SG45135A1 - Cyanate resin composition and copper-clad laminate - Google Patents

Cyanate resin composition and copper-clad laminate

Info

Publication number
SG45135A1
SG45135A1 SG1996000054A SG1996000054A SG45135A1 SG 45135 A1 SG45135 A1 SG 45135A1 SG 1996000054 A SG1996000054 A SG 1996000054A SG 1996000054 A SG1996000054 A SG 1996000054A SG 45135 A1 SG45135 A1 SG 45135A1
Authority
SG
Singapore
Prior art keywords
copper
resin composition
clad laminate
cyanate resin
cyanate
Prior art date
Application number
SG1996000054A
Other languages
English (en)
Inventor
Yasuhiro Endo
Yoichi Ueda
Toshiaki Hayashi
Mitsuhiro Shibata
Shinichiro Kitayama
Shuichi Kanagawa
Hisashi Watabu
Original Assignee
Sumitomo Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP03317093A external-priority patent/JP3331661B2/ja
Application filed by Sumitomo Chemical Co filed Critical Sumitomo Chemical Co
Publication of SG45135A1 publication Critical patent/SG45135A1/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/0622Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
    • C08G73/0638Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with at least three nitrogen atoms in the ring
    • C08G73/065Preparatory processes
    • C08G73/0655Preparatory processes from polycyanurates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014Nitrogen containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/02Polyamines
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/02Polyamines
    • C08G73/024Polyamines containing oxygen in the form of ether bonds in the main chain
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0346Organic insulating material consisting of one material containing N
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31678Of metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
SG1996000054A 1993-02-23 1994-02-22 Cyanate resin composition and copper-clad laminate SG45135A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP03317093A JP3331661B2 (ja) 1993-02-23 1993-02-23 シアネート化合物およびその組成物
JP4943093 1993-03-10

Publications (1)

Publication Number Publication Date
SG45135A1 true SG45135A1 (en) 1998-01-16

Family

ID=26371810

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996000054A SG45135A1 (en) 1993-02-23 1994-02-22 Cyanate resin composition and copper-clad laminate

Country Status (8)

Country Link
US (1) US5563237A (de)
EP (1) EP0612783B1 (de)
KR (1) KR100312003B1 (de)
CA (1) CA2115409A1 (de)
DE (1) DE69418238T2 (de)
MY (1) MY110194A (de)
SG (1) SG45135A1 (de)
TW (1) TW358825B (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2115537A1 (en) * 1993-02-23 1994-08-24 Yasuhiro Endo Cyanate resin composition and copper-clad laminate using the composition
EP1260538B1 (de) * 1999-10-06 2010-12-01 Kaneka Corporation Verfahren zur herstellung eines polyimidharzes
US8674007B2 (en) 2006-07-12 2014-03-18 Sabic Innovative Plastics Ip B.V. Flame retardant and scratch resistant thermoplastic polycarbonate compositions
KR101602512B1 (ko) * 2008-03-12 2016-03-10 블루 큐브 아이피 엘엘씨 지방족 탄소 함량이 높은 방향족 디시아네이트 화합물

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1190184B (de) * 1963-06-25 1965-04-01 Bayer Ag Verfahren zur Herstellung von hochmolekularen Polytriazinen
US4028393A (en) * 1975-02-22 1977-06-07 Bayer Aktiengesellschaft Process for the production of polyfunctional cyanic acid esters
DE2628417C2 (de) * 1976-06-24 1985-08-14 Bayer Ag, 5090 Leverkusen Härtbare Mischungen
JPS60240729A (ja) * 1984-05-14 1985-11-29 Mitsubishi Gas Chem Co Inc 硬化性樹脂組成物
US4740584A (en) * 1986-09-08 1988-04-26 Interez, Inc. Blend of dicyanate esters of dihydric phenols
US5260121A (en) * 1986-11-06 1993-11-09 Amoco Corporation Fiber-reinforced composite of cyanate ester, epoxy resin and thermoplast
EP0369527A3 (de) * 1988-11-14 1992-04-01 Shell Internationale Researchmaatschappij B.V. Härtbare Harzzusammensetzungen
JP3008992B2 (ja) * 1991-04-15 2000-02-14 三菱瓦斯化学株式会社 耐熱性レジンダスト
CA2070944A1 (en) * 1991-06-11 1992-12-12 Cynthia A. Arnold Inorganic oxide modified cyanate resin bodies
JPH05301852A (ja) * 1991-12-27 1993-11-16 Kanegafuchi Chem Ind Co Ltd シアン酸エステルおよびシアン酸エステルプレポリマーならびにそれから製造した電気用積層板

Also Published As

Publication number Publication date
EP0612783A1 (de) 1994-08-31
DE69418238D1 (de) 1999-06-10
TW358825B (en) 1999-05-21
EP0612783B1 (de) 1999-05-06
MY110194A (en) 1998-02-28
US5563237A (en) 1996-10-08
CA2115409A1 (en) 1994-08-24
KR940019807A (ko) 1994-09-15
KR100312003B1 (ko) 2002-08-24
DE69418238T2 (de) 1999-09-30

Similar Documents

Publication Publication Date Title
EP0578056A3 (en) Thermoplastic resin composition and laminates thereof
GB2278845B (en) Resin composition
ZA944071B (en) Laminated films
GB2281830B (en) I/q-modulator and i/q-demodulator
GB2277481B (en) Laminate film and method of producing the same
SG50438A1 (en) Composite board
GB2273818B (en) Composite electronic component
ZA945883B (en) Composite board
SG45135A1 (en) Cyanate resin composition and copper-clad laminate
GB9317631D0 (en) Multi-layered composite
GB9315201D0 (en) Adhesive films
SG43232A1 (en) Cyanate resin composition and copper-clad laminate using the composition
IL108739A0 (en) Board and manufacture thereof
SG45134A1 (en) Epoxy resin composition and copper-clad laminate
EP0645439A3 (de) Laminierkleberzusammensetzung.
GB9309979D0 (en) Bicycle and components thereof
GB2275682B (en) Epoxy resin and epoxy resin composition
AU5636894A (en) Laminate structure and process
GB9303185D0 (en) Composite panel
GB9313045D0 (en) Printing and laminating
GB2280137B (en) Composite articles
KR970002838Y1 (en) Composite form panel
ZA949242B (en) Composite panels
GB9316498D0 (en) Composite panels
GB9320946D0 (en) Detectable components