KR20020070437A - 집적 회로용 능동 패키지 - Google Patents

집적 회로용 능동 패키지 Download PDF

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Publication number
KR20020070437A
KR20020070437A KR1020027006515A KR20027006515A KR20020070437A KR 20020070437 A KR20020070437 A KR 20020070437A KR 1020027006515 A KR1020027006515 A KR 1020027006515A KR 20027006515 A KR20027006515 A KR 20027006515A KR 20020070437 A KR20020070437 A KR 20020070437A
Authority
KR
South Korea
Prior art keywords
package
integrated circuit
capacitor
capacitors
terminal
Prior art date
Application number
KR1020027006515A
Other languages
English (en)
Korean (ko)
Inventor
네브리기치드라간다닐로
예브티치밀란마르셀
황초우치
커켄달윌리엄
Original Assignee
더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 filed Critical 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈
Publication of KR20020070437A publication Critical patent/KR20020070437A/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/647—Resistive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/642—Capacitive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/645—Inductive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Dc-Dc Converters (AREA)
  • Filters And Equalizers (AREA)
  • Semiconductor Integrated Circuits (AREA)
KR1020027006515A 1999-11-22 2000-11-22 집적 회로용 능동 패키지 KR20020070437A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16682399P 1999-11-22 1999-11-22
US60/166,823 1999-11-22
PCT/US2000/032198 WO2001039252A2 (fr) 1999-11-22 2000-11-22 Boitier actif pour circuit integre

Publications (1)

Publication Number Publication Date
KR20020070437A true KR20020070437A (ko) 2002-09-09

Family

ID=22604828

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020027006515A KR20020070437A (ko) 1999-11-22 2000-11-22 집적 회로용 능동 패키지

Country Status (8)

Country Link
EP (1) EP1234321A1 (fr)
JP (1) JP2003515924A (fr)
KR (1) KR20020070437A (fr)
CN (1) CN100385664C (fr)
AU (1) AU1628301A (fr)
CA (1) CA2392273C (fr)
IL (1) IL149814A0 (fr)
WO (1) WO2001039252A2 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7663221B2 (en) 2004-01-07 2010-02-16 Samsung Electronics Co., Ltd. Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same
KR100963199B1 (ko) * 2008-06-11 2010-06-14 전자부품연구원 능동 소자 칩 내장형 기판 및 그의 제조 방법

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6812566B2 (en) 2002-01-02 2004-11-02 Intel Corporation Lower profile package with power supply in package
US7557433B2 (en) 2004-10-25 2009-07-07 Mccain Joseph H Microelectronic device with integrated energy source
US7230321B2 (en) 2003-10-13 2007-06-12 Mccain Joseph Integrated circuit package with laminated power cell having coplanar electrode
US10354943B1 (en) * 2018-07-12 2019-07-16 Infineon Technologies Ag Multi-branch terminal for integrated circuit (IC) package
CN109906003B (zh) * 2019-04-16 2021-04-16 常州信息职业技术学院 弹性夹持式集成电路封装装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4249196A (en) * 1978-08-21 1981-02-03 Burroughs Corporation Integrated circuit module with integral capacitor
FR2547113B1 (fr) * 1983-06-03 1986-11-07 Inf Milit Spatiale Aeronaut Boitier d'encapsulation de composant electronique, durci vis-a-vis des radiations
US4714981A (en) * 1986-04-09 1987-12-22 Rca Corporation Cover for a semiconductor package
US4978638A (en) * 1989-12-21 1990-12-18 International Business Machines Corporation Method for attaching heat sink to plastic packaged electronic component
US6198250B1 (en) * 1998-04-02 2001-03-06 The Procter & Gamble Company Primary battery having a built-in controller to extend battery run time

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7663221B2 (en) 2004-01-07 2010-02-16 Samsung Electronics Co., Ltd. Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same
KR100963199B1 (ko) * 2008-06-11 2010-06-14 전자부품연구원 능동 소자 칩 내장형 기판 및 그의 제조 방법

Also Published As

Publication number Publication date
WO2001039252A2 (fr) 2001-05-31
JP2003515924A (ja) 2003-05-07
CN100385664C (zh) 2008-04-30
WO2001039252A3 (fr) 2002-07-11
CN1425198A (zh) 2003-06-18
CA2392273A1 (fr) 2001-05-31
IL149814A0 (en) 2002-11-10
CA2392273C (fr) 2007-05-01
AU1628301A (en) 2001-06-04
EP1234321A1 (fr) 2002-08-28
WO2001039252A9 (fr) 2002-09-26

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