WO2001039252A3 - Boitier actif pour circuit integre - Google Patents

Boitier actif pour circuit integre Download PDF

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Publication number
WO2001039252A3
WO2001039252A3 PCT/US2000/032198 US0032198W WO0139252A3 WO 2001039252 A3 WO2001039252 A3 WO 2001039252A3 US 0032198 W US0032198 W US 0032198W WO 0139252 A3 WO0139252 A3 WO 0139252A3
Authority
WO
WIPO (PCT)
Prior art keywords
integrated circuit
component
package
active
inductor
Prior art date
Application number
PCT/US2000/032198
Other languages
English (en)
Other versions
WO2001039252A2 (fr
WO2001039252A9 (fr
Inventor
Dragan Danilo Nebrigic
Milan Marcel Jevtitch
Chow-Chi Huang
Kendall William Kerr
Original Assignee
Univ Illinois
Dragan Danilo Nebrigic
Milan Marcel Jevtitch
Chow-Chi Huang
Kendall William Kerr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Illinois, Dragan Danilo Nebrigic, Milan Marcel Jevtitch, Chow-Chi Huang, Kendall William Kerr filed Critical Univ Illinois
Priority to AU16283/01A priority Critical patent/AU1628301A/en
Priority to CA002392273A priority patent/CA2392273C/fr
Priority to KR1020027006515A priority patent/KR20020070437A/ko
Priority to EP00978869A priority patent/EP1234321A1/fr
Priority to IL14981400A priority patent/IL149814A0/xx
Priority to JP2001540823A priority patent/JP2003515924A/ja
Publication of WO2001039252A2 publication Critical patent/WO2001039252A2/fr
Publication of WO2001039252A3 publication Critical patent/WO2001039252A3/fr
Publication of WO2001039252A9 publication Critical patent/WO2001039252A9/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/647—Resistive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/642—Capacitive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/645—Inductive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Dc-Dc Converters (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Filters And Equalizers (AREA)

Abstract

L'invention concerne un boîtier actif pour circuit intégré qui peut comprendre un circuit intégré et un composant actif faisant partie intégrante de la topologie de circuit pour le circuit intégré. Le composant actif constitue au moins une partie du boîtier du circuit intégré, ce boîtier pouvant être une coque formée d'un ou plusieurs éléments discrets. Le boîtier actif peut avoir une géométrie et des dimensions analogues à celles d'un boîtier passif classique de circuit intégré, ou bien avoir une forme qui s'adapte dans un logement de batteries classique ou spécialement conçu, ou bien encore une forme propre à telle ou telle application spécifique. Un composant intelligent peut comprendre un élément discret ou une résistance, un condensateur ou une bobine d'inductance à semiconducteur, et un circuit intégré séparé logé dans le même boîtier que le composant discret ou une résistance, un condensateur ou une bobine d'inductance en semiconducteur. Le circuit intégré peut contrôler au moins un paramètre électrique du composant discret ou d'une résistance, d'une capacité ou d'une bobine d'inductance à semiconducteur. Selon une variante, le circuit intégré peut maintenir la résistance, la résistivité, la capacité, l'inductance, etc. du composant à l'intérieur d'une gamme étroite, afin d'établir un composant haute précision indépendamment des modifications du milieu ambiant (température, pression, humidité, etc.)
PCT/US2000/032198 1999-11-22 2000-11-22 Boitier actif pour circuit integre WO2001039252A2 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
AU16283/01A AU1628301A (en) 1999-11-22 2000-11-22 Active package for integrated circuit
CA002392273A CA2392273C (fr) 1999-11-22 2000-11-22 Boitier actif pour circuit integre
KR1020027006515A KR20020070437A (ko) 1999-11-22 2000-11-22 집적 회로용 능동 패키지
EP00978869A EP1234321A1 (fr) 1999-11-22 2000-11-22 Boitier actif pour circuit integre
IL14981400A IL149814A0 (en) 1999-11-22 2000-11-22 Active package for integrated circuit
JP2001540823A JP2003515924A (ja) 1999-11-22 2000-11-22 集積回路用アクティブパッケージ

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16682399P 1999-11-22 1999-11-22
US60/166,823 1999-11-22

Publications (3)

Publication Number Publication Date
WO2001039252A2 WO2001039252A2 (fr) 2001-05-31
WO2001039252A3 true WO2001039252A3 (fr) 2002-07-11
WO2001039252A9 WO2001039252A9 (fr) 2002-09-26

Family

ID=22604828

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2000/032198 WO2001039252A2 (fr) 1999-11-22 2000-11-22 Boitier actif pour circuit integre

Country Status (8)

Country Link
EP (1) EP1234321A1 (fr)
JP (1) JP2003515924A (fr)
KR (1) KR20020070437A (fr)
CN (1) CN100385664C (fr)
AU (1) AU1628301A (fr)
CA (1) CA2392273C (fr)
IL (1) IL149814A0 (fr)
WO (1) WO2001039252A2 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6812566B2 (en) 2002-01-02 2004-11-02 Intel Corporation Lower profile package with power supply in package
US7557433B2 (en) 2004-10-25 2009-07-07 Mccain Joseph H Microelectronic device with integrated energy source
US7230321B2 (en) 2003-10-13 2007-06-12 Mccain Joseph Integrated circuit package with laminated power cell having coplanar electrode
KR100541655B1 (ko) 2004-01-07 2006-01-11 삼성전자주식회사 패키지 회로기판 및 이를 이용한 패키지
KR100963199B1 (ko) * 2008-06-11 2010-06-14 전자부품연구원 능동 소자 칩 내장형 기판 및 그의 제조 방법
US10354943B1 (en) * 2018-07-12 2019-07-16 Infineon Technologies Ag Multi-branch terminal for integrated circuit (IC) package
CN109906003B (zh) * 2019-04-16 2021-04-16 常州信息职业技术学院 弹性夹持式集成电路封装装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4249196A (en) * 1978-08-21 1981-02-03 Burroughs Corporation Integrated circuit module with integral capacitor
US4639826A (en) * 1983-06-03 1987-01-27 Compagnie D'informatique Militaire, Spatiale Et Aeronautique Radiation-hardened casing for an electronic component
US4714981A (en) * 1986-04-09 1987-12-22 Rca Corporation Cover for a semiconductor package
EP0434298A1 (fr) * 1989-12-21 1991-06-26 International Business Machines Corporation Bloc de composants électroniques thermiquement renforcés
WO1999052168A1 (fr) * 1998-04-02 1999-10-14 The Procter & Gamble Company Pile primaire munie d'un controleur integre (convertisseur continu/continu) pouvant prolonger la duree de vie de la pile

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4249196A (en) * 1978-08-21 1981-02-03 Burroughs Corporation Integrated circuit module with integral capacitor
US4639826A (en) * 1983-06-03 1987-01-27 Compagnie D'informatique Militaire, Spatiale Et Aeronautique Radiation-hardened casing for an electronic component
US4714981A (en) * 1986-04-09 1987-12-22 Rca Corporation Cover for a semiconductor package
EP0434298A1 (fr) * 1989-12-21 1991-06-26 International Business Machines Corporation Bloc de composants électroniques thermiquement renforcés
WO1999052168A1 (fr) * 1998-04-02 1999-10-14 The Procter & Gamble Company Pile primaire munie d'un controleur integre (convertisseur continu/continu) pouvant prolonger la duree de vie de la pile

Also Published As

Publication number Publication date
IL149814A0 (en) 2002-11-10
CN100385664C (zh) 2008-04-30
CA2392273C (fr) 2007-05-01
JP2003515924A (ja) 2003-05-07
KR20020070437A (ko) 2002-09-09
WO2001039252A2 (fr) 2001-05-31
EP1234321A1 (fr) 2002-08-28
CN1425198A (zh) 2003-06-18
CA2392273A1 (fr) 2001-05-31
AU1628301A (en) 2001-06-04
WO2001039252A9 (fr) 2002-09-26

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