SG70672A1 - Functional groups for thermal crosslinking of polymeric systems - Google Patents
Functional groups for thermal crosslinking of polymeric systemsInfo
- Publication number
- SG70672A1 SG70672A1 SG1999000596A SG1999000596A SG70672A1 SG 70672 A1 SG70672 A1 SG 70672A1 SG 1999000596 A SG1999000596 A SG 1999000596A SG 1999000596 A SG1999000596 A SG 1999000596A SG 70672 A1 SG70672 A1 SG 70672A1
- Authority
- SG
- Singapore
- Prior art keywords
- functional groups
- thermal crosslinking
- polymeric systems
- polymeric
- systems
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
- C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F257/00—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F263/00—Macromolecular compounds obtained by polymerising monomers on to polymers of esters of unsaturated alcohols with saturated acids as defined in group C08F18/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/48—Polymers modified by chemical after-treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49894—Materials of the insulating layers or coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/5329—Insulating materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G2650/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterized by the type of post-polymerisation functionalisation
- C08G2650/20—Cross-linking
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2312/00—Crosslinking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12528—Semiconductor component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12556—Organic component
- Y10T428/12569—Synthetic resin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
- Polyethers (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
- Organic Insulating Materials (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Graft Or Block Polymers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/030,039 US6060170A (en) | 1998-02-25 | 1998-02-25 | Functional groups for thermal crosslinking of polymeric systems |
Publications (1)
Publication Number | Publication Date |
---|---|
SG70672A1 true SG70672A1 (en) | 2000-02-22 |
Family
ID=21852220
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1999000596A SG70672A1 (en) | 1998-02-25 | 1999-02-13 | Functional groups for thermal crosslinking of polymeric systems |
Country Status (9)
Country | Link |
---|---|
US (1) | US6060170A (ja) |
EP (2) | EP1291375B1 (ja) |
JP (2) | JP3092104B2 (ja) |
KR (3) | KR100302690B1 (ja) |
DE (2) | DE69913011T2 (ja) |
HK (1) | HK1019758A1 (ja) |
IL (1) | IL128622A (ja) |
SG (1) | SG70672A1 (ja) |
TW (1) | TW522158B (ja) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6660875B1 (en) | 1998-06-09 | 2003-12-09 | Ppt Technologies, Llc | Ion exchange purification of dielectric condensate precursor fluids and silicate esters such as tetraethylorthosilicate (TEOS) |
US6468589B2 (en) | 2000-02-02 | 2002-10-22 | Jsr Corporation | Composition for film formation and insulating film |
JP5320653B2 (ja) * | 2001-03-26 | 2013-10-23 | Jsr株式会社 | 膜形成用組成物および絶縁膜形成用材料 |
JP4585505B2 (ja) * | 2001-04-09 | 2010-11-24 | 昭和電工株式会社 | 硬化性ポリビニルベンジル化合物およびその製造方法 |
AU2002367422A1 (en) * | 2001-12-28 | 2003-07-24 | Sumitomo Chemical Company, Limited | Process for production of high-molecular compounds |
US6716955B2 (en) | 2002-01-14 | 2004-04-06 | Air Products And Chemicals, Inc. | Poly(arylene ether) polymer with low temperature crosslinking grafts and adhesive comprising the same |
US7189795B2 (en) * | 2003-07-16 | 2007-03-13 | Burgoyne Jr William Franklin | Poly(arylene ether)s bearing grafted hydroxyalkyls for use in electrically conductive adhesives |
US7309833B2 (en) * | 2003-07-29 | 2007-12-18 | Air Products And Chemicals, Inc. | Photovoltaic devices comprising layer(s) of photoactive organics dissolved in high Tg polymers |
US7179878B2 (en) * | 2003-10-31 | 2007-02-20 | Burgoyne Jr William Franklin | Poly(arylene ether) polymer with low temperature or UV crosslinking grafts and dielectric comprising the same |
US7067593B2 (en) | 2003-11-14 | 2006-06-27 | Lumera Corporation | Poly(arylene ethers) with pendant crosslinkable groups, and devices incorporating same |
US7101957B2 (en) * | 2003-11-14 | 2006-09-05 | Lumera Corporation | Crosslinked compositions comprising a poly(arylene ether) and a nonlinear optical chromophore, and devices incorporating same |
US7038004B2 (en) * | 2003-11-14 | 2006-05-02 | Lumera Corporation | Process for preparing poly(arylene ethers) with pendant crosslinkable groups |
US7001678B2 (en) * | 2003-11-14 | 2006-02-21 | Lumera Corporation | Crosslinked polymer blends that include a luminescent polymer, and devices incorporating same |
US7008556B2 (en) * | 2003-11-14 | 2006-03-07 | Lumera Corporation | Process for preparing crosslinked polymer blends that include a luminescent polymer |
US7125949B2 (en) * | 2004-01-21 | 2006-10-24 | Lumera Corporation | Fluorinated sol-gel electro-optic materials, process for producing same, and devices therefrom |
US7241394B2 (en) * | 2004-01-21 | 2007-07-10 | Lumera Corporation | Process of fabricating polymer sustained microelectrodes |
US6852563B1 (en) | 2004-01-21 | 2005-02-08 | Lumera Corporation | Process of fabricating electro-optic polymer devices with polymer sustained microelectrodes |
US7250712B2 (en) * | 2004-01-21 | 2007-07-31 | Lumera Corporation | Polymer sustained microelectrodes |
JP4603818B2 (ja) * | 2004-05-21 | 2010-12-22 | 富士フイルム株式会社 | 膜形成用塗布液、その塗布液を用いて得られる絶縁膜、及びそれを有する電子デバイス |
US20050260790A1 (en) * | 2004-05-24 | 2005-11-24 | Goodner Michael D | Substrate imprinting techniques |
US20060128163A1 (en) * | 2004-12-14 | 2006-06-15 | International Business Machines Corporation | Surface treatment of post-rie-damaged p-osg and other damaged materials |
US7919825B2 (en) * | 2006-06-02 | 2011-04-05 | Air Products And Chemicals, Inc. | Thin film transistors with poly(arylene ether) polymers as gate dielectrics and passivation layers |
JP5270758B2 (ja) * | 2008-08-12 | 2013-08-21 | エア プロダクツ アンド ケミカルズ インコーポレイテッド | パー(フェニルエチニル)アレーン誘導体を含有するポリマー組成物 |
US20100068283A1 (en) * | 2008-09-16 | 2010-03-18 | Searete Llc, A Limited Liability Corporation Of The State Of Delaware | Ex VIVO modifiable particle or polymeric material medicament carrier |
US20100068153A1 (en) * | 2008-09-16 | 2010-03-18 | Searete Llc, A Limited Liability Corporation Of The State Of Delaware | Ex vivo activatable final dosage form |
US20100068152A1 (en) * | 2008-09-16 | 2010-03-18 | Searete Llc, A Limited Liability Corporation Of The State Of Delaware | Ex vivo modifiable particle or polymeric based final dosage form |
US20100069821A1 (en) * | 2008-09-16 | 2010-03-18 | Searete Llc, A Limited Liability Corporation Of The State Of Delaware | Ex vivo modifiable medicament release-sites final dosage form |
US20100068233A1 (en) * | 2008-09-16 | 2010-03-18 | Searete Llc, A Limited Liability Corporation Of The State Of Delaware | Modifiable dosage form |
US20100068254A1 (en) * | 2008-09-16 | 2010-03-18 | Mahalaxmi Gita Bangera | Modifying a medicament availability state of a final dosage form |
US20100068235A1 (en) * | 2008-09-16 | 2010-03-18 | Searete LLC, a limited liability corporation of Deleware | Individualizable dosage form |
US20100068275A1 (en) * | 2008-09-16 | 2010-03-18 | Searete Llc, A Limited Liability Corporation Of The State Of Delaware | Personalizable dosage form |
SG11201401834SA (en) | 2011-11-18 | 2014-07-30 | Greene Tweed & Co Inc | Crosslinking compounds for high glass transition temperature polymers |
CN102875807B (zh) * | 2012-09-14 | 2014-03-26 | 哈尔滨工程大学 | 苯并噁嗪封端芴基聚醚酮酮热塑性树脂及其制备方法 |
WO2014066268A2 (en) | 2012-10-22 | 2014-05-01 | Greene, Tweed Of Delaware, Inc. | Cross-linked organic polymer compositions and methods for controlling cross-linking reaction rate and of modifying same to enhance processability |
US9127138B2 (en) | 2013-01-28 | 2015-09-08 | Delsper LP | Anti-extrusion compositions for sealing and wear components |
JP6456913B2 (ja) * | 2013-03-15 | 2019-01-23 | デルスパー リミテッド パートナーシップ | エラストマーとしての使用のための架橋有機ポリマー |
EP2799465A1 (de) | 2013-04-29 | 2014-11-05 | Evonik Industries AG | Verfahren zur Aufreinigung von Poly(arylenethern) |
WO2015045426A1 (en) * | 2013-09-30 | 2015-04-02 | Toyo Gosei Co., Ltd. | Compounders for Enhancing Generation of Chemical Species |
WO2015057183A1 (en) | 2013-10-14 | 2015-04-23 | Halliburton Energy Services, Inc. | Treatment fluids containing polysaccharides with friction reducing grafts thereon |
US9601325B2 (en) | 2014-06-24 | 2017-03-21 | Rohm And Haas Electronic Materials Llc | Aromatic resins for underlayers |
KR20210091693A (ko) * | 2018-09-11 | 2021-07-22 | 그린, 트위드 테크놀로지스, 인코포레이티드 | 적층 제조 공정에 사용하기 위한 가교성 방향족 중합체 조성물, 및 이를 형성하는 방법 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1258736A (en) * | 1985-10-29 | 1989-08-22 | National Research Council Of Canada | Preparation of substituted polysulfones by metalation |
CA1304537C (en) * | 1987-12-11 | 1992-06-30 | Michael Dominique Guiver | Aromatic polysulfone compounds and their manufacture |
US5114780A (en) * | 1990-04-17 | 1992-05-19 | Raychem Corporation | Electronic articles containing a fluorinated poly(arylene ether) dielectric |
DE69115076T2 (de) * | 1990-02-20 | 1996-05-09 | Nat Starch Chem Invest | Diarylacetylen endgekappte Polyimide. |
ATE160577T1 (de) * | 1990-04-17 | 1997-12-15 | Allied Signal Inc | Vernetzbare zusammensetzung fluorierter aromatischer äther |
US5179188A (en) * | 1990-04-17 | 1993-01-12 | Raychem Corporation | Crosslinkable fluorinated aromatic ether composition |
DE4435251A1 (de) * | 1994-10-04 | 1996-04-11 | Ibm | Mehrstufige Zugriffssteuerung auf Datenträgerkarten |
US5874516A (en) * | 1995-07-13 | 1999-02-23 | Air Products And Chemicals, Inc. | Nonfunctionalized poly(arylene ethers) |
US5658994A (en) * | 1995-07-13 | 1997-08-19 | Air Products And Chemicals, Inc. | Nonfunctionalized poly(arylene ether) dielectrics |
CN1103329C (zh) * | 1995-09-12 | 2003-03-19 | 陶氏化学公司 | 乙炔基取代的芳族化合物,其合成,聚合物及其用途 |
-
1998
- 1998-02-25 US US09/030,039 patent/US6060170A/en not_active Expired - Lifetime
-
1999
- 1999-02-13 SG SG1999000596A patent/SG70672A1/en unknown
- 1999-02-19 IL IL12862299A patent/IL128622A/xx not_active IP Right Cessation
- 1999-02-20 TW TW088102497A patent/TW522158B/zh not_active IP Right Cessation
- 1999-02-23 DE DE69913011T patent/DE69913011T2/de not_active Expired - Lifetime
- 1999-02-23 DE DE69918473T patent/DE69918473T2/de not_active Expired - Lifetime
- 1999-02-23 EP EP02026960A patent/EP1291375B1/en not_active Expired - Lifetime
- 1999-02-23 EP EP99102777A patent/EP0939096B1/en not_active Expired - Lifetime
- 1999-02-24 KR KR1019990006050A patent/KR100302690B1/ko not_active IP Right Cessation
- 1999-02-24 JP JP11045839A patent/JP3092104B2/ja not_active Expired - Lifetime
- 1999-11-01 HK HK99104913A patent/HK1019758A1/xx not_active IP Right Cessation
-
2000
- 2000-05-16 JP JP2000148640A patent/JP2000344898A/ja active Pending
-
2001
- 2001-01-18 KR KR10-2001-0002779A patent/KR100433722B1/ko not_active IP Right Cessation
- 2001-01-18 KR KR10-2001-0002778A patent/KR100433723B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
HK1019758A1 (en) | 2000-02-25 |
EP1291375A1 (en) | 2003-03-12 |
TW522158B (en) | 2003-03-01 |
IL128622A0 (en) | 2000-01-31 |
DE69913011T2 (de) | 2004-06-03 |
EP1291375B1 (en) | 2004-06-30 |
DE69918473D1 (de) | 2004-08-05 |
DE69913011D1 (de) | 2004-01-08 |
JP3092104B2 (ja) | 2000-09-25 |
KR19990072886A (ko) | 1999-09-27 |
DE69918473T2 (de) | 2004-11-25 |
EP0939096B1 (en) | 2003-11-26 |
KR20010034932A (ko) | 2001-04-25 |
JPH11315139A (ja) | 1999-11-16 |
KR20010034933A (ko) | 2001-04-25 |
EP0939096A3 (en) | 2001-01-31 |
IL128622A (en) | 2005-08-31 |
US6060170A (en) | 2000-05-09 |
KR100433722B1 (ko) | 2004-05-31 |
JP2000344898A (ja) | 2000-12-12 |
KR100433723B1 (ko) | 2004-06-09 |
EP0939096A2 (en) | 1999-09-01 |
KR100302690B1 (ko) | 2001-09-22 |
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