SG82011A1 - Package encapsulant compositions for use in electronic devices - Google Patents

Package encapsulant compositions for use in electronic devices

Info

Publication number
SG82011A1
SG82011A1 SG9903554A SG1999003554A SG82011A1 SG 82011 A1 SG82011 A1 SG 82011A1 SG 9903554 A SG9903554 A SG 9903554A SG 1999003554 A SG1999003554 A SG 1999003554A SG 82011 A1 SG82011 A1 SG 82011A1
Authority
SG
Singapore
Prior art keywords
electronic devices
package encapsulant
encapsulant compositions
compositions
package
Prior art date
Application number
SG9903554A
Other languages
English (en)
Inventor
Ma Bodan
K Tong Quinn
Original Assignee
Nat Starch Chem Invest
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Starch Chem Invest filed Critical Nat Starch Chem Invest
Publication of SG82011A1 publication Critical patent/SG82011A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D35/00—Filtering devices having features not specifically covered by groups B01D24/00 - B01D33/00, or for applications not specifically covered by groups B01D24/00 - B01D33/00; Auxiliary devices for filtration; Filter housing constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/065—Polyamides; Polyesteramides; Polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/2805—Compounds having only one group containing active hydrogen
    • C08G18/285—Nitrogen containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/73—Polyisocyanates or polyisothiocyanates acyclic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2201/00—Details relating to filtering apparatus
    • B01D2201/31—Other construction details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polymerisation Methods In General (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
SG9903554A 1998-07-02 1999-06-25 Package encapsulant compositions for use in electronic devices SG82011A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US9149398P 1998-07-02 1998-07-02
US09/336,246 US6316566B1 (en) 1998-07-02 1999-06-18 Package encapsulant compositions for use in electronic devices

Publications (1)

Publication Number Publication Date
SG82011A1 true SG82011A1 (en) 2001-07-24

Family

ID=26784020

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9903554A SG82011A1 (en) 1998-07-02 1999-06-25 Package encapsulant compositions for use in electronic devices

Country Status (10)

Country Link
US (2) US6316566B1 (zh)
EP (1) EP0969063B1 (zh)
JP (1) JP3299522B2 (zh)
KR (3) KR100591977B1 (zh)
CN (2) CN1264886C (zh)
DE (1) DE69935758T2 (zh)
HK (1) HK1025987A1 (zh)
MY (1) MY121433A (zh)
SG (1) SG82011A1 (zh)
TW (1) TW482775B (zh)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6852814B2 (en) * 1994-09-02 2005-02-08 Henkel Corporation Thermosetting resin compositions containing maleimide and/or vinyl compounds
US7645899B1 (en) 1994-09-02 2010-01-12 Henkel Corporation Vinyl compounds
US6355750B1 (en) * 1998-07-02 2002-03-12 National Starch And Chemical Investment Holding Corporation Dye attach adhesives for use in microelectronic devices
CN1109086C (zh) * 2000-07-19 2003-05-21 湖北省化学研究所 一种柔性印刷电路用的反应型阻燃胶粘剂及制备
US6706835B2 (en) * 2002-07-19 2004-03-16 National Starch And Chemical Investment Holding Corporation Curable compositions containing thiazole functionality
US6818680B2 (en) 2002-09-23 2004-11-16 Corning Incorporated Curable adhesive compositions
US7176044B2 (en) * 2002-11-25 2007-02-13 Henkel Corporation B-stageable die attach adhesives
US7884174B2 (en) 2003-05-05 2011-02-08 Designer Molecules, Inc. Imide-linked maleimide and polymaleimide compounds
US8513375B2 (en) 2003-05-05 2013-08-20 Designer Molecules, Inc. Imide-linked maleimide and polymaleimide compounds
WO2010019832A2 (en) 2008-08-13 2010-02-18 Designer Molecules, Inc. Amide-extended crosslinking compounds and methods for use thereof
KR101179815B1 (ko) * 2003-05-05 2012-09-04 디자이너 몰레큘스 인코퍼레이티드 이미드-연결된 말레이미드 및 폴리말레이미드 화합물
WO2005121190A2 (en) * 2004-06-04 2005-12-22 Designer Molecules Inc. Free-radical curable polyesters and methods for use thereof
US7875688B2 (en) 2004-06-04 2011-01-25 Designer Molecules, Inc. Free-radical curable polyesters and methods for use thereof
US20060009539A1 (en) * 2004-07-12 2006-01-12 Herr Donald E Maleimide-based radiation curable compositions
TWM271321U (en) * 2004-09-10 2005-07-21 Aiptek Int Inc Flip-chip packaging device
US8043534B2 (en) 2005-10-21 2011-10-25 Designer Molecules, Inc. Maleimide compositions and methods for use thereof
US8378017B2 (en) 2005-12-29 2013-02-19 Designer Molecules, Inc. Thermosetting adhesive compositions
US7868113B2 (en) 2007-04-11 2011-01-11 Designer Molecules, Inc. Low shrinkage polyester thermosetting resins
WO2008130894A1 (en) 2007-04-16 2008-10-30 Designer Molecules, Inc. Low temperature curing acrylate and maleimide based formulations and methods for use thereof
US8308892B2 (en) 2008-04-09 2012-11-13 Designer Molecules, Inc. Di-cinnamyl compounds and methods for use thereof
US8008419B2 (en) 2008-08-13 2011-08-30 Designer Molecules, Inc. Siloxane monomers and methods for use thereof
US8710682B2 (en) * 2009-09-03 2014-04-29 Designer Molecules Inc, Inc. Materials and methods for stress reduction in semiconductor wafer passivation layers
US8415812B2 (en) 2009-09-03 2013-04-09 Designer Molecules, Inc. Materials and methods for stress reduction in semiconductor wafer passivation layers
US8686162B2 (en) 2010-08-25 2014-04-01 Designer Molecules Inc, Inc. Maleimide-functional monomers in amorphous form
JP2014062050A (ja) * 2012-09-19 2014-04-10 Fujifilm Corp 多価官能マレイミド系重合性化合物、これを含む硬化組成物およびインク組成物
JP6120072B2 (ja) * 2012-10-17 2017-04-26 Jsr株式会社 液晶配向剤
US20160111380A1 (en) * 2014-10-21 2016-04-21 Georgia Tech Research Corporation New structure of microelectronic packages with edge protection by coating
DE102018105731A1 (de) * 2018-03-13 2019-09-19 Infineon Technologies Ag Vernetztes thermoplastisches Dielektrium für Chip-Package

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4390596A (en) * 1979-11-09 1983-06-28 Rhone-Poulenc Industries Encapsulation of electronic components in bis-imido polymer
US5070154A (en) * 1989-09-11 1991-12-03 Shin-Etsu Chemical Co., Ltd. Composition of maleimide and aromatic-double bond epoxy resin
EP0484157A2 (en) * 1990-10-31 1992-05-06 Kabushiki Kaisha Toshiba Maleimide resin composition and resin encapsulated semiconductor device manufactured using the composition
EP0507603A1 (en) * 1991-04-04 1992-10-07 Shin-Etsu Chemical Co., Ltd. Thermosetting resin compositions and their manufacture
DE4218311A1 (de) * 1991-06-07 1992-12-10 Shinetsu Chemical Co Hitzehaertbare harzmassen
EP0559338A1 (en) * 1992-02-13 1993-09-08 Shin-Etsu Chemical Co., Ltd. Thermosetting resin compositions
US5290882A (en) * 1991-08-13 1994-03-01 Shin-Etsu Chemical Co., Ltd. Thermosetting resin compositions
US5310830A (en) * 1990-06-28 1994-05-10 Konishi Co., Ltd. Epoxy resin, maleimide and OH- and epoxy-containing compound
WO1998010920A1 (en) * 1996-09-10 1998-03-19 Quantum Materials, Inc. Maleimide containing formulations and uses therefor

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3403172A (en) 1964-01-03 1968-09-24 Agriculture Usa Hard, high-melting waxes from longchain n-allylamides
DE2853992A1 (de) 1978-12-14 1980-07-03 Basf Ag Selbstverloeschende thermoplastische formmassen und formteile aus diesen
US4336311A (en) 1980-08-25 1982-06-22 Sprague Electric Company Humidity- and salt-resistant electronic component
EP0051165A1 (en) 1980-11-03 1982-05-12 BURROUGHS CORPORATION (a Michigan corporation) Repairable IC package with thermoplastic chip attach
US4485218A (en) 1982-02-18 1984-11-27 General Electric Company Encapsulating composition for inductive devices containing elastomeric polybutadiene having predominate trans-1,4 configuration
DE3233912A1 (de) 1982-09-13 1984-03-15 Merck Patent Gmbh, 6100 Darmstadt Fotolacke zur ausbildung von reliefstrukturen aus hochwaermebestaendigen polymeren
US4581461A (en) * 1983-04-07 1986-04-08 National Starch And Chemical Corporation Maleated siloxane derivatives
US4613637A (en) 1983-12-27 1986-09-23 Hughes Aircraft Company Copolymers utilizing isoimides and method of preparing same
US4533975A (en) 1983-12-27 1985-08-06 North American Philips Corporation Radiation hardenable coating and electronic components coated therewith
DE3443090A1 (de) 1984-11-27 1986-05-28 Bayer Ag, 5090 Leverkusen Aromatische polyester mit dimethylmaleinimid-endgruppen, ihre herstellung und verwendung
US4623559A (en) 1985-07-12 1986-11-18 Westinghouse Electric Corp. U.V. cured flexible polyester-monoacrylate protective thermistor coatings having good edge coverage and method of coating
US4720445A (en) 1986-02-18 1988-01-19 Allied Corporation Copolymers from maleimide and aliphatic vinyl ethers and esters used in positive photoresist
US4808717A (en) 1986-09-17 1989-02-28 Sumitomo Chemical Company, Limited Thermosetting resin composition
US4876358A (en) 1987-11-25 1989-10-24 Texaco Inc. Oxyethylene bismaleimide derivatives
US4826995A (en) 1987-11-25 1989-05-02 Texaco Inc. Bismaleimide derivatives of higher molecular weight polyoxyalkyleneamines
IL88477A0 (en) * 1987-11-27 1989-06-30 Hercules Inc Maleimide-based thermosettable resin compositions
JPH0637599B2 (ja) 1987-12-08 1994-05-18 ハニー化成株式会社 電着塗装方法
EP0357110A1 (en) 1988-08-05 1990-03-07 Akzo N.V. Two component coating curable at ambient temperature via a Diels-Alder reaction
US4999136A (en) 1988-08-23 1991-03-12 Westinghouse Electric Corp. Ultraviolet curable conductive resin
US5082880A (en) * 1988-09-12 1992-01-21 Mitsui Toatsu Chemicals, Inc. Semiconductor sealing composition containing epoxy resin and polymaleimide
US5017406A (en) 1988-12-08 1991-05-21 Dow Corning Corporation UV curable compositions cured with polysilane and peroxide initiators
JP2642470B2 (ja) 1989-02-23 1997-08-20 株式会社東芝 封止用樹脂組成物及び樹脂封止型半導体装置
JP2718156B2 (ja) * 1989-03-20 1998-02-25 日立化成工業株式会社 耐熱性接着剤組成物
CA2013018A1 (en) * 1989-03-31 1990-09-30 Isao Kaneko Imide prepolymers, cured products, method for making, laminate preparation, and encapsulating compositions
JP2679849B2 (ja) 1989-07-26 1997-11-19 松下電器産業株式会社 電子部品の実装方法およびこの方法に用いる接着剤
CA2040619A1 (en) 1990-04-19 1991-10-20 Yoshichi Hagiwara Photocurable self-retainable gel, shaped article prepared therefrom, applications and preparations thereof
KR960008127B1 (ko) * 1990-06-30 1996-06-20 제일모직 주식회사 내열성을 향상시킨 반도체소자 밀봉용 수지조성물
JPH04115407A (ja) 1990-09-03 1992-04-16 Soken Kagaku Kk 異方導電性接着剤組成物
JP3118246B2 (ja) 1990-10-11 2000-12-18 綜研化学株式会社 熱硬化型接着剤
EP0525418B1 (en) 1991-07-30 2002-11-20 Cytec Technology Corp. Toughened, fiber-reinforced thermosetting resin matrix prepregs and composites made therefrom
US5532296A (en) 1991-07-30 1996-07-02 Cytec Technology Corp. Bismaleimide resin systems toughened by addition of preformed functionalized low Tg elastomer particles
US5602205A (en) 1993-01-22 1997-02-11 Cytec Technology Corp. N-(substituted) maleimides and compositions incorporating the same
US5314950A (en) 1993-01-22 1994-05-24 Cytec Technology Corp. Heat resistant resin composition comprising polymers of N-(substituted) maleimides and improved process for the preparation of said maleimides
US5347258A (en) 1993-04-07 1994-09-13 Zycon Corporation Annular resistor coupled with printed circuit board through-hole
US5744557A (en) 1993-06-16 1998-04-28 Minnesota Mining And Manufacturing Company Energy-curable cyanate/ethylenically unsaturated compositions
JPH0855940A (ja) * 1994-08-12 1996-02-27 Sumitomo Chem Co Ltd 熱硬化性樹脂組成物
EP1453087B1 (en) 1994-09-02 2012-02-22 Henkel Corporation Microelectronic assembly
ES2175145T3 (es) 1995-11-13 2002-11-16 Cytec Tech Corp Polimeros termoestables para aplicaciones de compuestos y de adhesivos
JPH10101796A (ja) * 1996-09-30 1998-04-21 Matsushita Electric Works Ltd イミド樹脂組成物
JPH10168413A (ja) 1996-12-16 1998-06-23 Sumitomo Bakelite Co Ltd 異方導電性接着剤
US5760337A (en) 1996-12-16 1998-06-02 Shell Oil Company Thermally reworkable binders for flip-chip devices
US5726391A (en) 1996-12-16 1998-03-10 Shell Oil Company Thermosetting Encapsulants for electronics packaging
US6281314B1 (en) * 1998-07-02 2001-08-28 National Starch And Chemical Investment Holding Corporation Compositions for use in the fabrication of circuit components and printed wire boards

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4390596A (en) * 1979-11-09 1983-06-28 Rhone-Poulenc Industries Encapsulation of electronic components in bis-imido polymer
US5070154A (en) * 1989-09-11 1991-12-03 Shin-Etsu Chemical Co., Ltd. Composition of maleimide and aromatic-double bond epoxy resin
US5310830A (en) * 1990-06-28 1994-05-10 Konishi Co., Ltd. Epoxy resin, maleimide and OH- and epoxy-containing compound
EP0484157A2 (en) * 1990-10-31 1992-05-06 Kabushiki Kaisha Toshiba Maleimide resin composition and resin encapsulated semiconductor device manufactured using the composition
EP0507603A1 (en) * 1991-04-04 1992-10-07 Shin-Etsu Chemical Co., Ltd. Thermosetting resin compositions and their manufacture
DE4218311A1 (de) * 1991-06-07 1992-12-10 Shinetsu Chemical Co Hitzehaertbare harzmassen
US5290882A (en) * 1991-08-13 1994-03-01 Shin-Etsu Chemical Co., Ltd. Thermosetting resin compositions
EP0559338A1 (en) * 1992-02-13 1993-09-08 Shin-Etsu Chemical Co., Ltd. Thermosetting resin compositions
WO1998010920A1 (en) * 1996-09-10 1998-03-19 Quantum Materials, Inc. Maleimide containing formulations and uses therefor

Also Published As

Publication number Publication date
DE69935758T2 (de) 2007-12-27
HK1025987A1 (en) 2000-12-01
US20010056162A1 (en) 2001-12-27
KR100613214B1 (ko) 2006-08-22
EP0969063B1 (en) 2007-04-11
MY121433A (en) 2006-01-28
KR20060030493A (ko) 2006-04-10
CN1140603C (zh) 2004-03-03
EP0969063A3 (en) 2000-02-23
JP3299522B2 (ja) 2002-07-08
KR100613215B1 (ko) 2006-08-22
CN1264886C (zh) 2006-07-19
KR100591977B1 (ko) 2006-06-20
KR20000011447A (ko) 2000-02-25
US6316566B1 (en) 2001-11-13
TW482775B (en) 2002-04-11
CN1511911A (zh) 2004-07-14
US6350838B2 (en) 2002-02-26
DE69935758D1 (de) 2007-05-24
KR20060030492A (ko) 2006-04-10
JP2000103817A (ja) 2000-04-11
CN1244562A (zh) 2000-02-16
EP0969063A2 (en) 2000-01-05

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