SG75820A1 - Coating apparatus - Google Patents

Coating apparatus

Info

Publication number
SG75820A1
SG75820A1 SG1997004611A SG1997004611A SG75820A1 SG 75820 A1 SG75820 A1 SG 75820A1 SG 1997004611 A SG1997004611 A SG 1997004611A SG 1997004611 A SG1997004611 A SG 1997004611A SG 75820 A1 SG75820 A1 SG 75820A1
Authority
SG
Singapore
Prior art keywords
coating apparatus
coating
Prior art date
Application number
SG1997004611A
Other languages
English (en)
Inventor
Takahiro Kitano
Katsuya Okumura
Shinichi Ito
Original Assignee
Tokyo Electro Ltd
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electro Ltd, Toshiba Kk filed Critical Tokyo Electro Ltd
Publication of SG75820A1 publication Critical patent/SG75820A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/2496—Self-proportioning or correlating systems
    • Y10T137/2499—Mixture condition maintaining or sensing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/87571—Multiple inlet with single outlet
    • Y10T137/87652—With means to promote mixing or combining of plural fluids
    • Y10T137/8766—With selectively operated flow control means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/87571—Multiple inlet with single outlet
    • Y10T137/87652—With means to promote mixing or combining of plural fluids
    • Y10T137/8766—With selectively operated flow control means
    • Y10T137/87668—Single actuator operates plural flow control means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/87571—Multiple inlet with single outlet
    • Y10T137/87676—With flow control
    • Y10T137/87684—Valve in each inlet

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
SG1997004611A 1996-12-25 1997-12-22 Coating apparatus SG75820A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP34607796 1996-12-25
JP27012697A JP3333121B2 (ja) 1996-12-25 1997-10-02 塗布装置

Publications (1)

Publication Number Publication Date
SG75820A1 true SG75820A1 (en) 2000-10-24

Family

ID=26549074

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1997004611A SG75820A1 (en) 1996-12-25 1997-12-22 Coating apparatus

Country Status (7)

Country Link
US (1) US6059880A (ko)
EP (1) EP0851302B1 (ko)
JP (1) JP3333121B2 (ko)
KR (1) KR100375037B1 (ko)
DE (1) DE69702291T2 (ko)
SG (1) SG75820A1 (ko)
TW (1) TW414962B (ko)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3410342B2 (ja) * 1997-01-31 2003-05-26 東京エレクトロン株式会社 塗布装置
JP2000189880A (ja) * 1998-12-28 2000-07-11 Canon Inc 塗布方法および装置ならびにカラ―フィルタの製造方法
JP3697389B2 (ja) 1999-09-27 2005-09-21 株式会社東芝 液膜形成方法及び塗布膜形成方法
US7125584B2 (en) * 1999-09-27 2006-10-24 Kabushiki Kaisha Toshiba Method for forming a liquid film on a substrate
EP1124252A2 (en) * 2000-02-10 2001-08-16 Applied Materials, Inc. Apparatus and process for processing substrates
TWI228755B (en) * 2000-02-17 2005-03-01 Toshiba Corp Chemical liquid processing apparatus and the method thereof
JP2001230191A (ja) * 2000-02-18 2001-08-24 Tokyo Electron Ltd 処理液供給方法及び処理液供給装置
US7905653B2 (en) * 2001-07-31 2011-03-15 Mega Fluid Systems, Inc. Method and apparatus for blending process materials
JP2002239434A (ja) * 2001-02-14 2002-08-27 Tokyo Electron Ltd 塗布膜形成装置および塗布膜形成方法
JP3704054B2 (ja) * 2001-05-01 2005-10-05 東京エレクトロン株式会社 処理液の濃度を変更する方法及び処理液供給装置
KR100857972B1 (ko) * 2001-06-07 2008-09-10 도쿄엘렉트론가부시키가이샤 도포막 형성방법 및 도포막 형성장치
JP3869306B2 (ja) 2001-08-28 2007-01-17 東京エレクトロン株式会社 現像処理方法および現像液塗布装置
US7041172B2 (en) * 2003-02-20 2006-05-09 Asml Holding N.V. Methods and apparatus for dispensing semiconductor processing solutions with multi-syringe fluid delivery systems
TW569969U (en) * 2003-05-01 2004-01-01 Shi-Tsai Chen Airtight type pressure storage apparatus
JP3988676B2 (ja) * 2003-05-01 2007-10-10 セイコーエプソン株式会社 塗布装置、薄膜の形成方法、薄膜形成装置及び半導体装置の製造方法
US7152815B2 (en) * 2003-06-04 2006-12-26 Nordson Corporation Dispensing system, nozzle and method for independently dispensing and controlling liquid
US7078355B2 (en) * 2003-12-29 2006-07-18 Asml Holding N.V. Method and system of coating polymer solution on surface of a substrate
JP4554236B2 (ja) * 2004-03-08 2010-09-29 東京エレクトロン株式会社 液供給機構および液供給方法
US7651306B2 (en) 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US7819079B2 (en) 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7699021B2 (en) 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization
US20060130767A1 (en) 2004-12-22 2006-06-22 Applied Materials, Inc. Purged vacuum chuck with proximity pins
JP4523517B2 (ja) * 2005-08-09 2010-08-11 東京エレクトロン株式会社 塗布処理装置および塗布処理方法、ならびにコンピュータ読み取可能な記憶媒体
JP4704228B2 (ja) * 2005-09-06 2011-06-15 東京応化工業株式会社 レジスト液供給装置及び当該レジスト液供給装置を得るための改造キット
JP4514224B2 (ja) * 2005-09-28 2010-07-28 東京エレクトロン株式会社 リンス処理方法、現像処理方法及び現像装置
JP4901191B2 (ja) * 2005-11-18 2012-03-21 東京応化工業株式会社 レジスト希釈システム
US20070187531A1 (en) * 2006-02-14 2007-08-16 The U.S. Of America As Represented By The Secretary Of The Navy Apparatus and method to amalgamate substances
JP5069550B2 (ja) * 2007-05-17 2012-11-07 大日本スクリーン製造株式会社 塗布装置
SG176676A1 (en) * 2009-06-10 2012-01-30 Advanced Tech Materials Fluid processing systems and methods
US8567437B2 (en) * 2009-11-05 2013-10-29 J-Lok Co. Multi-speed resin cartridge production system
JP4832576B2 (ja) * 2010-04-12 2011-12-07 東京エレクトロン株式会社 塗布処理装置
CN102294317A (zh) * 2010-06-28 2011-12-28 无锡华润上华半导体有限公司 光刻胶喷涂装置及方法
TWI585908B (zh) * 2010-11-25 2017-06-01 山田尖端科技股份有限公司 樹脂模塑裝置與樹脂模塑方法
CN102527574A (zh) * 2010-12-08 2012-07-04 无锡华润上华科技有限公司 光刻胶喷涂装置及其方法
JP6425719B2 (ja) * 2013-10-11 2018-11-21 トランジションズ オプティカル， インコーポレイテッド 光学基材に複数コーティングを塗布するためのスピンコーター
JP2015115486A (ja) * 2013-12-12 2015-06-22 東京エレクトロン株式会社 液供給装置
TWI585539B (zh) 2014-05-15 2017-06-01 東京威力科創股份有限公司 用以在光阻分配系統中增進再循環及過濾的方法及設備
JP7050140B1 (ja) * 2020-12-21 2022-04-07 株式会社デンソーテン 調合装置および調合方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3806037A (en) * 1972-12-01 1974-04-23 Hanson Equipment Co Selective fluid discharge system and control valve means therefor
US5254367A (en) * 1989-07-06 1993-10-19 Tokyo Electron Limited Coating method and apparatus
JPH04209520A (ja) * 1990-12-04 1992-07-30 Mitsubishi Electric Corp 回転塗布装置
US5407267A (en) * 1992-12-30 1995-04-18 Nordson Corporation Method and apparatus for forming and dispensing coating material containing multiple components
SG93216A1 (en) * 1993-03-25 2002-12-17 Tokyo Electron Ltd Method of forming coating film and apparatus therefor
JPH06348023A (ja) * 1993-06-03 1994-12-22 Nippon Kayaku Co Ltd 顔料を含むカラーフィルター用レジストの塗布方法
JP3659668B2 (ja) * 1994-08-25 2005-06-15 オリンパス株式会社 ぶれ補正機能テストモード付カメラ
US5478435A (en) * 1994-12-16 1995-12-26 National Semiconductor Corp. Point of use slurry dispensing system

Also Published As

Publication number Publication date
DE69702291T2 (de) 2001-02-08
DE69702291D1 (de) 2000-07-20
JPH10242045A (ja) 1998-09-11
KR100375037B1 (ko) 2003-05-09
JP3333121B2 (ja) 2002-10-07
TW414962B (en) 2000-12-11
EP0851302A1 (en) 1998-07-01
US6059880A (en) 2000-05-09
EP0851302B1 (en) 2000-06-14
KR19980064625A (ko) 1998-10-07

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