SG71684A1 - Multilayer printed circuit board method of producing multilayer printed circut board and resin filler - Google Patents

Multilayer printed circuit board method of producing multilayer printed circut board and resin filler

Info

Publication number
SG71684A1
SG71684A1 SG1996010945A SG1996010945A SG71684A1 SG 71684 A1 SG71684 A1 SG 71684A1 SG 1996010945 A SG1996010945 A SG 1996010945A SG 1996010945 A SG1996010945 A SG 1996010945A SG 71684 A1 SG71684 A1 SG 71684A1
Authority
SG
Singapore
Prior art keywords
multilayer printed
resin filler
circuit board
printed circuit
board
Prior art date
Application number
SG1996010945A
Other languages
English (en)
Inventor
Toshihiko Yasue
Yasuji Hiramatsu
Hideki Yano
Yoshifumi Ishitani
Yoichiro Kawamura
Hideki Murase
Ayumi Suzuki
Masato Kawade
Motoo Asai
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Publication of SG71684A1 publication Critical patent/SG71684A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0773—Dissolving the filler without dissolving the matrix material; Dissolving the matrix material without dissolving the filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
SG1996010945A 1995-10-23 1996-10-23 Multilayer printed circuit board method of producing multilayer printed circut board and resin filler SG71684A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP27392895 1995-10-23
JP31746995 1995-11-10
JP16340296 1996-06-24

Publications (1)

Publication Number Publication Date
SG71684A1 true SG71684A1 (en) 2000-04-18

Family

ID=27322157

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996010945A SG71684A1 (en) 1995-10-23 1996-10-23 Multilayer printed circuit board method of producing multilayer printed circut board and resin filler

Country Status (7)

Country Link
EP (4) EP1445996B1 (fr)
KR (1) KR100272850B1 (fr)
CN (1) CN1090891C (fr)
DE (3) DE69637655D1 (fr)
MY (1) MY116680A (fr)
SG (1) SG71684A1 (fr)
WO (1) WO1997016056A1 (fr)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6376049B1 (en) * 1997-10-14 2002-04-23 Ibiden Co., Ltd. Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole
EP1843649A3 (fr) 1998-09-03 2007-10-31 Ibiden Co., Ltd. Panneau à circuit imprimé multicouche et son procédé de fabrication
MY144573A (en) * 1998-09-14 2011-10-14 Ibiden Co Ltd Printed circuit board and method for its production
KR20010085811A (ko) 1998-09-17 2001-09-07 엔도 마사루 다층빌드업배선판
SE9803670L (sv) * 1998-10-26 2000-04-27 Ericsson Telefon Ab L M Förfarande vid framställning av kretskort
JP2000261147A (ja) * 1999-03-10 2000-09-22 Shinko Electric Ind Co Ltd 多層配線基板及びその製造方法
JP4442832B2 (ja) * 1999-04-13 2010-03-31 イビデン株式会社 多層プリント配線板
EP1744609B1 (fr) * 1999-06-02 2012-12-12 Ibiden Co., Ltd. Plaquette à circuits imprimés multicouche et procédé de fabrication
EP1162867B1 (fr) 1999-10-26 2006-04-05 Ibiden Co., Ltd. Panneau de cablage realise en carte imprimee multicouche et procede de production
WO2004010751A1 (fr) 2002-07-18 2004-01-29 Hitachi Chemical Co., Ltd. Panneau de cablage multicouche, procede permettant de produire ce panneau, dispositif semi-conducteur et dispositif radio-electronique
ES2217952B1 (es) * 2002-12-30 2006-03-16 Lear Automotive (Eeds) Spain, S.L. Procedimiento para la fabricacion de placas de circuito impreso con espacios entre pistas protegidos.
DE10328857B3 (de) * 2003-06-26 2005-03-17 OCé PRINTING SYSTEMS GMBH Hülse zum Transport eines Tonergemischs und Verfahren zum Herstellen einer solchen Hülse
CN101014890B (zh) * 2004-09-08 2011-01-19 东丽株式会社 光布线用树脂组合物和光电复合布线基板
JP5344394B2 (ja) * 2008-07-10 2013-11-20 山栄化学株式会社 硬化性樹脂組成物、並びにハロゲンフリー樹脂基板及びハロゲンフリービルドアッププリント配線板
TWI517268B (zh) * 2009-08-07 2016-01-11 半導體能源研究所股份有限公司 端子構造的製造方法和電子裝置的製造方法
JP5077324B2 (ja) * 2009-10-26 2012-11-21 株式会社デンソー 配線基板
CN101720167B (zh) * 2009-11-20 2012-06-06 深圳崇达多层线路板有限公司 内层芯板树脂塞孔的线路板制作方法
CN101854778B (zh) * 2010-04-30 2011-10-26 深圳崇达多层线路板有限公司 一种对线路板导电孔进行树脂塞孔的制造工艺
CN102510668B (zh) * 2011-11-08 2014-02-19 深圳市景旺电子股份有限公司 一种超厚铜pcb板制作方法及其电路板
CN102548199A (zh) * 2011-12-29 2012-07-04 广东生益科技股份有限公司 电路基板及其制作方法
CN105704915A (zh) * 2016-04-26 2016-06-22 浪潮电子信息产业股份有限公司 一种耐腐蚀的服务器pcb
CN106304665A (zh) * 2016-08-30 2017-01-04 江门全合精密电子有限公司 10安士铜印刷电路板的制作方法
TWI788471B (zh) * 2018-01-16 2023-01-01 日商太陽油墨製造股份有限公司 熱硬化性樹脂組成物、其硬化物及印刷配線板
CN117690902B (zh) * 2024-02-03 2024-04-12 江门市和美精艺电子有限公司 一种含改性胶膜的封装基板

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2042059A5 (fr) * 1969-04-02 1971-02-05 Ibm
DE2451343C3 (de) * 1973-10-26 1978-10-05 Matsushita Electric Industrial Co., Ltd., Kadoma, Osaka (Japan) Gedruckte Schaltung
KR860001555B1 (ko) * 1983-10-14 1986-10-04 가부시기가이샤 히다찌세이사꾸쇼 에폭시 수지 조성물
DE3913966B4 (de) * 1988-04-28 2005-06-02 Ibiden Co., Ltd., Ogaki Klebstoffdispersion zum stromlosen Plattieren, sowie Verwendung zur Herstellung einer gedruckten Schaltung
US5120384A (en) * 1989-05-25 1992-06-09 Matsushita Electric Works, Ltd. Method of manufacturing multilayer laminate
EP0453785A1 (fr) * 1990-04-24 1991-10-30 Oerlikon Contraves AG Procédé de fabrication d'un circuit à couche mince multicouche à résistances intégrées à couche mince
JP3057766B2 (ja) * 1990-12-18 2000-07-04 日本ケミコン株式会社 厚膜多層回路基板及びその製造方法
JPH04221886A (ja) * 1990-12-21 1992-08-12 Nippon Chemicon Corp 厚膜多層回路基板及びその製造方法
JP2778323B2 (ja) * 1992-01-23 1998-07-23 株式会社日立製作所 プリント配線基板およびその製造方法
JP3053970B2 (ja) * 1992-07-27 2000-06-19 住友ベークライト株式会社 多層印刷配線板の製造方法
US5766670A (en) * 1993-11-17 1998-06-16 Ibm Via fill compositions for direct attach of devices and methods for applying same
US5450290A (en) * 1993-02-01 1995-09-12 International Business Machines Corporation Printed circuit board with aligned connections and method of making same
JPH06275959A (ja) * 1993-03-22 1994-09-30 Hitachi Ltd 多層配線基板とその製造方法および両面プリント配線板の製造方法
GB2283617A (en) * 1993-11-02 1995-05-10 Coates Brothers Plc Blocking through-holes in laminar substrates

Also Published As

Publication number Publication date
EP1445996A2 (fr) 2004-08-11
EP1705973B1 (fr) 2011-05-11
DE69633690D1 (de) 2004-11-25
MY116680A (en) 2004-03-31
DE69633381T2 (de) 2005-02-24
EP1318708A2 (fr) 2003-06-11
WO1997016056A1 (fr) 1997-05-01
DE69637655D1 (de) 2008-10-02
CN1169234A (zh) 1997-12-31
EP1705973A2 (fr) 2006-09-27
KR987001202A (ko) 1998-04-30
EP0800336B1 (fr) 2004-09-15
EP0800336A4 (fr) 1999-04-21
EP0800336A1 (fr) 1997-10-08
EP1445996A3 (fr) 2004-08-18
EP1318708B1 (fr) 2004-10-20
CN1090891C (zh) 2002-09-11
KR100272850B1 (ko) 2001-01-15
EP1445996B1 (fr) 2008-08-20
DE69633690T2 (de) 2005-03-10
DE69633381D1 (de) 2004-10-21
EP1318708A3 (fr) 2003-06-18
EP1705973A3 (fr) 2009-01-21

Similar Documents

Publication Publication Date Title
SG71684A1 (en) Multilayer printed circuit board method of producing multilayer printed circut board and resin filler
GB2324860B (en) Method and apparatus for manufacturing a multilayer printed circuit board
SG46967A1 (en) Process for producing multilayer printed circuit board
TW337397U (en) Printed wiring board, method of producing the same and electronic device
EP0566043A3 (en) Method of producing boards for printed wiring
EP0494668A3 (en) Polyimide multilayer wiring board and method of producing same
EP0478313A3 (en) A multilayer printed circuit board and manufacturing method therefor
EP0247575A3 (en) Multilayer printed wiring board and method for producing the same
GB2247112B (en) Method of forming through holes in a printed wiring board
GB2296994B (en) Microstrip printed wiring board and a method for making same
SG82561A1 (en) Process for producing multilayer printed circuit boards
EP0428870A3 (en) Photosensitive resin composition for forming conductor patterns and multilayer circuit boards using same
GB2246243B (en) Printed wiring board and method of manufacturing same
SG44314A1 (en) Printed circuit board and method of connecting electronic parts
GB2201294B (en) Multilayer printed wiring boards and method for making same
EP0460856A3 (en) Copper foil for inner layer circuit of multi-layered printed circuit board, method of producing the same and multi-layered printed circuit board having the same
GB9405608D0 (en) Manufacture of printed wiring boards
GB9207285D0 (en) Method of manufacturing printed wiring boards
GB2247110B (en) A method of producing a printed circuit board
SG63569A1 (en) Method of forming a multilayer printed circuit board and product thereof
EP0715490A3 (fr) Procédé de fabrication d'un panneau à circuit multicouche
AU6700396A (en) Process and device for producing through-connected printed circuit boards and multilayered printed circuit boards
GB2283614B (en) Method for manufacture of multilayer wiring board and the multilayer wiring board
GB2284509B (en) Method of making a printed circuit board
IL103439A0 (en) Method of forming a printed circuit board