CA2392273A1 - Boitier actif pour circuit integre - Google Patents

Boitier actif pour circuit integre Download PDF

Info

Publication number
CA2392273A1
CA2392273A1 CA002392273A CA2392273A CA2392273A1 CA 2392273 A1 CA2392273 A1 CA 2392273A1 CA 002392273 A CA002392273 A CA 002392273A CA 2392273 A CA2392273 A CA 2392273A CA 2392273 A1 CA2392273 A1 CA 2392273A1
Authority
CA
Canada
Prior art keywords
integrated circuit
component
package
active
inductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002392273A
Other languages
English (en)
Other versions
CA2392273C (fr
Inventor
Dragan Danilo Nebrigic
Milan Marcel Jevtitch
Chow-Chi Huang
Kendall William Kerr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University of Illinois
Original Assignee
The Board Of Trustees Of The University Of Illinois
Dragan Danilo Nebrigic
Milan Marcel Jevtitch
Chow-Chi Huang
Kendall William Kerr
The Procter & Gamble Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by The Board Of Trustees Of The University Of Illinois, Dragan Danilo Nebrigic, Milan Marcel Jevtitch, Chow-Chi Huang, Kendall William Kerr, The Procter & Gamble Company filed Critical The Board Of Trustees Of The University Of Illinois
Publication of CA2392273A1 publication Critical patent/CA2392273A1/fr
Application granted granted Critical
Publication of CA2392273C publication Critical patent/CA2392273C/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/647—Resistive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/642—Capacitive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/645—Inductive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Dc-Dc Converters (AREA)
  • Filters And Equalizers (AREA)
  • Semiconductor Integrated Circuits (AREA)
CA002392273A 1999-11-22 2000-11-22 Boitier actif pour circuit integre Expired - Fee Related CA2392273C (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16682399P 1999-11-22 1999-11-22
US60/166,823 1999-11-22
PCT/US2000/032198 WO2001039252A2 (fr) 1999-11-22 2000-11-22 Boitier actif pour circuit integre

Publications (2)

Publication Number Publication Date
CA2392273A1 true CA2392273A1 (fr) 2001-05-31
CA2392273C CA2392273C (fr) 2007-05-01

Family

ID=22604828

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002392273A Expired - Fee Related CA2392273C (fr) 1999-11-22 2000-11-22 Boitier actif pour circuit integre

Country Status (8)

Country Link
EP (1) EP1234321A1 (fr)
JP (1) JP2003515924A (fr)
KR (1) KR20020070437A (fr)
CN (1) CN100385664C (fr)
AU (1) AU1628301A (fr)
CA (1) CA2392273C (fr)
IL (1) IL149814A0 (fr)
WO (1) WO2001039252A2 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6812566B2 (en) 2002-01-02 2004-11-02 Intel Corporation Lower profile package with power supply in package
US7557433B2 (en) 2004-10-25 2009-07-07 Mccain Joseph H Microelectronic device with integrated energy source
US7230321B2 (en) 2003-10-13 2007-06-12 Mccain Joseph Integrated circuit package with laminated power cell having coplanar electrode
KR100541655B1 (ko) 2004-01-07 2006-01-11 삼성전자주식회사 패키지 회로기판 및 이를 이용한 패키지
KR100963199B1 (ko) * 2008-06-11 2010-06-14 전자부품연구원 능동 소자 칩 내장형 기판 및 그의 제조 방법
US10354943B1 (en) * 2018-07-12 2019-07-16 Infineon Technologies Ag Multi-branch terminal for integrated circuit (IC) package
CN109906003B (zh) * 2019-04-16 2021-04-16 常州信息职业技术学院 弹性夹持式集成电路封装装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4249196A (en) * 1978-08-21 1981-02-03 Burroughs Corporation Integrated circuit module with integral capacitor
FR2547113B1 (fr) * 1983-06-03 1986-11-07 Inf Milit Spatiale Aeronaut Boitier d'encapsulation de composant electronique, durci vis-a-vis des radiations
US4714981A (en) * 1986-04-09 1987-12-22 Rca Corporation Cover for a semiconductor package
US4978638A (en) * 1989-12-21 1990-12-18 International Business Machines Corporation Method for attaching heat sink to plastic packaged electronic component
US6198250B1 (en) * 1998-04-02 2001-03-06 The Procter & Gamble Company Primary battery having a built-in controller to extend battery run time

Also Published As

Publication number Publication date
KR20020070437A (ko) 2002-09-09
WO2001039252A2 (fr) 2001-05-31
JP2003515924A (ja) 2003-05-07
CN100385664C (zh) 2008-04-30
WO2001039252A3 (fr) 2002-07-11
CN1425198A (zh) 2003-06-18
IL149814A0 (en) 2002-11-10
CA2392273C (fr) 2007-05-01
AU1628301A (en) 2001-06-04
EP1234321A1 (fr) 2002-08-28
WO2001039252A9 (fr) 2002-09-26

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Legal Events

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EEER Examination request
MKLA Lapsed