、半導体装置の製造方法、基板処理装置の制御方法および基板処理装置の表示方法 |
| US8784690B2 (en) | 2010-08-20 | 2014-07-22 | Rhodia Operations | Polymer compositions, polymer films, polymer gels, polymer foams, and electronic devices containing such films, gels and foams |
| TR201802555T4 (tr) * | 2010-10-29 | 2018-03-21 | Macdermid Enthone Inc | Dielektrik substratlar üzerine iletken polimerlerin depo edilmesine yönelik bileşim ve yöntem. |
| CN104349585B (zh) * | 2013-08-01 | 2018-05-15 | 宏启胜精密电子(秦皇岛)有限公司 | 电路板及其制作方法 |
| US10920321B2 (en) | 2014-05-30 | 2021-02-16 | Uab Rekin International | Chrome-free adhesion pre-treatment for plastics |
| CN105887054B (zh) * | 2016-06-13 | 2019-01-18 | 华南理工大学 | 一种高导电生物质/纳米金属柔性复合膜及其制备方法 |
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| US4847114A (en) * | 1984-01-26 | 1989-07-11 | Learonal, Inc. | Preparation of printed circuit boards by selective metallization |
| DE3806884C1 (en) * | 1988-03-03 | 1989-09-21 | Blasberg-Oberflaechentechnik Gmbh, 5650 Solingen, De | Through-plated contact printed circuit and method for fabricating it |
| US5183692A (en) * | 1991-07-01 | 1993-02-02 | Motorola, Inc. | Polyimide coating having electroless metal plate |
| US5268088A (en) * | 1991-12-12 | 1993-12-07 | Eric F. Harnden | Simplified method for direct electroplating of acrylic or epoxy containing dielectric substrates |
| DE4202337A1 (de) * | 1992-01-29 | 1993-08-05 | Bayer Ag | Verfahren zur durchkontaktierung von zweilagigen leiterplatten und multilayern |
| US5427841A (en) * | 1993-03-09 | 1995-06-27 | U.S. Philips Corporation | Laminated structure of a metal layer on a conductive polymer layer and method of manufacturing such a structure |
| DE4326079A1 (de) * | 1993-07-30 | 1995-02-02 | Atotech Deutschland Gmbh | Verfahren zur Behandlung von Kunststoffoberflächen und Anquell-Lösung |
| DE19502988B4 (de) * | 1995-01-31 | 2004-03-18 | Blasberg Oberflächentechnik GmbH | Verfahren zur galvanischen Beschichtung von Polymeroberflächen |
| WO1999019883A1 (en) * | 1997-10-15 | 1999-04-22 | The Dow Chemical Company | Electronically-conductive polymers |
-
1998
- 1998-05-16 DE DE19822075A patent/DE19822075C2/de not_active Expired - Fee Related
-
1999
- 1999-05-14 DE DE59900882T patent/DE59900882D1/de not_active Expired - Lifetime
- 1999-05-14 RO ROA200001122A patent/RO119837B1/ro unknown
- 1999-05-14 HU HU0102325A patent/HUP0102325A3/hu unknown
- 1999-05-14 CN CNB998086835A patent/CN1299548C/zh not_active Expired - Lifetime
- 1999-05-14 IL IL13942299A patent/IL139422A/en not_active IP Right Cessation
- 1999-05-14 SK SK1692-2000A patent/SK16922000A3/sk unknown
- 1999-05-14 AU AU42618/99A patent/AU4261899A/en not_active Abandoned
- 1999-05-14 CA CA002331757A patent/CA2331757A1/en not_active Abandoned
- 1999-05-14 EP EP99952103A patent/EP1088121B1/de not_active Expired - Lifetime
- 1999-05-14 KR KR1020007012740A patent/KR100541893B1/ko not_active IP Right Cessation
- 1999-05-14 AT AT99952103T patent/ATE213510T1/de not_active IP Right Cessation
- 1999-05-14 RU RU2000131601/09A patent/RU2214075C2/ru not_active IP Right Cessation
- 1999-05-14 TR TR2000/03369T patent/TR200003369T2/xx unknown
- 1999-05-14 US US09/674,510 patent/US6589593B1/en not_active Expired - Fee Related
- 1999-05-14 WO PCT/EP1999/003322 patent/WO1999060189A2/de active IP Right Grant
- 1999-05-14 JP JP2000549789A patent/JP4044286B2/ja not_active Expired - Lifetime
- 1999-05-14 PL PL99345093A patent/PL345093A1/xx unknown
- 1999-05-14 YU YU71000A patent/YU71000A/sh unknown
-
2000
- 2000-11-02 IS IS5704A patent/IS5704A/is unknown
- 2000-11-15 NO NO20005778A patent/NO20005778L/no not_active Application Discontinuation
- 2000-11-15 ZA ZA200006623A patent/ZA200006623B/xx unknown
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2001
- 2001-08-28 HK HK01106071A patent/HK1035385A1/xx not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JP2002515657A (ja) | 2002-05-28 |
| JP4044286B2 (ja) | 2008-02-06 |
| NO20005778L (no) | 2000-11-27 |
| ATE213510T1 (de) | 2002-03-15 |
| WO1999060189A3 (de) | 2000-04-06 |
| IL139422A0 (en) | 2001-11-25 |
| HUP0102325A2 (hu) | 2001-10-28 |
| EP1088121B1 (de) | 2002-02-20 |
| KR100541893B1 (ko) | 2006-01-10 |
| DE19822075A1 (de) | 1999-11-18 |
| DE19822075C2 (de) | 2002-03-21 |
| EP1088121A2 (de) | 2001-04-04 |
| CN1299548C (zh) | 2007-02-07 |
| IS5704A (is) | 2000-11-02 |
| US6589593B1 (en) | 2003-07-08 |
| YU71000A (sh) | 2003-02-28 |
| HUP0102325A3 (en) | 2002-02-28 |
| AU4261899A (en) | 1999-12-06 |
| RU2214075C2 (ru) | 2003-10-10 |
| IL139422A (en) | 2004-01-04 |
| ZA200006623B (en) | 2001-05-30 |
| TR200003369T2 (tr) | 2001-07-23 |
| CA2331757A1 (en) | 1999-11-25 |
| DE59900882D1 (de) | 2002-03-28 |
| NO20005778D0 (no) | 2000-11-15 |
| WO1999060189A2 (de) | 1999-11-25 |
| HK1035385A1 (en) | 2001-11-23 |
| CN1309881A (zh) | 2001-08-22 |
| RO119837B1 (ro) | 2005-04-29 |
| PL345093A1 (en) | 2001-12-03 |
| KR20010025021A (ko) | 2001-03-26 |
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