SG74713A1 - Cyanate ester based thermoset compositions - Google Patents
Cyanate ester based thermoset compositionsInfo
- Publication number
- SG74713A1 SG74713A1 SG1999001388A SG1999001388A SG74713A1 SG 74713 A1 SG74713 A1 SG 74713A1 SG 1999001388 A SG1999001388 A SG 1999001388A SG 1999001388 A SG1999001388 A SG 1999001388A SG 74713 A1 SG74713 A1 SG 74713A1
- Authority
- SG
- Singapore
- Prior art keywords
- cyanate ester
- ester based
- thermoset compositions
- based thermoset
- compositions
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/0622—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
- C08G73/0638—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with at least three nitrogen atoms in the ring
- C08G73/065—Preparatory processes
- C08G73/0655—Preparatory processes from polycyanurates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/0622—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
- C08G73/0638—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with at least three nitrogen atoms in the ring
- C08G73/065—Preparatory processes
- C08G73/0655—Preparatory processes from polycyanurates
- C08G73/0661—Preparatory processes from polycyanurates characterised by the catalyst used
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/046,278 US6194495B1 (en) | 1998-03-23 | 1998-03-23 | Cyanate ester based thermoset compositions |
US09/096,323 US6162876A (en) | 1998-03-23 | 1998-06-11 | Cyanate ester based thermoset compositions |
Publications (1)
Publication Number | Publication Date |
---|---|
SG74713A1 true SG74713A1 (en) | 2000-08-22 |
Family
ID=21942589
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1999001388A SG74713A1 (en) | 1998-03-23 | 1999-03-19 | Cyanate ester based thermoset compositions |
Country Status (7)
Country | Link |
---|---|
US (1) | US6194495B1 (fr) |
EP (1) | EP0945477B1 (fr) |
JP (1) | JPH11322924A (fr) |
CN (1) | CN1244610C (fr) |
DE (1) | DE69920308T2 (fr) |
ES (1) | ES2229629T3 (fr) |
SG (1) | SG74713A1 (fr) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6245841B1 (en) * | 1998-03-23 | 2001-06-12 | General Electric Company | Cyanate ester based thermoset compositions |
US7022777B2 (en) * | 2001-06-28 | 2006-04-04 | General Electric | Moldable poly(arylene ether) thermosetting compositions, methods, and articles |
US6709738B2 (en) | 2001-10-15 | 2004-03-23 | 3M Innovative Properties Company | Coated substrate with energy curable cyanate resin |
EP1542013B1 (fr) * | 2002-06-24 | 2016-04-13 | Fujirebio Inc. | Intensificateur de chimiluminescence |
US7071266B2 (en) * | 2003-01-17 | 2006-07-04 | Mitsubishi Gas Chemical Company, Inc. | Curable resin composition and cured product thereof |
US20070004902A1 (en) * | 2005-05-25 | 2007-01-04 | Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. | Triazine Containing Polymers |
DE102006022372A1 (de) * | 2006-05-12 | 2007-11-15 | Airbus Deutschland Gmbh | Flammfeste, niedrigtemperaturhärtende, cyanatbasierte Prepregharze für Honeycomb-Sandwichbauteile mit exzellenten Oberflächen |
WO2009018194A1 (fr) * | 2007-08-02 | 2009-02-05 | Dow Global Technologies Inc. | Matériau amortisseur thermodurcissable |
JP5022265B2 (ja) * | 2008-02-18 | 2012-09-12 | パナソニック株式会社 | 透明積層板 |
DE102008013231A1 (de) * | 2008-03-07 | 2009-09-10 | Robert Bosch Gmbh | Härtbares Reaktionsharzsystem |
CN102300936B (zh) * | 2009-03-16 | 2014-03-12 | 东丽株式会社 | 纤维增强树脂组合物、成型材料及纤维增强树脂组合物的制造方法 |
DE102009003132A1 (de) * | 2009-05-15 | 2010-11-18 | Robert Bosch Gmbh | Kunststoffformmasse sowie Verfahren zu deren Herstellung |
US8283408B2 (en) * | 2010-02-26 | 2012-10-09 | Hexcel Corporation | Thermoplastic-toughened cyanate ester resin composites with low heat release properties |
WO2013115069A1 (fr) * | 2012-01-31 | 2013-08-08 | 三菱瓦斯化学株式会社 | Composition de résine pour une matière de carte de circuit imprimé, et préimprégné, feuille de résine, stratifié plaqué par une feuille de métal et carte de circuit imprimé les utilisant |
WO2014197827A1 (fr) | 2013-06-06 | 2014-12-11 | Halliburton Energy Services, Inc. | Outil d'étanchéité de puits pouvant être changé |
EP3298081A1 (fr) * | 2015-05-18 | 2018-03-28 | SABIC Global Technologies B.V. | Compositions de résistance diélectrique améliorée |
CN108264763B (zh) * | 2016-12-30 | 2020-03-20 | 比亚迪股份有限公司 | 氰酸酯树脂原料组合物和氰酸酯树脂以及氰酸酯树脂金属复合材料和其制备方法 |
CN109486185B (zh) * | 2018-12-10 | 2021-05-25 | 苏州大学 | 芳纶纤维增强氰酸酯复合材料 |
CN109679342B (zh) * | 2018-12-25 | 2021-05-25 | 苏州大学 | 阻燃氰酸酯热压板 |
CN111786102A (zh) * | 2019-04-03 | 2020-10-16 | 莱尔德电子材料(深圳)有限公司 | 低介电、低损耗天线罩 |
CN110204723B (zh) * | 2019-07-02 | 2021-07-30 | 西北师范大学 | 一种耐热性聚苯硫醚的制备方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2612312A1 (de) | 1976-03-23 | 1977-09-29 | Bayer Ag | Formmassen aus mischungen halogenhaltiger und halogenfreier, polyfunktioneller, aromatischer cyansaeureester |
DE2628631C2 (de) | 1976-06-25 | 1984-10-11 | Bayer Ag, 5090 Leverkusen | Formmassen aus Mischungen von polyfunktionellen aromatischen Cyansäureestern und halogenhaltigen aromatischen Polykohlensäureestern |
US4389516A (en) | 1980-03-24 | 1983-06-21 | Mitsubishi Gas Chemical Company, Inc. | Curable polyphenylene ether resin composition |
JPS57143320A (en) | 1981-02-28 | 1982-09-04 | Mitsubishi Gas Chem Co Inc | Novel curable resin composition |
JPS5857921A (ja) * | 1981-10-02 | 1983-04-06 | Mitsubishi Gas Chem Co Inc | 新規なポリフェニレンエーテル系樹脂フィルム及びその製造法 |
US4604452A (en) | 1985-10-21 | 1986-08-05 | Celanese Corporation | Metal carboxylate/alkylphenol curing catalyst for polycyanate esters of polyhydric phenols |
US4902752A (en) | 1987-10-05 | 1990-02-20 | Hi-Tek Polymers, Inc. | Polycyanate esters of polyhydric phenols blended with thermoplastic polymers |
US4983683A (en) | 1987-10-05 | 1991-01-08 | Hi-Tek Polymers, Inc. | Polycyanate esters of polyhydric phenols blended with thermoplastic polymers |
US5162450A (en) * | 1989-02-17 | 1992-11-10 | General Electric Company | Curable dielectric polyphenylene ether-polyepoxide compositions |
US5143785A (en) | 1990-08-20 | 1992-09-01 | Minnesota Mining And Manufacturing Company | Cyanate ester adhesives for electronic applications |
JP2524453B2 (ja) | 1992-06-12 | 1996-08-14 | 住友ベークライト株式会社 | 熱硬化性樹脂組成物 |
JPH06228308A (ja) * | 1992-12-29 | 1994-08-16 | Internatl Business Mach Corp <Ibm> | トリアジン重合体およびその使用 |
JP3238222B2 (ja) * | 1993-01-19 | 2001-12-10 | 住友ベークライト株式会社 | 低誘電率熱硬化性樹脂組成物 |
JP3006366B2 (ja) * | 1993-09-22 | 2000-02-07 | 松下電工株式会社 | ポリフェニレンオキサイド樹脂組成物、プリプレグ及び積層板 |
JPH08253582A (ja) | 1995-01-20 | 1996-10-01 | Sumitomo Chem Co Ltd | 熱硬化性樹脂組成物および銅張り積層板 |
EP0889096B1 (fr) | 1997-07-04 | 2002-09-11 | Hitachi Chemical Company, Ltd. | Composition de résine durcissable modifiée par un ester de cyanate, un vernis, un préimprégné, une plaque laminée et recouverte de métal, un film, une plaque à circuits imprimés produit à partir de ceci |
JP3315631B2 (ja) * | 1997-10-23 | 2002-08-19 | 日立化成工業株式会社 | 難燃性変性シアネートエステル系樹脂フィルム及びその製造方法 |
-
1998
- 1998-03-23 US US09/046,278 patent/US6194495B1/en not_active Expired - Lifetime
-
1999
- 1999-02-23 CN CNB991023714A patent/CN1244610C/zh not_active Expired - Fee Related
- 1999-03-12 EP EP99301917A patent/EP0945477B1/fr not_active Expired - Lifetime
- 1999-03-12 ES ES99301917T patent/ES2229629T3/es not_active Expired - Lifetime
- 1999-03-12 DE DE69920308T patent/DE69920308T2/de not_active Expired - Lifetime
- 1999-03-19 JP JP11074707A patent/JPH11322924A/ja active Pending
- 1999-03-19 SG SG1999001388A patent/SG74713A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN1244610C (zh) | 2006-03-08 |
EP0945477A1 (fr) | 1999-09-29 |
DE69920308D1 (de) | 2004-10-28 |
CN1229817A (zh) | 1999-09-29 |
ES2229629T3 (es) | 2005-04-16 |
DE69920308T2 (de) | 2005-09-29 |
JPH11322924A (ja) | 1999-11-26 |
EP0945477B1 (fr) | 2004-09-22 |
US6194495B1 (en) | 2001-02-27 |
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