SG52844A1 - Device and method for perforating printed circuit board - Google Patents

Device and method for perforating printed circuit board

Info

Publication number
SG52844A1
SG52844A1 SG1996010669A SG1996010669A SG52844A1 SG 52844 A1 SG52844 A1 SG 52844A1 SG 1996010669 A SG1996010669 A SG 1996010669A SG 1996010669 A SG1996010669 A SG 1996010669A SG 52844 A1 SG52844 A1 SG 52844A1
Authority
SG
Singapore
Prior art keywords
circuit board
printed circuit
perforating
perforating printed
board
Prior art date
Application number
SG1996010669A
Other languages
English (en)
Inventor
Tsutomu Saito
Shinichi Kato
Original Assignee
Seiko Precision Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Precision Kk filed Critical Seiko Precision Kk
Publication of SG52844A1 publication Critical patent/SG52844A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Drilling And Boring (AREA)
  • Details Of Cutting Devices (AREA)
  • Control Of Cutting Processes (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
SG1996010669A 1995-09-22 1996-09-20 Device and method for perforating printed circuit board SG52844A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7244377A JP2873439B2 (ja) 1995-09-22 1995-09-22 プリント基板の穴明け装置及び穴明け方法

Publications (1)

Publication Number Publication Date
SG52844A1 true SG52844A1 (en) 1998-09-28

Family

ID=17117784

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996010669A SG52844A1 (en) 1995-09-22 1996-09-20 Device and method for perforating printed circuit board

Country Status (5)

Country Link
JP (1) JP2873439B2 (zh)
KR (1) KR100247266B1 (zh)
CN (1) CN1088320C (zh)
SG (1) SG52844A1 (zh)
TW (1) TW386047B (zh)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3802309B2 (ja) * 2000-03-28 2006-07-26 株式会社アドテックエンジニアリング 多層回路基板製造における位置合わせ装置及び露光装置
JP4343391B2 (ja) * 2000-04-07 2009-10-14 株式会社モトロニクス ワークの加工装置
JP4502454B2 (ja) * 2000-04-28 2010-07-14 株式会社ムラキ 基準穴穴開け機
JP4134503B2 (ja) * 2000-10-11 2008-08-20 松下電器産業株式会社 回路形成基板の製造方法
KR20020078472A (ko) * 2001-04-03 2002-10-19 디에스테크널러지(주) 홀 가공기에 의한 인쇄회로기판의 홀 가공방법
CN1143763C (zh) * 2002-07-29 2004-03-31 应书波 图像自动找准的数控冲孔机
JP4514690B2 (ja) * 2005-10-31 2010-07-28 ヤマハファインテック株式会社 コネクタ部の打ち抜き装置、コネクタ部の打ち抜き方法およびコネクタ部の打ち抜き方法を実現するためのプログラム
JP4542046B2 (ja) * 2006-01-30 2010-09-08 セイコープレシジョン株式会社 穴開け方法及び穴開け装置
WO2007138685A1 (ja) * 2006-05-30 2007-12-06 Beac Co., Ltd. 穿孔装置、プリント配線用基板及び電子機器
JP4210692B2 (ja) * 2006-05-30 2009-01-21 セイコープレシジョン株式会社 穿孔装置
KR100809926B1 (ko) 2006-10-09 2008-03-06 주식회사 나래시스 인쇄회로기판용 드릴링머신
JP4767180B2 (ja) * 2007-01-11 2011-09-07 セイコープレシジョン株式会社 穴開け装置
KR100883176B1 (ko) 2007-12-03 2009-02-12 세호로보트산업 주식회사 기판 타발 장치
US8947076B2 (en) 2010-01-18 2015-02-03 Bourns, Inc. High resolution non-contacting multi-turn position sensor
CN102145414A (zh) * 2011-03-24 2011-08-10 苏州市艾西依钣金制造有限公司 一种多孔攻芽方法
JP5466687B2 (ja) * 2011-11-08 2014-04-09 セイコープレシジョン株式会社 配線板測定装置
JP5512648B2 (ja) * 2011-12-28 2014-06-04 セイコープレシジョン株式会社 Ｘ線処理装置
JP5952053B2 (ja) * 2012-03-29 2016-07-13 セイコープレシジョン株式会社 穴開け装置
JP5952052B2 (ja) * 2012-03-29 2016-07-13 セイコープレシジョン株式会社 穴開け装置
CN102699952A (zh) * 2012-06-01 2012-10-03 深圳市威利特自动化设备有限公司 一种打孔方法、装置以及设备
US9481028B2 (en) * 2013-09-26 2016-11-01 The Boeing Company Automated drilling through pilot holes
CN104260147A (zh) * 2014-08-21 2015-01-07 宁波赛特信息科技发展有限公司 一种挠性线路板钻孔方法
CN104476612B (zh) * 2014-12-11 2016-08-24 广州兴森快捷电路科技有限公司 一种X-Ray钻孔装置
CN104972511A (zh) * 2015-07-08 2015-10-14 沪士电子股份有限公司 一种提升pcb板对钻精度的钻孔方法
CN106270620B (zh) * 2016-08-29 2019-08-02 山东莱钢建设有限公司 F型轨排钻孔设备
CN112454493B (zh) * 2020-10-16 2022-06-03 广州裕申电子科技有限公司 电路板标识系统、方法及存储介质

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2561166B2 (ja) * 1990-03-26 1996-12-04 株式会社精工舎 プリント基板の穴明け方法及びその装置
JPH0657381A (ja) * 1992-08-05 1994-03-01 Sumitomo Special Metals Co Ltd Ｆｅ−Ｎｉ−Ｃｏ系低熱膨張合金

Also Published As

Publication number Publication date
CN1151676A (zh) 1997-06-11
JP2873439B2 (ja) 1999-03-24
CN1088320C (zh) 2002-07-24
KR100247266B1 (ko) 2000-03-15
TW386047B (en) 2000-04-01
KR970019786A (ko) 1997-04-30
JPH0985693A (ja) 1997-03-31

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