HK1019758A1 - Functional groups for thermal crosslinking of polymeric systems - Google Patents

Functional groups for thermal crosslinking of polymeric systems

Info

Publication number
HK1019758A1
HK1019758A1 HK99104913A HK99104913A HK1019758A1 HK 1019758 A1 HK1019758 A1 HK 1019758A1 HK 99104913 A HK99104913 A HK 99104913A HK 99104913 A HK99104913 A HK 99104913A HK 1019758 A1 HK1019758 A1 HK 1019758A1
Authority
HK
Hong Kong
Prior art keywords
functional groups
thermal crosslinking
polymeric systems
polymeric
systems
Prior art date
Application number
HK99104913A
Other languages
English (en)
Inventor
William Franklin Burgoyne Jr
Original Assignee
Air Prod & Chem
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Air Prod & Chem filed Critical Air Prod & Chem
Publication of HK1019758A1 publication Critical patent/HK1019758A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
    • C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F257/00—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F263/00—Macromolecular compounds obtained by polymerising monomers on to polymers of esters of unsaturated alcohols with saturated acids as defined in group C08F18/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/48—Polymers modified by chemical after-treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49894—Materials of the insulating layers or coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/5329—Insulating materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterized by the type of post-polymerisation functionalisation
    • C08G2650/20—Cross-linking
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00—Crosslinking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Chemical & Material Sciences (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
  • Polyethers (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Organic Insulating Materials (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Graft Or Block Polymers (AREA)
HK99104913A 1998-02-25 1999-11-01 Functional groups for thermal crosslinking of polymeric systems HK1019758A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/030,039 US6060170A (en) 1998-02-25 1998-02-25 Functional groups for thermal crosslinking of polymeric systems

Publications (1)

Publication Number Publication Date
HK1019758A1 true HK1019758A1 (en) 2000-02-25

Family

ID=21852220

Family Applications (1)

Application Number Title Priority Date Filing Date
HK99104913A HK1019758A1 (en) 1998-02-25 1999-11-01 Functional groups for thermal crosslinking of polymeric systems

Country Status (9)

Country Link
US (1) US6060170A (ja)
EP (2) EP0939096B1 (ja)
JP (2) JP3092104B2 (ja)
KR (3) KR100302690B1 (ja)
DE (2) DE69918473T2 (ja)
HK (1) HK1019758A1 (ja)
IL (1) IL128622A (ja)
SG (1) SG70672A1 (ja)
TW (1) TW522158B (ja)

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WO2003057762A1 (fr) * 2001-12-28 2003-07-17 Sumitomo Chemical Company, Limited Procede de production de composes de poids moleculaire eleve
US6716955B2 (en) * 2002-01-14 2004-04-06 Air Products And Chemicals, Inc. Poly(arylene ether) polymer with low temperature crosslinking grafts and adhesive comprising the same
US7189795B2 (en) * 2003-07-16 2007-03-13 Burgoyne Jr William Franklin Poly(arylene ether)s bearing grafted hydroxyalkyls for use in electrically conductive adhesives
US7309833B2 (en) * 2003-07-29 2007-12-18 Air Products And Chemicals, Inc. Photovoltaic devices comprising layer(s) of photoactive organics dissolved in high Tg polymers
US7179878B2 (en) * 2003-10-31 2007-02-20 Burgoyne Jr William Franklin Poly(arylene ether) polymer with low temperature or UV crosslinking grafts and dielectric comprising the same
US7008556B2 (en) * 2003-11-14 2006-03-07 Lumera Corporation Process for preparing crosslinked polymer blends that include a luminescent polymer
US7001678B2 (en) * 2003-11-14 2006-02-21 Lumera Corporation Crosslinked polymer blends that include a luminescent polymer, and devices incorporating same
US7038004B2 (en) * 2003-11-14 2006-05-02 Lumera Corporation Process for preparing poly(arylene ethers) with pendant crosslinkable groups
US7101957B2 (en) * 2003-11-14 2006-09-05 Lumera Corporation Crosslinked compositions comprising a poly(arylene ether) and a nonlinear optical chromophore, and devices incorporating same
US7067593B2 (en) 2003-11-14 2006-06-27 Lumera Corporation Poly(arylene ethers) with pendant crosslinkable groups, and devices incorporating same
US7125949B2 (en) * 2004-01-21 2006-10-24 Lumera Corporation Fluorinated sol-gel electro-optic materials, process for producing same, and devices therefrom
US7241394B2 (en) * 2004-01-21 2007-07-10 Lumera Corporation Process of fabricating polymer sustained microelectrodes
US7250712B2 (en) * 2004-01-21 2007-07-31 Lumera Corporation Polymer sustained microelectrodes
US6852563B1 (en) 2004-01-21 2005-02-08 Lumera Corporation Process of fabricating electro-optic polymer devices with polymer sustained microelectrodes
JP4603818B2 (ja) * 2004-05-21 2010-12-22 富士フイルム株式会社 膜形成用塗布液、その塗布液を用いて得られる絶縁膜、及びそれを有する電子デバイス
US20050260790A1 (en) * 2004-05-24 2005-11-24 Goodner Michael D Substrate imprinting techniques
US20060128163A1 (en) * 2004-12-14 2006-06-15 International Business Machines Corporation Surface treatment of post-rie-damaged p-osg and other damaged materials
US7919825B2 (en) * 2006-06-02 2011-04-05 Air Products And Chemicals, Inc. Thin film transistors with poly(arylene ether) polymers as gate dielectrics and passivation layers
JP5270758B2 (ja) * 2008-08-12 2013-08-21 エア プロダクツ アンド ケミカルズ インコーポレイテッド パー（フェニルエチニル）アレーン誘導体を含有するポリマー組成物
US20100068278A1 (en) * 2008-09-16 2010-03-18 Searete Llc, A Limited Liablity Corporation Of The State Of Delaware Ex vivo modifiable medicament release-associations
US20100068233A1 (en) * 2008-09-16 2010-03-18 Searete Llc, A Limited Liability Corporation Of The State Of Delaware Modifiable dosage form
US20100068254A1 (en) * 2008-09-16 2010-03-18 Mahalaxmi Gita Bangera Modifying a medicament availability state of a final dosage form
US20100068153A1 (en) * 2008-09-16 2010-03-18 Searete Llc, A Limited Liability Corporation Of The State Of Delaware Ex vivo activatable final dosage form
US20100068152A1 (en) * 2008-09-16 2010-03-18 Searete Llc, A Limited Liability Corporation Of The State Of Delaware Ex vivo modifiable particle or polymeric based final dosage form
US20100069821A1 (en) * 2008-09-16 2010-03-18 Searete Llc, A Limited Liability Corporation Of The State Of Delaware Ex vivo modifiable medicament release-sites final dosage form
US20100068235A1 (en) * 2008-09-16 2010-03-18 Searete LLC, a limited liability corporation of Deleware Individualizable dosage form
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CA2899324C (en) 2013-01-28 2021-06-15 Delsper LP Anti-extrusion compositions for sealing and wear components
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Also Published As

Publication number Publication date
EP0939096A3 (en) 2001-01-31
EP1291375B1 (en) 2004-06-30
IL128622A (en) 2005-08-31
IL128622A0 (en) 2000-01-31
SG70672A1 (en) 2000-02-22
EP0939096A2 (en) 1999-09-01
JP3092104B2 (ja) 2000-09-25
KR100433723B1 (ko) 2004-06-09
JPH11315139A (ja) 1999-11-16
KR100433722B1 (ko) 2004-05-31
TW522158B (en) 2003-03-01
KR19990072886A (ko) 1999-09-27
DE69913011D1 (de) 2004-01-08
EP0939096B1 (en) 2003-11-26
DE69918473D1 (de) 2004-08-05
EP1291375A1 (en) 2003-03-12
US6060170A (en) 2000-05-09
DE69918473T2 (de) 2004-11-25
KR20010034932A (ko) 2001-04-25
KR20010034933A (ko) 2001-04-25
DE69913011T2 (de) 2004-06-03
JP2000344898A (ja) 2000-12-12
KR100302690B1 (ko) 2001-09-22

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Effective date: 20190222