GB2273818B - Composite electronic component - Google Patents

Composite electronic component

Info

Publication number
GB2273818B
GB2273818B GB9326361A GB9326361A GB2273818B GB 2273818 B GB2273818 B GB 2273818B GB 9326361 A GB9326361 A GB 9326361A GB 9326361 A GB9326361 A GB 9326361A GB 2273818 B GB2273818 B GB 2273818B
Authority
GB
United Kingdom
Prior art keywords
electronic component
composite electronic
composite
component
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
GB9326361A
Other versions
GB9326361D0 (en
GB2273818A (en
Inventor
Harufumi Mandai
Noboru Kato
Koji Shiroki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of GB9326361D0 publication Critical patent/GB9326361D0/en
Publication of GB2273818A publication Critical patent/GB2273818A/en
Application granted granted Critical
Publication of GB2273818B publication Critical patent/GB2273818B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/17—Structural details of sub-circuits of frequency selective networks
    • H03H7/1741—Comprising typical LC combinations, irrespective of presence and location of additional resistors
    • H03H7/1766—Parallel LC in series path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/17—Structural details of sub-circuits of frequency selective networks
    • H03H7/1716—Comprising foot-point elements
    • H03H7/1725—Element to ground being common to different shunt paths, i.e. Y-structure
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/17—Structural details of sub-circuits of frequency selective networks
    • H03H7/1741—Comprising typical LC combinations, irrespective of presence and location of additional resistors
    • H03H7/1783—Combined LC in series path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H03H2001/0021—Constructional details
    • H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0239—Signal transmission by AC coupling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1003—Non-printed inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Filters And Equalizers (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
GB9326361A 1992-12-26 1993-12-23 Composite electronic component Expired - Lifetime GB2273818B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4358136A JP2822825B2 (en) 1992-12-26 1992-12-26 Composite electronic components

Publications (3)

Publication Number Publication Date
GB9326361D0 GB9326361D0 (en) 1994-02-23
GB2273818A GB2273818A (en) 1994-06-29
GB2273818B true GB2273818B (en) 1996-04-10

Family

ID=18457734

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9326361A Expired - Lifetime GB2273818B (en) 1992-12-26 1993-12-23 Composite electronic component

Country Status (3)

Country Link
JP (1) JP2822825B2 (en)
DE (1) DE4342818C2 (en)
GB (1) GB2273818B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19812836A1 (en) * 1998-03-24 1999-09-30 Pemetzrieder Neosid Inductive miniature component for SMD assembly
DE10064447C2 (en) 2000-12-22 2003-01-02 Epcos Ag Electrical multilayer component and interference suppression circuit with the component
KR100461719B1 (en) 2002-04-25 2004-12-14 삼성전기주식회사 Dielectric laminated filter
JP2004336250A (en) * 2003-05-02 2004-11-25 Taiyo Yuden Co Ltd Antenna matching circuit, and mobile communication apparatus and dielectric antenna having the same
JP3959091B2 (en) * 2004-12-15 2007-08-15 Ｔｄｋ株式会社 Surge absorption circuit
JP4908091B2 (en) * 2006-07-25 2012-04-04 ローム株式会社 Semiconductor device
DE102008004470A1 (en) 2007-12-05 2009-06-10 Rohde & Schwarz Gmbh & Co. Kg Electrical circuit arrangement with concentrated elements in multilayer substrates
WO2011158546A1 (en) * 2010-06-16 2011-12-22 株式会社村田製作所 Stacked filter
KR102048098B1 (en) * 2014-11-04 2019-11-22 삼성전기주식회사 Multi-layered chip component and board having the same mounted thereon
KR102048099B1 (en) * 2014-11-04 2019-11-22 삼성전기주식회사 Multi-layered chip component and board having the same mounted thereon

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1470695A (en) * 1973-06-16 1977-04-21 Sony Corp Electric band-pass wave filters including printed circuits
US4342143A (en) * 1974-02-04 1982-08-03 Jennings Thomas A Method of making multiple electrical components in integrated microminiature form
US5227739A (en) * 1990-12-20 1993-07-13 Murata Manufacturing Co., Ltd. Voltage controlled oscillator having a resonator

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE754515R (en) * 1969-08-06 1971-02-08 Siemens Ag NETWORK
US3721871A (en) * 1969-08-12 1973-03-20 J Heron High voltage monolithic ceramic capacitor
DE2515747C2 (en) * 1975-04-10 1982-07-01 Draloric Electronic GmbH, 8500 Nürnberg Multiple capacitor, for use in communication cables
JPS609220U (en) * 1983-06-28 1985-01-22 株式会社村田製作所 LC composite parts
JPH0693589B2 (en) * 1989-03-23 1994-11-16 株式会社村田製作所 LC filter

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1470695A (en) * 1973-06-16 1977-04-21 Sony Corp Electric band-pass wave filters including printed circuits
US4342143A (en) * 1974-02-04 1982-08-03 Jennings Thomas A Method of making multiple electrical components in integrated microminiature form
US5227739A (en) * 1990-12-20 1993-07-13 Murata Manufacturing Co., Ltd. Voltage controlled oscillator having a resonator

Also Published As

Publication number Publication date
DE4342818C2 (en) 2001-06-28
GB9326361D0 (en) 1994-02-23
JPH06204397A (en) 1994-07-22
JP2822825B2 (en) 1998-11-11
GB2273818A (en) 1994-06-29
DE4342818A1 (en) 1994-06-30

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Legal Events

Date Code Title Description
PE20 Patent expired after termination of 20 years

Expiry date: 20131222