DE69920308D1 - Wärmehärtbare Zusammensetzungen auf Basis von Cyanatestern - Google Patents

Wärmehärtbare Zusammensetzungen auf Basis von Cyanatestern

Info

Publication number
DE69920308D1
DE69920308D1 DE69920308T DE69920308T DE69920308D1 DE 69920308 D1 DE69920308 D1 DE 69920308D1 DE 69920308 T DE69920308 T DE 69920308T DE 69920308 T DE69920308 T DE 69920308T DE 69920308 D1 DE69920308 D1 DE 69920308D1
Authority
DE
Germany
Prior art keywords
compositions based
cyanate esters
thermosetting compositions
thermosetting
cyanate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69920308T
Other languages
English (en)
Other versions
DE69920308T2 (de
Inventor
Gary William Yeager
Yiqun Pan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SABIC Global Technologies BV
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/096,323 external-priority patent/US6162876A/en
Application filed by General Electric Co filed Critical General Electric Co
Application granted granted Critical
Publication of DE69920308D1 publication Critical patent/DE69920308D1/de
Publication of DE69920308T2 publication Critical patent/DE69920308T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/0622—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
    • C08G73/0638—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with at least three nitrogen atoms in the ring
    • C08G73/065—Preparatory processes
    • C08G73/0655—Preparatory processes from polycyanurates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/0622—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
    • C08G73/0638—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with at least three nitrogen atoms in the ring
    • C08G73/065—Preparatory processes
    • C08G73/0655—Preparatory processes from polycyanurates
    • C08G73/0661—Preparatory processes from polycyanurates characterised by the catalyst used
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
DE69920308T 1998-03-23 1999-03-12 Wärmehärtbare Zusammensetzungen auf Basis von Cyanatestern Expired - Lifetime DE69920308T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US09/046,278 US6194495B1 (en) 1998-03-23 1998-03-23 Cyanate ester based thermoset compositions
US46278 1998-03-23
US09/096,323 US6162876A (en) 1998-03-23 1998-06-11 Cyanate ester based thermoset compositions
US96323 1998-06-11

Publications (2)

Publication Number Publication Date
DE69920308D1 true DE69920308D1 (de) 2004-10-28
DE69920308T2 DE69920308T2 (de) 2005-09-29

Family

ID=21942589

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69920308T Expired - Lifetime DE69920308T2 (de) 1998-03-23 1999-03-12 Wärmehärtbare Zusammensetzungen auf Basis von Cyanatestern

Country Status (7)

Country Link
US (1) US6194495B1 (de)
EP (1) EP0945477B1 (de)
JP (1) JPH11322924A (de)
CN (1) CN1244610C (de)
DE (1) DE69920308T2 (de)
ES (1) ES2229629T3 (de)
SG (1) SG74713A1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6245841B1 (en) * 1998-03-23 2001-06-12 General Electric Company Cyanate ester based thermoset compositions
US7022777B2 (en) * 2001-06-28 2006-04-04 General Electric Moldable poly(arylene ether) thermosetting compositions, methods, and articles
US6709738B2 (en) 2001-10-15 2004-03-23 3M Innovative Properties Company Coated substrate with energy curable cyanate resin
JP4434015B2 (ja) * 2002-06-24 2010-03-17 富士レビオ株式会社 化学発光増強剤
US7071266B2 (en) 2003-01-17 2006-07-04 Mitsubishi Gas Chemical Company, Inc. Curable resin composition and cured product thereof
US20070004902A1 (en) * 2005-05-25 2007-01-04 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. Triazine Containing Polymers
DE102006022372A1 (de) * 2006-05-12 2007-11-15 Airbus Deutschland Gmbh Flammfeste, niedrigtemperaturhärtende, cyanatbasierte Prepregharze für Honeycomb-Sandwichbauteile mit exzellenten Oberflächen
EP2176355A1 (de) * 2007-08-02 2010-04-21 Dow Global Technologies Inc. Dämpfender duroplast
JP5022265B2 (ja) * 2008-02-18 2012-09-12 パナソニック株式会社 透明積層板
DE102008013231A1 (de) 2008-03-07 2009-09-10 Robert Bosch Gmbh Härtbares Reaktionsharzsystem
KR101654389B1 (ko) * 2009-03-16 2016-09-05 도레이 카부시키가이샤 섬유강화 수지조성물, 성형재료 및 섬유강화 수지조성물의 제조방법
DE102009003132A1 (de) * 2009-05-15 2010-11-18 Robert Bosch Gmbh Kunststoffformmasse sowie Verfahren zu deren Herstellung
US8283408B2 (en) * 2010-02-26 2012-10-09 Hexcel Corporation Thermoplastic-toughened cyanate ester resin composites with low heat release properties
JP6065845B2 (ja) * 2012-01-31 2017-01-25 三菱瓦斯化学株式会社 プリント配線板材料用樹脂組成物、並びにそれを用いたプリプレグ、樹脂シート、金属箔張積層板及びプリント配線板
US9677372B2 (en) 2013-06-06 2017-06-13 Halliburton Energy Services, Inc. Well system cementing plug
CN107683307A (zh) * 2015-05-18 2018-02-09 沙特基础工业全球技术公司 改进的介电强度的组合物
CN108264763B (zh) * 2016-12-30 2020-03-20 比亚迪股份有限公司 氰酸酯树脂原料组合物和氰酸酯树脂以及氰酸酯树脂金属复合材料和其制备方法
CN109486185B (zh) * 2018-12-10 2021-05-25 苏州大学 芳纶纤维增强氰酸酯复合材料
CN109679342B (zh) * 2018-12-25 2021-05-25 苏州大学 阻燃氰酸酯热压板
CN210182571U (zh) * 2019-04-03 2020-03-24 莱尔德电子材料(深圳)有限公司 低介电、低损耗天线罩
CN110204723B (zh) * 2019-07-02 2021-07-30 西北师范大学 一种耐热性聚苯硫醚的制备方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2612312A1 (de) 1976-03-23 1977-09-29 Bayer Ag Formmassen aus mischungen halogenhaltiger und halogenfreier, polyfunktioneller, aromatischer cyansaeureester
DE2628631C2 (de) 1976-06-25 1984-10-11 Bayer Ag, 5090 Leverkusen Formmassen aus Mischungen von polyfunktionellen aromatischen Cyansäureestern und halogenhaltigen aromatischen Polykohlensäureestern
US4389516A (en) 1980-03-24 1983-06-21 Mitsubishi Gas Chemical Company, Inc. Curable polyphenylene ether resin composition
JPS57143320A (en) 1981-02-28 1982-09-04 Mitsubishi Gas Chem Co Inc Novel curable resin composition
JPS5857921A (ja) * 1981-10-02 1983-04-06 Mitsubishi Gas Chem Co Inc 新規なポリフェニレンエーテル系樹脂フィルム及びその製造法
US4604452A (en) 1985-10-21 1986-08-05 Celanese Corporation Metal carboxylate/alkylphenol curing catalyst for polycyanate esters of polyhydric phenols
US4983683A (en) 1987-10-05 1991-01-08 Hi-Tek Polymers, Inc. Polycyanate esters of polyhydric phenols blended with thermoplastic polymers
US4902752A (en) 1987-10-05 1990-02-20 Hi-Tek Polymers, Inc. Polycyanate esters of polyhydric phenols blended with thermoplastic polymers
US5162450A (en) * 1989-02-17 1992-11-10 General Electric Company Curable dielectric polyphenylene ether-polyepoxide compositions
US5143785A (en) 1990-08-20 1992-09-01 Minnesota Mining And Manufacturing Company Cyanate ester adhesives for electronic applications
JP2524453B2 (ja) 1992-06-12 1996-08-14 住友ベークライト株式会社 熱硬化性樹脂組成物
JPH06228308A (ja) * 1992-12-29 1994-08-16 Internatl Business Mach Corp <Ibm> トリアジン重合体およびその使用
JP3238222B2 (ja) * 1993-01-19 2001-12-10 住友ベークライト株式会社 低誘電率熱硬化性樹脂組成物
JP3006366B2 (ja) * 1993-09-22 2000-02-07 松下電工株式会社 ポリフェニレンオキサイド樹脂組成物、プリプレグ及び積層板
JPH08253582A (ja) 1995-01-20 1996-10-01 Sumitomo Chem Co Ltd 熱硬化性樹脂組成物および銅張り積層板
JP3315631B2 (ja) * 1997-10-23 2002-08-19 日立化成工業株式会社 難燃性変性シアネートエステル系樹脂フィルム及びその製造方法
DE69807793T2 (de) 1997-07-04 2003-08-14 Hitachi Chemical Co., Ltd. Mit einem Cyanatester modifizierte härtbare Harzzusammensetzung und daraus hergestellter Lack, Prepreg, mit Metall bedeckte Schichtplatte, Film, gedruckte Leiterplatte und Mehrschichtleiterplatte

Also Published As

Publication number Publication date
DE69920308T2 (de) 2005-09-29
US6194495B1 (en) 2001-02-27
CN1244610C (zh) 2006-03-08
JPH11322924A (ja) 1999-11-26
CN1229817A (zh) 1999-09-29
EP0945477A1 (de) 1999-09-29
SG74713A1 (en) 2000-08-22
ES2229629T3 (es) 2005-04-16
EP0945477B1 (de) 2004-09-22

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: SABIC INNOVATIVE PLASTICS IP B.V., BERGEN OP Z, NL

8328 Change in the person/name/address of the agent

Representative=s name: PATENT- UND RECHTSANWAELTE BARDEHLE, PAGENBERG, DO