CA2392273A1 - Active package for integrated circuit - Google Patents

Active package for integrated circuit Download PDF

Info

Publication number
CA2392273A1
CA2392273A1 CA002392273A CA2392273A CA2392273A1 CA 2392273 A1 CA2392273 A1 CA 2392273A1 CA 002392273 A CA002392273 A CA 002392273A CA 2392273 A CA2392273 A CA 2392273A CA 2392273 A1 CA2392273 A1 CA 2392273A1
Authority
CA
Canada
Prior art keywords
integrated circuit
component
package
active
inductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002392273A
Other languages
French (fr)
Other versions
CA2392273C (en
Inventor
Dragan Danilo Nebrigic
Milan Marcel Jevtitch
Chow-Chi Huang
Kendall William Kerr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University of Illinois
Original Assignee
The Board Of Trustees Of The University Of Illinois
Dragan Danilo Nebrigic
Milan Marcel Jevtitch
Chow-Chi Huang
Kendall William Kerr
The Procter & Gamble Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by The Board Of Trustees Of The University Of Illinois, Dragan Danilo Nebrigic, Milan Marcel Jevtitch, Chow-Chi Huang, Kendall William Kerr, The Procter & Gamble Company filed Critical The Board Of Trustees Of The University Of Illinois
Publication of CA2392273A1 publication Critical patent/CA2392273A1/en
Application granted granted Critical
Publication of CA2392273C publication Critical patent/CA2392273C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/647—Resistive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/642—Capacitive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/645—Inductive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Abstract

An active package for an integrated circuit may include an integrated circuit and an active component that is part of the circuit topology for the integrated circuit. The active component forms at least a portion of the housing for the integrated circuit. The integrated circuit may be housed in a shell formed by one or more discrete components. The active package may be formed in the same geometry and dimensions as a standard passive integrated circuit package, or may be formed in a shape to fit inside a standard or specially made battery package, or for another special application. A smart component may include a discrete component or a semiconductor-based resistor, capacitor or inductor, and a separate integrated circuit housed in the same housing as the discrete component or a semiconductor-based resistor, capacitor or inductor. The integrated circuit may control at least one electrical parameter of the discrete component or a semiconductor-based resistor, capacitor or inductor. In one embodiment, the integrated circuit may maintain the resistance, resistivity, capacitance, inductance, etc. of the component inside a narrow range in order to create a high-precision component regardless of changes in environmental changes such as temperature, pressure, humidity, etc.
CA002392273A 1999-11-22 2000-11-22 Active package for integrated circuit Expired - Fee Related CA2392273C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16682399P 1999-11-22 1999-11-22
US60/166,823 1999-11-22
PCT/US2000/032198 WO2001039252A2 (en) 1999-11-22 2000-11-22 Active package for integrated circuit

Publications (2)

Publication Number Publication Date
CA2392273A1 true CA2392273A1 (en) 2001-05-31
CA2392273C CA2392273C (en) 2007-05-01

Family

ID=22604828

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002392273A Expired - Fee Related CA2392273C (en) 1999-11-22 2000-11-22 Active package for integrated circuit

Country Status (8)

Country Link
EP (1) EP1234321A1 (en)
JP (1) JP2003515924A (en)
KR (1) KR20020070437A (en)
CN (1) CN100385664C (en)
AU (1) AU1628301A (en)
CA (1) CA2392273C (en)
IL (1) IL149814A0 (en)
WO (1) WO2001039252A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6812566B2 (en) * 2002-01-02 2004-11-02 Intel Corporation Lower profile package with power supply in package
US7557433B2 (en) 2004-10-25 2009-07-07 Mccain Joseph H Microelectronic device with integrated energy source
US7230321B2 (en) 2003-10-13 2007-06-12 Mccain Joseph Integrated circuit package with laminated power cell having coplanar electrode
KR100541655B1 (en) 2004-01-07 2006-01-11 삼성전자주식회사 Package circuit board and package using thereof
KR100963199B1 (en) * 2008-06-11 2010-06-14 전자부품연구원 Substrate with active device chip embedded therein and fabricating method thereof
US10354943B1 (en) * 2018-07-12 2019-07-16 Infineon Technologies Ag Multi-branch terminal for integrated circuit (IC) package
CN109906003B (en) * 2019-04-16 2021-04-16 常州信息职业技术学院 Elastic clamping type integrated circuit packaging device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4249196A (en) * 1978-08-21 1981-02-03 Burroughs Corporation Integrated circuit module with integral capacitor
FR2547113B1 (en) * 1983-06-03 1986-11-07 Inf Milit Spatiale Aeronaut ELECTRONIC COMPONENT ENCAPSULATION BOX, RADIATION HARDENED
US4714981A (en) * 1986-04-09 1987-12-22 Rca Corporation Cover for a semiconductor package
US4978638A (en) * 1989-12-21 1990-12-18 International Business Machines Corporation Method for attaching heat sink to plastic packaged electronic component
US6198250B1 (en) * 1998-04-02 2001-03-06 The Procter & Gamble Company Primary battery having a built-in controller to extend battery run time

Also Published As

Publication number Publication date
CN100385664C (en) 2008-04-30
WO2001039252A2 (en) 2001-05-31
EP1234321A1 (en) 2002-08-28
WO2001039252A3 (en) 2002-07-11
JP2003515924A (en) 2003-05-07
CN1425198A (en) 2003-06-18
IL149814A0 (en) 2002-11-10
AU1628301A (en) 2001-06-04
WO2001039252A9 (en) 2002-09-26
CA2392273C (en) 2007-05-01
KR20020070437A (en) 2002-09-09

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Legal Events

Date Code Title Description
EEER Examination request
MKLA Lapsed