SG74567A1 - Low dielectric resin composition - Google Patents

Low dielectric resin composition

Info

Publication number
SG74567A1
SG74567A1 SG1996010670A SG1996010670A SG74567A1 SG 74567 A1 SG74567 A1 SG 74567A1 SG 1996010670 A SG1996010670 A SG 1996010670A SG 1996010670 A SG1996010670 A SG 1996010670A SG 74567 A1 SG74567 A1 SG 74567A1
Authority
SG
Singapore
Prior art keywords
resin composition
low dielectric
dielectric resin
low
composition
Prior art date
Application number
SG1996010670A
Other languages
English (en)
Inventor
Hiroyuki Morishima
Shunsuke Yokotsuka
Aya Serita
Ko Aosaki
Ikuo Matsukura
Takenori Nartita
Shunichiro Uchimura
Original Assignee
Asahi Glass Co Ltd
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd, Hitachi Chemical Co Ltd filed Critical Asahi Glass Co Ltd
Publication of SG74567A1 publication Critical patent/SG74567A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/443—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds
    • H01B3/445—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds from vinylfluorides or other fluoroethylenic compounds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
    • Y10T428/31544—Addition polymer is perhalogenated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31667—Next to addition polymer from unsaturated monomers, or aldehyde or ketone condensation product

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Paints Or Removers (AREA)
  • Formation Of Insulating Films (AREA)
  • Organic Insulating Materials (AREA)
SG1996010670A 1995-09-21 1996-09-19 Low dielectric resin composition SG74567A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24322895 1995-09-21

Publications (1)

Publication Number Publication Date
SG74567A1 true SG74567A1 (en) 2000-08-22

Family

ID=17100749

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996010670A SG74567A1 (en) 1995-09-21 1996-09-19 Low dielectric resin composition

Country Status (8)

Country Link
US (1) US5905117A (de)
EP (1) EP0767467B1 (de)
JP (1) JPH09143420A (de)
KR (1) KR100428826B1 (de)
CN (1) CN1122078C (de)
DE (1) DE69618521T2 (de)
SG (1) SG74567A1 (de)
TW (1) TW420708B (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6660875B1 (en) 1998-06-09 2003-12-09 Ppt Technologies, Llc Ion exchange purification of dielectric condensate precursor fluids and silicate esters such as tetraethylorthosilicate (TEOS)
DE69907575T2 (de) 1998-07-03 2004-03-18 Asahi Glass Co., Ltd. Optischer Wellenleiter
US6639015B1 (en) 1998-09-01 2003-10-28 Catalysts & Chemicals Industries Co., Ltd. Coating liquid for forming a silica-containing film with a low-dielectric constant
US6391220B1 (en) * 1999-08-18 2002-05-21 Fujitsu Limited, Inc. Methods for fabricating flexible circuit structures
TWI260332B (en) * 1999-09-16 2006-08-21 Hitachi Chemical Co Ltd Compositions, methods of forming low dielectric coefficient film using the composition, low dielectric coefficient films, and electronic components having the film
US20040253462A1 (en) * 1999-09-16 2004-12-16 Hitachi Chemical Co., Ltd. Composition, methods for forming low-permittivity film using the composition, low-permittivity film, and electronic part having the low-permittivity film
EP1160848B1 (de) * 2000-05-22 2011-10-05 JSR Corporation Zusammensetzung für die Herstellung einer auf Silika basierenden Schicht
WO2002016477A2 (en) * 2000-08-21 2002-02-28 Dow Global Technologies Inc. Organosilicate resins as hardmasks for organic polymer dielectrics in fabrication of microelectronic devices
TW594395B (en) * 2000-09-29 2004-06-21 Nippon Zeon Co Photoresist composition for insulating film, insulating film for organic electroluminescent element, and process for producing the same
TW588072B (en) 2000-10-10 2004-05-21 Shipley Co Llc Antireflective porogens
JP3750532B2 (ja) * 2001-01-29 2006-03-01 株式会社村田製作所 薄膜回路基板及びその製造方法
US6455443B1 (en) * 2001-02-21 2002-09-24 International Business Machines Corporation Method of fabricating low-dielectric constant interlevel dielectric films for BEOL interconnects with enhanced adhesion and low-defect density
WO2003028070A2 (en) * 2001-09-27 2003-04-03 Henkel Corporation Compositions having controlled flowability and thermal properties
DE10162443A1 (de) * 2001-12-19 2003-07-03 Bayer Ag Verfahren zur Herstellung von dielektrischen Schichten unter Verwendung multifunktioneller Carbosilane
US7122880B2 (en) * 2002-05-30 2006-10-17 Air Products And Chemicals, Inc. Compositions for preparing low dielectric materials
US7307343B2 (en) * 2002-05-30 2007-12-11 Air Products And Chemicals, Inc. Low dielectric materials and methods for making same
KR100515583B1 (ko) * 2002-06-27 2005-09-20 주식회사 엘지화학 유기실리케이트 중합체 및 이를 함유하는 절연막
US6797643B2 (en) * 2002-10-23 2004-09-28 Applied Materials Inc. Plasma enhanced CVD low k carbon-doped silicon oxide film deposition using VHF-RF power
US6932092B2 (en) * 2002-11-22 2005-08-23 Applied Materials, Inc. Method for cleaning plasma enhanced chemical vapor deposition chamber using very high frequency energy
JP4179323B2 (ja) * 2003-01-27 2008-11-12 ダイキン工業株式会社 塗料組成物
DE602004014296D1 (de) * 2003-08-15 2008-07-17 Inst Tech Precision Elect Chromfreies Mittel zur Behandlung von Metalloberflächen
WO2007052664A1 (ja) * 2005-10-31 2007-05-10 Daikin Industries, Ltd. ポリテトラフルオロエチレンの成形方法、ポリテトラフルオロエチレン成形体、架橋性ポリテトラフルオロエチレン、ポリテトラフルオロエチレン架橋体粉末、樹脂ブレンド組成物、および樹脂ブレンド成形体
JP4493055B1 (ja) * 2009-07-17 2010-06-30 大日本塗料株式会社 塗料組成物
CA2887099C (en) * 2012-10-31 2020-10-06 Solvay Sa Process for manufacturing fluoropolymer hybrid composites
CN105418926B (zh) * 2014-09-12 2018-07-13 中国科学院上海高等研究院 一种含氟萘乙基硅树脂及其制备方法和应用
WO2017145823A1 (ja) * 2016-02-24 2017-08-31 旭硝子株式会社 塗布液組成物およびこれを用いた膜付き物品の製造方法
KR102449940B1 (ko) * 2016-10-05 2022-09-30 에이지씨 가부시키가이샤 함불소 중합체 함유 조성물 및 함불소 중합체막이 형성된 기재의 제조 방법

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0271876B1 (de) * 1986-12-19 1993-09-29 Asahi Glass Company Ltd. Beschichtungszusammensetzung und beschichtetes Produkt
CA2027109C (en) * 1989-02-10 2001-05-01 Toshiro Nanbu Thermosetting composition
CA2013949C (en) * 1989-04-06 1999-08-24 Toshiro Nambu Thermosetting composition
US5037917A (en) * 1989-06-09 1991-08-06 The Dow Chemical Company Perfluorocyclobutane ring-containing polymers
US5021602A (en) * 1989-06-09 1991-06-04 The Dow Chemical Company Reactive compounds containing perfluorocyclobutane rings
JP2801660B2 (ja) * 1989-07-21 1998-09-21 触媒化成工業株式会社 シリカ系被膜形成用塗布液の製造方法
DE69111699T2 (de) * 1990-06-01 1996-04-18 Asahi Glass Co Ltd Fluoropolymer-Überzugszusammensetzung und damit beschichteter Gegenstand.
JP3320440B2 (ja) * 1992-03-17 2002-09-03 触媒化成工業株式会社 被膜形成用塗布液およびその製造方法
US5360869A (en) * 1992-10-30 1994-11-01 University Of North Carolina At Chapel Hill Method of making fluorinated copolymers
JPH06322336A (ja) * 1993-05-11 1994-11-22 Asahi Glass Co Ltd 電子部品用接着剤及び物品
JPH07331178A (ja) * 1994-06-14 1995-12-19 Toray Ind Inc コーティング用組成物およびその製造方法
US5656555A (en) * 1995-02-17 1997-08-12 Texas Instruments Incorporated Modified hydrogen silsesquioxane spin-on glass

Also Published As

Publication number Publication date
CN1122078C (zh) 2003-09-24
JPH09143420A (ja) 1997-06-03
KR100428826B1 (ko) 2004-09-18
CN1165161A (zh) 1997-11-19
TW420708B (en) 2001-02-01
DE69618521T2 (de) 2002-10-31
EP0767467B1 (de) 2002-01-16
EP0767467A3 (de) 1998-01-28
KR970015670A (ko) 1997-04-28
EP0767467A2 (de) 1997-04-09
US5905117A (en) 1999-05-18
DE69618521D1 (de) 2002-02-21

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