SG82011A1 - Package encapsulant compositions for use in electronic devices - Google Patents

Package encapsulant compositions for use in electronic devices

Info

Publication number
SG82011A1
SG82011A1 SG9903554A SG1999003554A SG82011A1 SG 82011 A1 SG82011 A1 SG 82011A1 SG 9903554 A SG9903554 A SG 9903554A SG 1999003554 A SG1999003554 A SG 1999003554A SG 82011 A1 SG82011 A1 SG 82011A1
Authority
SG
Singapore
Prior art keywords
electronic devices
package encapsulant
encapsulant compositions
compositions
package
Prior art date
Application number
SG9903554A
Other languages
English (en)
Inventor
Ma Bodan
K Tong Quinn
Original Assignee
Nat Starch Chem Invest
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Starch Chem Invest filed Critical Nat Starch Chem Invest
Publication of SG82011A1 publication Critical patent/SG82011A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D35/00—Filtering devices having features not specifically covered by groups B01D24/00 - B01D33/00, or for applications not specifically covered by groups B01D24/00 - B01D33/00; Auxiliary devices for filtration; Filter housing constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/065—Polyamides; Polyesteramides; Polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/2805—Compounds having only one group containing active hydrogen
    • C08G18/285—Nitrogen containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/73—Polyisocyanates or polyisothiocyanates acyclic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2201/00—Details relating to filtering apparatus
    • B01D2201/31—Other construction details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polymerisation Methods In General (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
SG9903554A 1998-07-02 1999-06-25 Package encapsulant compositions for use in electronic devices SG82011A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US9149398P 1998-07-02 1998-07-02
US09/336,246 US6316566B1 (en) 1998-07-02 1999-06-18 Package encapsulant compositions for use in electronic devices

Publications (1)

Publication Number Publication Date
SG82011A1 true SG82011A1 (en) 2001-07-24

Family

ID=26784020

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9903554A SG82011A1 (en) 1998-07-02 1999-06-25 Package encapsulant compositions for use in electronic devices

Country Status (10)

Country Link
US (2) US6316566B1 (zh)
EP (1) EP0969063B1 (zh)
JP (1) JP3299522B2 (zh)
KR (3) KR100591977B1 (zh)
CN (2) CN1140603C (zh)
DE (1) DE69935758T2 (zh)
HK (1) HK1025987A1 (zh)
MY (1) MY121433A (zh)
SG (1) SG82011A1 (zh)
TW (1) TW482775B (zh)

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US6852814B2 (en) * 1994-09-02 2005-02-08 Henkel Corporation Thermosetting resin compositions containing maleimide and/or vinyl compounds
US7645899B1 (en) 1994-09-02 2010-01-12 Henkel Corporation Vinyl compounds
US6355750B1 (en) * 1998-07-02 2002-03-12 National Starch And Chemical Investment Holding Corporation Dye attach adhesives for use in microelectronic devices
CN1109086C (zh) * 2000-07-19 2003-05-21 湖北省化学研究所 一种柔性印刷电路用的反应型阻燃胶粘剂及制备
US6706835B2 (en) * 2002-07-19 2004-03-16 National Starch And Chemical Investment Holding Corporation Curable compositions containing thiazole functionality
US6818680B2 (en) 2002-09-23 2004-11-16 Corning Incorporated Curable adhesive compositions
US7176044B2 (en) * 2002-11-25 2007-02-13 Henkel Corporation B-stageable die attach adhesives
WO2010019832A2 (en) 2008-08-13 2010-02-18 Designer Molecules, Inc. Amide-extended crosslinking compounds and methods for use thereof
JP5328006B2 (ja) * 2003-05-05 2013-10-30 デジグナー モレキュールズ インコーポレイテッド イミド−リンクしたマレインイミドおよびポリマレインイミド化合物
US7884174B2 (en) 2003-05-05 2011-02-08 Designer Molecules, Inc. Imide-linked maleimide and polymaleimide compounds
US8513375B2 (en) 2003-05-05 2013-08-20 Designer Molecules, Inc. Imide-linked maleimide and polymaleimide compounds
JP2008501826A (ja) * 2004-06-04 2008-01-24 デジグナー モレキュールズ インコーポレイテッド フリーラジカル硬化可能なポリエステル類およびその使用方法
US7875688B2 (en) 2004-06-04 2011-01-25 Designer Molecules, Inc. Free-radical curable polyesters and methods for use thereof
US20060009539A1 (en) * 2004-07-12 2006-01-12 Herr Donald E Maleimide-based radiation curable compositions
TWM271321U (en) * 2004-09-10 2005-07-21 Aiptek Int Inc Flip-chip packaging device
US8043534B2 (en) 2005-10-21 2011-10-25 Designer Molecules, Inc. Maleimide compositions and methods for use thereof
US8378017B2 (en) 2005-12-29 2013-02-19 Designer Molecules, Inc. Thermosetting adhesive compositions
US7868113B2 (en) 2007-04-11 2011-01-11 Designer Molecules, Inc. Low shrinkage polyester thermosetting resins
US8063161B2 (en) 2007-04-16 2011-11-22 Designer Molecules, Inc. Low temperature curing acrylate and maleimide based formulations and methods for use thereof
US8308892B2 (en) 2008-04-09 2012-11-13 Designer Molecules, Inc. Di-cinnamyl compounds and methods for use thereof
US8008419B2 (en) 2008-08-13 2011-08-30 Designer Molecules, Inc. Siloxane monomers and methods for use thereof
US8415812B2 (en) 2009-09-03 2013-04-09 Designer Molecules, Inc. Materials and methods for stress reduction in semiconductor wafer passivation layers
US8710682B2 (en) * 2009-09-03 2014-04-29 Designer Molecules Inc, Inc. Materials and methods for stress reduction in semiconductor wafer passivation layers
US8686162B2 (en) 2010-08-25 2014-04-01 Designer Molecules Inc, Inc. Maleimide-functional monomers in amorphous form
JP2014062050A (ja) * 2012-09-19 2014-04-10 Fujifilm Corp 多価官能マレイミド系重合性化合物、これを含む硬化組成物およびインク組成物
JP6120072B2 (ja) * 2012-10-17 2017-04-26 Jsr株式会社 液晶配向剤
US20160111380A1 (en) * 2014-10-21 2016-04-21 Georgia Tech Research Corporation New structure of microelectronic packages with edge protection by coating
DE102018105731A1 (de) * 2018-03-13 2019-09-19 Infineon Technologies Ag Vernetztes thermoplastisches Dielektrium für Chip-Package

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Publication number Priority date Publication date Assignee Title
US4390596A (en) * 1979-11-09 1983-06-28 Rhone-Poulenc Industries Encapsulation of electronic components in bis-imido polymer
US5070154A (en) * 1989-09-11 1991-12-03 Shin-Etsu Chemical Co., Ltd. Composition of maleimide and aromatic-double bond epoxy resin
EP0484157A2 (en) * 1990-10-31 1992-05-06 Kabushiki Kaisha Toshiba Maleimide resin composition and resin encapsulated semiconductor device manufactured using the composition
EP0507603A1 (en) * 1991-04-04 1992-10-07 Shin-Etsu Chemical Co., Ltd. Thermosetting resin compositions and their manufacture
DE4218311A1 (de) * 1991-06-07 1992-12-10 Shinetsu Chemical Co Hitzehaertbare harzmassen
EP0559338A1 (en) * 1992-02-13 1993-09-08 Shin-Etsu Chemical Co., Ltd. Thermosetting resin compositions
US5290882A (en) * 1991-08-13 1994-03-01 Shin-Etsu Chemical Co., Ltd. Thermosetting resin compositions
US5310830A (en) * 1990-06-28 1994-05-10 Konishi Co., Ltd. Epoxy resin, maleimide and OH- and epoxy-containing compound
WO1998010920A1 (en) * 1996-09-10 1998-03-19 Quantum Materials, Inc. Maleimide containing formulations and uses therefor

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Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4390596A (en) * 1979-11-09 1983-06-28 Rhone-Poulenc Industries Encapsulation of electronic components in bis-imido polymer
US5070154A (en) * 1989-09-11 1991-12-03 Shin-Etsu Chemical Co., Ltd. Composition of maleimide and aromatic-double bond epoxy resin
US5310830A (en) * 1990-06-28 1994-05-10 Konishi Co., Ltd. Epoxy resin, maleimide and OH- and epoxy-containing compound
EP0484157A2 (en) * 1990-10-31 1992-05-06 Kabushiki Kaisha Toshiba Maleimide resin composition and resin encapsulated semiconductor device manufactured using the composition
EP0507603A1 (en) * 1991-04-04 1992-10-07 Shin-Etsu Chemical Co., Ltd. Thermosetting resin compositions and their manufacture
DE4218311A1 (de) * 1991-06-07 1992-12-10 Shinetsu Chemical Co Hitzehaertbare harzmassen
US5290882A (en) * 1991-08-13 1994-03-01 Shin-Etsu Chemical Co., Ltd. Thermosetting resin compositions
EP0559338A1 (en) * 1992-02-13 1993-09-08 Shin-Etsu Chemical Co., Ltd. Thermosetting resin compositions
WO1998010920A1 (en) * 1996-09-10 1998-03-19 Quantum Materials, Inc. Maleimide containing formulations and uses therefor

Also Published As

Publication number Publication date
CN1140603C (zh) 2004-03-03
KR100613214B1 (ko) 2006-08-22
KR20000011447A (ko) 2000-02-25
CN1244562A (zh) 2000-02-16
DE69935758T2 (de) 2007-12-27
US6316566B1 (en) 2001-11-13
KR100613215B1 (ko) 2006-08-22
JP3299522B2 (ja) 2002-07-08
KR20060030493A (ko) 2006-04-10
DE69935758D1 (de) 2007-05-24
EP0969063A3 (en) 2000-02-23
EP0969063B1 (en) 2007-04-11
CN1264886C (zh) 2006-07-19
HK1025987A1 (en) 2000-12-01
MY121433A (en) 2006-01-28
KR20060030492A (ko) 2006-04-10
EP0969063A2 (en) 2000-01-05
US20010056162A1 (en) 2001-12-27
US6350838B2 (en) 2002-02-26
KR100591977B1 (ko) 2006-06-20
JP2000103817A (ja) 2000-04-11
TW482775B (en) 2002-04-11
CN1511911A (zh) 2004-07-14

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