IL149814A0 - Active package for integrated circuit - Google Patents
Active package for integrated circuitInfo
- Publication number
- IL149814A0 IL149814A0 IL14981400A IL14981400A IL149814A0 IL 149814 A0 IL149814 A0 IL 149814A0 IL 14981400 A IL14981400 A IL 14981400A IL 14981400 A IL14981400 A IL 14981400A IL 149814 A0 IL149814 A0 IL 149814A0
- Authority
- IL
- Israel
- Prior art keywords
- integrated circuit
- active package
- package
- active
- integrated
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/647—Resistive arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/642—Capacitive arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/645—Inductive arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Dc-Dc Converters (AREA)
- Filters And Equalizers (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16682399P | 1999-11-22 | 1999-11-22 | |
PCT/US2000/032198 WO2001039252A2 (en) | 1999-11-22 | 2000-11-22 | Active package for integrated circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
IL149814A0 true IL149814A0 (en) | 2002-11-10 |
Family
ID=22604828
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL14981400A IL149814A0 (en) | 1999-11-22 | 2000-11-22 | Active package for integrated circuit |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP1234321A1 (en) |
JP (1) | JP2003515924A (en) |
KR (1) | KR20020070437A (en) |
CN (1) | CN100385664C (en) |
AU (1) | AU1628301A (en) |
CA (1) | CA2392273C (en) |
IL (1) | IL149814A0 (en) |
WO (1) | WO2001039252A2 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6812566B2 (en) | 2002-01-02 | 2004-11-02 | Intel Corporation | Lower profile package with power supply in package |
US7230321B2 (en) | 2003-10-13 | 2007-06-12 | Mccain Joseph | Integrated circuit package with laminated power cell having coplanar electrode |
US7557433B2 (en) | 2004-10-25 | 2009-07-07 | Mccain Joseph H | Microelectronic device with integrated energy source |
KR100541655B1 (en) | 2004-01-07 | 2006-01-11 | 삼성전자주식회사 | Package circuit board and package using thereof |
KR100963199B1 (en) * | 2008-06-11 | 2010-06-14 | 전자부품연구원 | Substrate with active device chip embedded therein and fabricating method thereof |
US10354943B1 (en) * | 2018-07-12 | 2019-07-16 | Infineon Technologies Ag | Multi-branch terminal for integrated circuit (IC) package |
CN109906003B (en) * | 2019-04-16 | 2021-04-16 | 常州信息职业技术学院 | Elastic clamping type integrated circuit packaging device |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4249196A (en) * | 1978-08-21 | 1981-02-03 | Burroughs Corporation | Integrated circuit module with integral capacitor |
FR2547113B1 (en) * | 1983-06-03 | 1986-11-07 | Inf Milit Spatiale Aeronaut | ELECTRONIC COMPONENT ENCAPSULATION BOX, RADIATION HARDENED |
US4714981A (en) * | 1986-04-09 | 1987-12-22 | Rca Corporation | Cover for a semiconductor package |
US4978638A (en) * | 1989-12-21 | 1990-12-18 | International Business Machines Corporation | Method for attaching heat sink to plastic packaged electronic component |
US6198250B1 (en) * | 1998-04-02 | 2001-03-06 | The Procter & Gamble Company | Primary battery having a built-in controller to extend battery run time |
-
2000
- 2000-11-22 KR KR1020027006515A patent/KR20020070437A/en not_active Application Discontinuation
- 2000-11-22 CN CNB008185557A patent/CN100385664C/en not_active Expired - Fee Related
- 2000-11-22 JP JP2001540823A patent/JP2003515924A/en active Pending
- 2000-11-22 WO PCT/US2000/032198 patent/WO2001039252A2/en active Application Filing
- 2000-11-22 AU AU16283/01A patent/AU1628301A/en not_active Abandoned
- 2000-11-22 EP EP00978869A patent/EP1234321A1/en not_active Withdrawn
- 2000-11-22 IL IL14981400A patent/IL149814A0/en unknown
- 2000-11-22 CA CA002392273A patent/CA2392273C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
WO2001039252A3 (en) | 2002-07-11 |
WO2001039252A9 (en) | 2002-09-26 |
CN100385664C (en) | 2008-04-30 |
AU1628301A (en) | 2001-06-04 |
JP2003515924A (en) | 2003-05-07 |
CA2392273A1 (en) | 2001-05-31 |
CA2392273C (en) | 2007-05-01 |
EP1234321A1 (en) | 2002-08-28 |
WO2001039252A2 (en) | 2001-05-31 |
CN1425198A (en) | 2003-06-18 |
KR20020070437A (en) | 2002-09-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG82701A1 (en) | Multi-functional shipping system for integrated circuit devices | |
GB0002758D0 (en) | Semiconductor devices | |
SG91352A1 (en) | Semiconductor package | |
EP1164595A4 (en) | Semiconductor device | |
GB0000106D0 (en) | Semiconductor device | |
GB9922763D0 (en) | Semiconductor devices | |
GB2353496B (en) | Encapsulating semiconducttor integrated circuits | |
EP1179851A4 (en) | Semiconductor device | |
GB2356489B (en) | Semiconductor device | |
GB2347014B (en) | Semiconductor device | |
EP1229591A4 (en) | Semiconductor device | |
EP1220071A4 (en) | Semiconductor device | |
IL149814A0 (en) | Active package for integrated circuit | |
GB2370687B (en) | An integrated circuit package | |
SG90199A1 (en) | Active damping circuit | |
GB9920173D0 (en) | Semiconductor laser | |
EP1211733A4 (en) | Semiconductor device | |
GB2348556B (en) | Semiconductor device | |
GB2354881B (en) | Integrated circuit packaging structure | |
EP1093126A4 (en) | Integrated circuit | |
GB9827901D0 (en) | Active semiconductor | |
IL145435A0 (en) | Elastane package | |
AU6317100A (en) | Semiconductor package unit | |
GB9915579D0 (en) | Integrated circuit packaging | |
TW422413U (en) | Improved semiconductor package structure |