SG66410A1 - Single and double gate field effect transistors with sidewall source-drain contacts - Google Patents
Single and double gate field effect transistors with sidewall source-drain contactsInfo
- Publication number
- SG66410A1 SG66410A1 SG1997004059A SG1997004059A SG66410A1 SG 66410 A1 SG66410 A1 SG 66410A1 SG 1997004059 A SG1997004059 A SG 1997004059A SG 1997004059 A SG1997004059 A SG 1997004059A SG 66410 A1 SG66410 A1 SG 66410A1
- Authority
- SG
- Singapore
- Prior art keywords
- field effect
- effect transistors
- gate field
- double gate
- drain contacts
- Prior art date
Links
- 230000005669 field effect Effects 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/80—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/66772—Monocristalline silicon transistors on insulating substrates, e.g. quartz substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41733—Source or drain electrodes for field effect devices for thin film transistors with insulated gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78645—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with multiple gate
- H01L29/78648—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with multiple gate arranged on opposing sides of the channel
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/767,916 US5773331A (en) | 1996-12-17 | 1996-12-17 | Method for making single and double gate field effect transistors with sidewall source-drain contacts |
Publications (1)
Publication Number | Publication Date |
---|---|
SG66410A1 true SG66410A1 (en) | 1999-07-20 |
Family
ID=25080961
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1997004059A SG66410A1 (en) | 1996-12-17 | 1997-11-14 | Single and double gate field effect transistors with sidewall source-drain contacts |
Country Status (5)
Country | Link |
---|---|
US (1) | US5773331A (ko) |
JP (1) | JP3282143B2 (ko) |
KR (1) | KR100288667B1 (ko) |
SG (1) | SG66410A1 (ko) |
TW (1) | TW372357B (ko) |
Families Citing this family (83)
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US20060086977A1 (en) | 2004-10-25 | 2006-04-27 | Uday Shah | Nonplanar device with thinned lower body portion and method of fabrication |
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US20060202266A1 (en) | 2005-03-14 | 2006-09-14 | Marko Radosavljevic | Field effect transistor with metal source/drain regions |
US7387946B2 (en) * | 2005-06-07 | 2008-06-17 | Freescale Semiconductor, Inc. | Method of fabricating a substrate for a planar, double-gated, transistor process |
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KR101448903B1 (ko) * | 2007-10-23 | 2014-10-13 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치 및 그의 제작방법 |
US8362566B2 (en) | 2008-06-23 | 2013-01-29 | Intel Corporation | Stress in trigate devices using complimentary gate fill materials |
US9203041B2 (en) | 2014-01-31 | 2015-12-01 | International Business Machines Corporation | Carbon nanotube transistor having extended contacts |
CN111670486B (zh) * | 2018-01-29 | 2024-08-09 | 麻省理工学院 | 背栅场效应晶体管及其制造方法 |
KR20210062129A (ko) * | 2019-11-20 | 2021-05-31 | 삼성디스플레이 주식회사 | 표시 장치 및 표시 장치의 제조 방법 |
US12040409B2 (en) | 2021-02-09 | 2024-07-16 | Taiwan Semiconductor Manufacturing Company Limited | Thin film transistor including a dielectric diffusion barrier and methods for forming the same |
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US5376561A (en) * | 1990-12-31 | 1994-12-27 | Kopin Corporation | High density electronic circuit modules |
US5420048A (en) * | 1991-01-09 | 1995-05-30 | Canon Kabushiki Kaisha | Manufacturing method for SOI-type thin film transistor |
JPH04322469A (ja) * | 1991-04-23 | 1992-11-12 | Mitsubishi Electric Corp | 薄膜電界効果素子およびその製造方法 |
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US5273921A (en) * | 1991-12-27 | 1993-12-28 | Purdue Research Foundation | Methods for fabricating a dual-gated semiconductor-on-insulator field effect transistor |
US5461250A (en) * | 1992-08-10 | 1995-10-24 | International Business Machines Corporation | SiGe thin film or SOI MOSFET and method for making the same |
US5348899A (en) * | 1993-05-12 | 1994-09-20 | Micron Semiconductor, Inc. | Method of fabricating a bottom and top gated thin film transistor |
JPH0878683A (ja) * | 1994-06-30 | 1996-03-22 | Toshiba Corp | 半導体装置およびその製造方法 |
JPH08162640A (ja) * | 1994-11-30 | 1996-06-21 | Sony Corp | 半導体装置の製造方法 |
-
1996
- 1996-12-17 US US08/767,916 patent/US5773331A/en not_active Expired - Lifetime
-
1997
- 1997-09-26 KR KR1019970049136A patent/KR100288667B1/ko not_active IP Right Cessation
- 1997-10-21 JP JP28834797A patent/JP3282143B2/ja not_active Expired - Fee Related
- 1997-10-28 TW TW086115908A patent/TW372357B/zh not_active IP Right Cessation
- 1997-11-14 SG SG1997004059A patent/SG66410A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
JPH10178180A (ja) | 1998-06-30 |
KR100288667B1 (ko) | 2001-12-12 |
JP3282143B2 (ja) | 2002-05-13 |
US5773331A (en) | 1998-06-30 |
TW372357B (en) | 1999-10-21 |
KR19980063491A (ko) | 1998-10-07 |
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