GB9803885D0 - Moulded electronic device package - Google Patents

Moulded electronic device package

Info

Publication number
GB9803885D0
GB9803885D0 GB9803885A GB9803885A GB9803885D0 GB 9803885 D0 GB9803885 D0 GB 9803885D0 GB 9803885 A GB9803885 A GB 9803885A GB 9803885 A GB9803885 A GB 9803885A GB 9803885 D0 GB9803885 D0 GB 9803885D0
Authority
GB
United Kingdom
Prior art keywords
electronic device
device package
moulded electronic
moulded
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB9803885A
Other versions
GB2334814A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Priority to GB9803885A priority Critical patent/GB2334814A/en
Publication of GB9803885D0 publication Critical patent/GB9803885D0/en
Publication of GB2334814A publication Critical patent/GB2334814A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
GB9803885A 1998-02-25 1998-02-25 Moulded electronic device package with a heat sink Withdrawn GB2334814A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9803885A GB2334814A (en) 1998-02-25 1998-02-25 Moulded electronic device package with a heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9803885A GB2334814A (en) 1998-02-25 1998-02-25 Moulded electronic device package with a heat sink

Publications (2)

Publication Number Publication Date
GB9803885D0 true GB9803885D0 (en) 1998-04-22
GB2334814A GB2334814A (en) 1999-09-01

Family

ID=10827505

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9803885A Withdrawn GB2334814A (en) 1998-02-25 1998-02-25 Moulded electronic device package with a heat sink

Country Status (1)

Country Link
GB (1) GB2334814A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10249552B2 (en) * 2017-02-22 2019-04-02 Jmj Korea Co., Ltd. Semiconductor package having double-sided heat dissipation structure

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5753947A (en) * 1980-09-17 1982-03-31 Hitachi Ltd Transistor and electronic device containing it
DE3684184D1 (en) * 1985-06-20 1992-04-16 Toshiba Kawasaki Kk ENCLOSED SEMICONDUCTOR ARRANGEMENT.
EP0484180A1 (en) * 1990-11-01 1992-05-06 Fujitsu Limited Packaged semiconductor device having an optimized heat dissipation
JP3406753B2 (en) * 1995-11-30 2003-05-12 三菱電機株式会社 Semiconductor device and semiconductor module

Also Published As

Publication number Publication date
GB2334814A (en) 1999-09-01

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)