SG52732A1 - Highly polishable highly thermally conductive silicon carbide method of preparation and applications thereof - Google Patents
Highly polishable highly thermally conductive silicon carbide method of preparation and applications thereofInfo
- Publication number
- SG52732A1 SG52732A1 SG1996008485A SG1996008485A SG52732A1 SG 52732 A1 SG52732 A1 SG 52732A1 SG 1996008485 A SG1996008485 A SG 1996008485A SG 1996008485 A SG1996008485 A SG 1996008485A SG 52732 A1 SG52732 A1 SG 52732A1
- Authority
- SG
- Singapore
- Prior art keywords
- highly
- applications
- preparation
- silicon carbide
- thermally conductive
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/01—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes on temporary substrates, e.g. substrates subsequently removed by etching
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/56—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides
- C04B35/565—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides based on silicon carbide
- C04B35/571—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides based on silicon carbide obtained from Si-containing polymer precursors or organosilicon monomers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/32—Carbides
- C23C16/325—Silicon carbide
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4404—Coatings or surface treatment on the inside of the reaction chamber or on parts thereof
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/32—Thermal properties
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Structural Engineering (AREA)
- Chemical Vapour Deposition (AREA)
- Carbon And Carbon Compounds (AREA)
- Magnetic Record Carriers (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Ceramic Products (AREA)
- Manufacturing Of Tubular Articles Or Embedded Moulded Articles (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US92307792A | 1992-07-31 | 1992-07-31 | |
US07/959,880 US5374412A (en) | 1992-07-31 | 1992-10-13 | Highly polishable, highly thermally conductive silicon carbide |
Publications (1)
Publication Number | Publication Date |
---|---|
SG52732A1 true SG52732A1 (en) | 1998-09-28 |
Family
ID=27129861
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1996008485A SG52732A1 (en) | 1992-07-31 | 1993-07-30 | Highly polishable highly thermally conductive silicon carbide method of preparation and applications thereof |
Country Status (9)
Country | Link |
---|---|
US (3) | US5374412A (fr) |
EP (1) | EP0588479B1 (fr) |
JP (1) | JPH06199513A (fr) |
KR (1) | KR970002892B1 (fr) |
CA (1) | CA2099833C (fr) |
DE (1) | DE69309375T2 (fr) |
HK (1) | HK119997A (fr) |
IL (1) | IL106417A (fr) |
SG (1) | SG52732A1 (fr) |
Families Citing this family (58)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW337513B (en) * | 1992-11-23 | 1998-08-01 | Cvd Inc | Chemical vapor deposition-produced silicon carbide having improved properties and preparation process thereof |
US6236542B1 (en) | 1994-01-21 | 2001-05-22 | International Business Machines Corporation | Substrate independent superpolishing process and slurry |
US5850329A (en) * | 1994-10-31 | 1998-12-15 | Sullivan; Thomas Milton | Magnetic recording device components |
US6309766B1 (en) | 1994-10-31 | 2001-10-30 | Thomas M. Sullivan | Polycrystalline silicon carbide ceramic wafer and substrate |
US6077619A (en) * | 1994-10-31 | 2000-06-20 | Sullivan; Thomas M. | Polycrystalline silicon carbide ceramic wafer and substrate |
US5623386A (en) * | 1994-10-31 | 1997-04-22 | Sullivan; Thomas M. | Magnetic recording component |
US5618594A (en) * | 1995-04-13 | 1997-04-08 | Cvd, Incorporated | Composite thermocouple protection tubes |
EP0783747A1 (fr) * | 1995-05-26 | 1997-07-16 | International Business Machines Corporation | Disque a contact direct pour enregistrement magnetique vertical de donnees |
US5677230A (en) * | 1995-12-01 | 1997-10-14 | Motorola | Method of making wide bandgap semiconductor devices |
US5584936A (en) * | 1995-12-14 | 1996-12-17 | Cvd, Incorporated | Susceptor for semiconductor wafer processing |
US5741445A (en) | 1996-02-06 | 1998-04-21 | Cvd, Incorporated | Method of making lightweight closed-back mirror |
US5683028A (en) * | 1996-05-03 | 1997-11-04 | Cvd, Incorporated | Bonding of silicon carbide components |
DE19730770C2 (de) * | 1996-08-06 | 2001-05-10 | Wacker Chemie Gmbh | Porenfreie Sinterkörper auf Basis von Siliciumcarbid, Verfahren zu ihrer Herstellung und ihre Verwendung als Substrate für Festplattenspeicher |
JP2918860B2 (ja) * | 1997-01-20 | 1999-07-12 | 日本ピラー工業株式会社 | 鏡面体 |
JPH1179846A (ja) * | 1997-09-01 | 1999-03-23 | Tokai Carbon Co Ltd | 炭化珪素成形体 |
US6063186A (en) * | 1997-12-17 | 2000-05-16 | Cree, Inc. | Growth of very uniform silicon carbide epitaxial layers |
US6228297B1 (en) * | 1998-05-05 | 2001-05-08 | Rohm And Haas Company | Method for producing free-standing silicon carbide articles |
US6231923B1 (en) | 1998-08-17 | 2001-05-15 | Tevtech Llc | Chemical vapor deposition of near net shape monolithic ceramic parts |
US6464912B1 (en) | 1999-01-06 | 2002-10-15 | Cvd, Incorporated | Method for producing near-net shape free standing articles by chemical vapor deposition |
JP2001048649A (ja) * | 1999-07-30 | 2001-02-20 | Asahi Glass Co Ltd | 炭化ケイ素およびその製造方法 |
DE60032358T2 (de) | 2000-02-15 | 2007-10-25 | Toshiba Ceramics Co., Ltd. | Verfahren zur herstellung von si-sic-gliedern zur thermischen behandlung von halbleitern |
US7018947B2 (en) * | 2000-02-24 | 2006-03-28 | Shipley Company, L.L.C. | Low resistivity silicon carbide |
US6939821B2 (en) * | 2000-02-24 | 2005-09-06 | Shipley Company, L.L.C. | Low resistivity silicon carbide |
US6560064B1 (en) * | 2000-03-21 | 2003-05-06 | International Business Machines Corporation | Disk array system with internal environmental controls |
US6797085B1 (en) * | 2000-09-28 | 2004-09-28 | Intel Corporation | Metallurgically enhanced heat sink |
US6811761B2 (en) | 2000-11-10 | 2004-11-02 | Shipley Company, L.L.C. | Silicon carbide with high thermal conductivity |
US8202621B2 (en) * | 2001-09-22 | 2012-06-19 | Rohm And Haas Company | Opaque low resistivity silicon carbide |
US20040011464A1 (en) * | 2002-07-16 | 2004-01-22 | Applied Materials, Inc. | Promotion of independence between degree of dissociation of reactive gas and the amount of ionization of dilutant gas via diverse gas injection |
US20040112190A1 (en) * | 2002-11-26 | 2004-06-17 | Hollis Michael Chad | Bevel angle locking actuator and bevel angle locking system for a saw |
US20040173597A1 (en) * | 2003-03-03 | 2004-09-09 | Manoj Agrawal | Apparatus for contacting gases at high temperature |
JP4064315B2 (ja) * | 2003-08-20 | 2008-03-19 | 信越化学工業株式会社 | 誘導結合プラズマトーチ及び元素分析装置 |
US20050123713A1 (en) * | 2003-12-05 | 2005-06-09 | Forrest David T. | Articles formed by chemical vapor deposition and methods for their manufacture |
US20100297350A1 (en) | 2003-12-05 | 2010-11-25 | David Thomas Forrest | Free-standing silicon carbide articles formed by chemical vapor deposition and methods for their manufacture |
DE602005003538T2 (de) * | 2004-08-10 | 2008-10-23 | Ibiden Co., Ltd., Ogaki | Brennofen und verfahren zur herstellung von keramischen teilen mit diesem brennofen |
US7972441B2 (en) * | 2005-04-05 | 2011-07-05 | Applied Materials, Inc. | Thermal oxidation of silicon using ozone |
EP1772901B1 (fr) * | 2005-10-07 | 2012-07-25 | Rohm and Haas Electronic Materials, L.L.C. | Dispositif support de plaquette semiconductrice et méthode de traitement de semi-conducteurs |
KR101332206B1 (ko) * | 2005-12-02 | 2013-11-25 | 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. | 반도체 처리 방법 |
EP1863079B1 (fr) * | 2006-06-02 | 2011-08-10 | Rohm and Haas Electronic Materials, L.L.C. | Appareil avec joints de rayon de filet |
US20080007555A1 (en) * | 2006-07-10 | 2008-01-10 | Vrba Joseph A | Dynamic plot on plot displays |
TWI361469B (en) * | 2007-03-09 | 2012-04-01 | Rohm & Haas Elect Mat | Chemical vapor deposited silicon carbide articles |
KR101012082B1 (ko) * | 2007-06-25 | 2011-02-07 | 데이또꾸샤 가부시키가이샤 | 가열 장치 및 이것을 채용한 기판 처리 장치 및 반도체장치의 제조 방법 및 절연체 |
JP4523661B1 (ja) * | 2009-03-10 | 2010-08-11 | 三井造船株式会社 | 原子層堆積装置及び薄膜形成方法 |
US8685845B2 (en) | 2010-08-20 | 2014-04-01 | International Business Machines Corporation | Epitaxial growth of silicon doped with carbon and phosphorus using hydrogen carrier gas |
CN103038387B (zh) * | 2011-08-02 | 2015-05-27 | 新柯隆株式会社 | 碳化硅薄膜的成膜方法 |
US8753985B2 (en) * | 2012-01-17 | 2014-06-17 | Applied Materials, Inc. | Molecular layer deposition of silicon carbide |
ES2656024T3 (es) * | 2012-04-05 | 2018-02-22 | General Atomics | Juntas de alta durabilidad entre artículos de cerámica, y método para realizar la junta |
WO2014027472A1 (fr) * | 2012-08-17 | 2014-02-20 | 株式会社Ihi | Procédé de fabrication de matière composite résistant à la chaleur et dispositif de fabrication |
KR101585924B1 (ko) | 2014-02-04 | 2016-01-18 | 국방과학연구소 | 탄화규소 써멀 화학기상증착장치의 가스반응로 |
US9915001B2 (en) | 2014-09-03 | 2018-03-13 | Silcotek Corp. | Chemical vapor deposition process and coated article |
US10100409B2 (en) * | 2015-02-11 | 2018-10-16 | United Technologies Corporation | Isothermal warm wall CVD reactor |
WO2017040623A1 (fr) | 2015-09-01 | 2017-03-09 | Silcotek Corp. | Revêtement par dépôt chimique en phase vapeur thermique |
US11161324B2 (en) | 2017-09-13 | 2021-11-02 | Silcotek Corp. | Corrosion-resistant coated article and thermal chemical vapor deposition coating process |
CN110579105B (zh) * | 2018-06-08 | 2021-06-08 | 北京北方华创微电子装备有限公司 | 氧化炉 |
WO2020252306A1 (fr) | 2019-06-14 | 2020-12-17 | Silcotek Corp. | Croissance de nanofils |
KR102104799B1 (ko) | 2019-08-13 | 2020-05-04 | 주식회사 바이테크 | 대용량 cvd 장치 |
KR102297741B1 (ko) | 2019-08-28 | 2021-09-06 | 주식회사 바이테크 | 대용량 cvd 장치 |
CN113479889B (zh) * | 2021-08-20 | 2022-12-09 | 中电化合物半导体有限公司 | 一种碳化硅粉料的合成方法 |
CN117401979B (zh) * | 2023-11-02 | 2024-09-10 | 湖南德智新材料有限公司 | 一种制备碳化硅陶瓷材料的方法、应用及碳化硅陶瓷材料 |
Family Cites Families (19)
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US3549413A (en) * | 1969-07-28 | 1970-12-22 | Gen Technologies Corp | Reinforcing filaments comprising coated tungsten wires |
US4123989A (en) * | 1977-09-12 | 1978-11-07 | Mobil Tyco Solar Energy Corp. | Manufacture of silicon on the inside of a tube |
EP0126790B1 (fr) * | 1983-05-27 | 1986-09-03 | Ibm Deutschland Gmbh | Disque magnétique composite |
US4647494A (en) * | 1985-10-31 | 1987-03-03 | International Business Machines Corporation | Silicon/carbon protection of metallic magnetic structures |
US4861533A (en) * | 1986-11-20 | 1989-08-29 | Air Products And Chemicals, Inc. | Method of preparing silicon carbide capillaries |
JPH0222473A (ja) * | 1988-07-08 | 1990-01-25 | Sumitomo Metal Mining Co Ltd | セラミック材の製造方法及びその製造用高温反応炉 |
US4923716A (en) * | 1988-09-26 | 1990-05-08 | Hughes Aircraft Company | Chemical vapor desposition of silicon carbide |
JP2627792B2 (ja) * | 1988-11-22 | 1997-07-09 | 日本パイオニクス株式会社 | 水素ガスの精製装置 |
JPH02265011A (ja) * | 1989-04-06 | 1990-10-29 | Sony Corp | 磁気記録媒体 |
JP2805160B2 (ja) * | 1989-06-21 | 1998-09-30 | 東洋炭素株式会社 | 炭素質成形断熱体 |
US5150507A (en) * | 1989-08-03 | 1992-09-29 | Cvd Incorporated | Method of fabricating lightweight honeycomb structures |
US5071596A (en) * | 1989-10-23 | 1991-12-10 | Cvd Incorporated | Fabrication of lightweight ceramic mirrors by means of a chemical vapor deposition process |
US4997678A (en) * | 1989-10-23 | 1991-03-05 | Cvd Incorporated | Chemical vapor deposition process to replicate the finish and figure of preshaped structures |
US4990374A (en) * | 1989-11-28 | 1991-02-05 | Cvd Incorporated | Selective area chemical vapor deposition |
JPH03252307A (ja) * | 1990-02-27 | 1991-11-11 | Showa Denko Kk | 多結晶炭化珪素 |
US5043773A (en) * | 1990-06-04 | 1991-08-27 | Advanced Technology Materials, Inc. | Wafer base for silicon carbide semiconductor devices, incorporating alloy substrates |
US5190890A (en) * | 1990-06-04 | 1993-03-02 | Advanced Technology Materials, Inc. | Wafer base for silicon carbide semiconductor devices, incorporating alloy substrates, and method of making the same |
CA2058809A1 (fr) * | 1991-01-07 | 1992-07-08 | Jitendra S. Goela | Depot chimique en phase vapeur de silicium et de carbure de silicium aux proprietes optiques ameliorees |
JPH04258810A (ja) * | 1991-02-13 | 1992-09-14 | Sony Corp | 磁気記録媒体 |
-
1992
- 1992-10-13 US US07/959,880 patent/US5374412A/en not_active Expired - Lifetime
-
1993
- 1993-07-05 CA CA002099833A patent/CA2099833C/fr not_active Expired - Fee Related
- 1993-07-20 IL IL10641793A patent/IL106417A/en not_active IP Right Cessation
- 1993-07-30 JP JP5189696A patent/JPH06199513A/ja active Pending
- 1993-07-30 EP EP93306023A patent/EP0588479B1/fr not_active Expired - Lifetime
- 1993-07-30 KR KR1019930014639A patent/KR970002892B1/ko not_active IP Right Cessation
- 1993-07-30 SG SG1996008485A patent/SG52732A1/en unknown
- 1993-07-30 DE DE69309375T patent/DE69309375T2/de not_active Expired - Lifetime
-
1994
- 1994-11-17 US US08/340,981 patent/US5465184A/en not_active Expired - Lifetime
-
1995
- 1995-05-01 US US08/432,342 patent/US5474613A/en not_active Expired - Lifetime
-
1997
- 1997-06-26 HK HK119997A patent/HK119997A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US5374412A (en) | 1994-12-20 |
KR970002892B1 (ko) | 1997-03-12 |
HK119997A (en) | 1997-09-05 |
DE69309375D1 (de) | 1997-05-07 |
DE69309375T2 (de) | 1997-07-10 |
JPH06199513A (ja) | 1994-07-19 |
IL106417A0 (en) | 1993-11-15 |
CA2099833C (fr) | 1997-11-25 |
US5465184A (en) | 1995-11-07 |
US5474613A (en) | 1995-12-12 |
IL106417A (en) | 1996-09-12 |
KR940002164A (ko) | 1994-02-16 |
EP0588479B1 (fr) | 1997-04-02 |
EP0588479A1 (fr) | 1994-03-23 |
CA2099833A1 (fr) | 1994-02-01 |
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