SG85703A1 - Tray for semiconductor integrated circuit device - Google Patents

Tray for semiconductor integrated circuit device

Info

Publication number
SG85703A1
SG85703A1 SG200002294A SG200002294A SG85703A1 SG 85703 A1 SG85703 A1 SG 85703A1 SG 200002294 A SG200002294 A SG 200002294A SG 200002294 A SG200002294 A SG 200002294A SG 85703 A1 SG85703 A1 SG 85703A1
Authority
SG
Singapore
Prior art keywords
tray
integrated circuit
semiconductor integrated
circuit device
semiconductor
Prior art date
Application number
SG200002294A
Other languages
English (en)
Inventor
Sembonmatsu Shigeru
Ishikawa Manabu
Original Assignee
Nec Corp
Sumitomo Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=14882579&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SG85703(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Nec Corp, Sumitomo Chemical Co filed Critical Nec Corp
Publication of SG85703A1 publication Critical patent/SG85703A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG200002294A 1999-04-30 2000-04-27 Tray for semiconductor integrated circuit device SG85703A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12432699A JP3771084B2 (ja) 1999-04-30 1999-04-30 半導体集積回路装置用トレイ

Publications (1)

Publication Number Publication Date
SG85703A1 true SG85703A1 (en) 2002-01-15

Family

ID=14882579

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200002294A SG85703A1 (en) 1999-04-30 2000-04-27 Tray for semiconductor integrated circuit device

Country Status (8)

Country Link
US (1) US6357595B2 (ja)
EP (1) EP1049138A2 (ja)
JP (1) JP3771084B2 (ja)
KR (1) KR100390324B1 (ja)
CN (1) CN1133571C (ja)
MY (1) MY125134A (ja)
SG (1) SG85703A1 (ja)
TW (1) TW457619B (ja)

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000007647A (ko) * 1998-07-06 2000-02-07 윤종용 반도체 패키지 포장용 트레이
US7191512B2 (en) * 1998-09-29 2007-03-20 Applied Kinetics, Inc. Tray system for holding and positioning components
US6474475B1 (en) * 2000-02-22 2002-11-05 Micron Technology, Inc. Apparatus for handling stacked integrated circuit devices
JP2001261089A (ja) * 2000-03-16 2001-09-26 Toshiba Corp 電子部品用トレイ
JP2002019832A (ja) * 2000-07-11 2002-01-23 Oki Electric Ind Co Ltd エンボスキャリアテープ
MY130407A (en) * 2000-12-01 2007-06-29 Texchem Pack M Sdn Bhd Tray for storing semiconductor chips
SG94735A1 (en) * 2001-01-16 2003-03-18 Sumitomo Bakelite Co Container for electric device
US6662949B2 (en) * 2001-12-28 2003-12-16 Hon Hai Precision Ind. Co., Ltd. Package for mechanical or electrical components
US6914771B2 (en) * 2002-05-29 2005-07-05 Hirokazu Ono Tray for electronic components
US7108899B2 (en) * 2002-09-11 2006-09-19 Entegris, Inc. Chip tray with tacky surface
US6926937B2 (en) * 2002-09-11 2005-08-09 Entegris, Inc. Matrix tray with tacky surfaces
US7032747B2 (en) * 2002-12-02 2006-04-25 Hni Technologies Inc. Reusable packaging system
TW563947U (en) * 2002-12-13 2003-11-21 Hon Hai Prec Ind Co Ltd Hard tray for carrying electrical connectors
TW563925U (en) * 2002-12-17 2003-11-21 Hon Hai Prec Ind Co Ltd A hard tray for accommodating electrical connectors
US6868970B2 (en) * 2003-04-16 2005-03-22 Illinois Tool Works Inc. Stackable tray for integrated circuits with corner support elements and lateral support elements forming matrix tray capture system
US7874434B2 (en) * 2003-11-06 2011-01-25 Sharp Kabushiki Kaisha Substrate carrying tray
JP4429823B2 (ja) * 2004-06-28 2010-03-10 富士通株式会社 半導体装置用トレイ
WO2006018672A1 (en) * 2004-08-20 2006-02-23 Infineon Technologies Ag Packing tray
US7999383B2 (en) 2006-07-21 2011-08-16 Bae Systems Information And Electronic Systems Integration Inc. High speed, high density, low power die interconnect system
CN101168392B (zh) * 2006-10-23 2011-06-01 日立麦克赛尔株式会社 电池托盘及使用该电池托盘的电池的制造方法
JP4832568B2 (ja) * 2007-03-16 2011-12-07 富士通セミコンダクター株式会社 電子部品収納容器
JP4360431B2 (ja) * 2007-08-20 2009-11-11 セイコーエプソン株式会社 半導体チップ収容トレイ
JP5255801B2 (ja) * 2007-09-07 2013-08-07 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP5113507B2 (ja) * 2007-12-25 2013-01-09 新光電気工業株式会社 放熱板収納トレー
CN102092507A (zh) * 2009-12-09 2011-06-15 深圳富泰宏精密工业有限公司 物料盘
JP5051797B2 (ja) * 2010-05-06 2012-10-17 シノン電気産業株式会社 半導体集積回路用トレー
CN201793171U (zh) * 2010-05-07 2011-04-13 富士康(昆山)电脑接插件有限公司 连接器包装盒
KR20130040238A (ko) * 2010-07-01 2013-04-23 루브리졸 어드밴스드 머티어리얼스, 인코포레이티드 폴리(페닐렌 에테르) 조성물의 열성형된 ｉｃ 트레이
US20120032054A1 (en) * 2010-08-09 2012-02-09 Tzung-Lin Huang Stackable holder for an integrated circuit package
KR20120018644A (ko) 2010-08-23 2012-03-05 삼성전자주식회사 반도체 패키지 이송 장치
CN102897435A (zh) 2011-07-29 2013-01-30 宸鸿科技(厦门)有限公司 承载装置及其制造与复制方法
CN103508082A (zh) * 2012-06-25 2014-01-15 联建(中国)科技有限公司 组件置放盘结构
US8453843B1 (en) 2012-07-27 2013-06-04 International Business Machines Corporation Tray for transporting semiconductor devices of a BGA type
US9406325B2 (en) * 2013-07-30 2016-08-02 Seagate Technology Llc Slider cleaning and carrier tray
CN104576465A (zh) * 2013-10-17 2015-04-29 中国科学院苏州纳米技术与纳米仿生研究所 芯片盛放装置
CN104709553B (zh) * 2013-12-13 2017-12-29 联想(北京)有限公司 一种用于放置集成模块的托盘
US9643772B2 (en) * 2014-07-04 2017-05-09 Shenzhen China Star Optoelectronics Technology Co., Ltd. Package box device for liquid crystal panels
KR101711735B1 (ko) * 2015-05-19 2017-03-03 주식회사 케이엠에이치하이텍 반도체 칩 트레이
US20170162411A1 (en) * 2015-12-03 2017-06-08 Nanya Technology Corporation Tray
US9818632B2 (en) * 2015-12-28 2017-11-14 Yu-Nan Lo Tray for semiconductor devices
JP6861602B2 (ja) * 2017-09-15 2021-04-21 Ｔｏｗａ株式会社 保持部材、保持部材の製造方法、保持機構及び製品の製造装置
KR102464332B1 (ko) * 2017-12-05 2022-11-07 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 적재 트레이 및 적재 트레이 모듈
CN109461686A (zh) * 2018-10-22 2019-03-12 武汉华星光电半导体显示技术有限公司 电子面板的承托装置
USD968957S1 (en) 2020-09-16 2022-11-08 Digi-Key Corporation Tray for transporting and storing electronic components
JP7180911B2 (ja) * 2021-03-16 2022-11-30 シノン電気産業株式会社 半導体集積回路用トレー
EP4092721A1 (en) * 2021-05-21 2022-11-23 STMicroelectronics S.r.l. Containment and transportation tray for electronic components having small dimensions and low weight

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5418692A (en) * 1994-08-22 1995-05-23 Shinon Denkisangyo Kabushiki-Kaisha Tray for semiconductor devices
EP0840358A2 (en) * 1996-11-05 1998-05-06 Applied Materials, Inc. Sloped substrate support

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3538735A1 (de) 1985-10-31 1987-05-07 Bosch Gmbh Robert Verfahren und schaltungsanordnung zum verdecken von fehlern in einem digitalen videosignal
JPH01226580A (ja) * 1988-02-26 1989-09-11 Yamaichi Electric Mfg Co Ltd Ｉｃキャリア
JPH0717592A (ja) 1993-06-16 1995-01-20 Hitachi Ltd 搬送用トレイ
US5400904C1 (en) 1993-10-15 2001-01-16 Murphy R H Co Inc Tray for ball terminal integrated circuits
US5964353A (en) * 1996-05-20 1999-10-12 Ilinois Tool Works Inc. Energy absorbing carrier tape
US5848702A (en) * 1997-06-05 1998-12-15 Advanced Micro Devices, Inc. Tray with flippable cover
US6036023A (en) * 1997-07-10 2000-03-14 Teradyne, Inc. Heat-transfer enhancing features for semiconductor carriers and devices
US5957293A (en) * 1998-05-04 1999-09-28 Advanced Micro Devices, Inc. Tray to ship ceramic substrates and ceramic BGA packages
US6071056A (en) * 1998-11-13 2000-06-06 International Business Machines Corporation Shipping tray backside location
US6079565A (en) * 1998-12-28 2000-06-27 Flouroware, Inc. Clipless tray

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5418692A (en) * 1994-08-22 1995-05-23 Shinon Denkisangyo Kabushiki-Kaisha Tray for semiconductor devices
EP0840358A2 (en) * 1996-11-05 1998-05-06 Applied Materials, Inc. Sloped substrate support

Also Published As

Publication number Publication date
CN1133571C (zh) 2004-01-07
JP2000315723A (ja) 2000-11-14
MY125134A (en) 2006-07-31
KR20010014840A (ko) 2001-02-26
US6357595B2 (en) 2002-03-19
JP3771084B2 (ja) 2006-04-26
KR100390324B1 (ko) 2003-07-16
EP1049138A2 (en) 2000-11-02
TW457619B (en) 2001-10-01
CN1272450A (zh) 2000-11-08
US20020003101A1 (en) 2002-01-10

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