JPH06204397A - Compound electronic parts - Google Patents
Compound electronic partsInfo
- Publication number
- JPH06204397A JPH06204397A JP35813692A JP35813692A JPH06204397A JP H06204397 A JPH06204397 A JP H06204397A JP 35813692 A JP35813692 A JP 35813692A JP 35813692 A JP35813692 A JP 35813692A JP H06204397 A JPH06204397 A JP H06204397A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- capacitor
- electrodes
- capacitor electrode
- capacitance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 150000001875 compounds Chemical class 0.000 title abstract 2
- 239000003990 capacitor Substances 0.000 claims abstract description 88
- 239000002131 composite material Substances 0.000 claims description 6
- 239000003989 dielectric material Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 10
- 238000009966 trimming Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/17—Structural details of sub-circuits of frequency selective networks
- H03H7/1741—Comprising typical LC combinations, irrespective of presence and location of additional resistors
- H03H7/1766—Parallel LC in series path
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/17—Structural details of sub-circuits of frequency selective networks
- H03H7/1716—Comprising foot-point elements
- H03H7/1725—Element to ground being common to different shunt paths, i.e. Y-structure
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/17—Structural details of sub-circuits of frequency selective networks
- H03H7/1741—Comprising typical LC combinations, irrespective of presence and location of additional resistors
- H03H7/1783—Combined LC in series path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H2001/0021—Constructional details
- H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0239—Signal transmission by AC coupling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09672—Superposed layout, i.e. in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1003—Non-printed inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Filters And Equalizers (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】この発明は複合電子部品に関し、
特にたとえば、内部に静電容量を形成した本体にインダ
クタやICなどの電子部品を取り付けた複合電子部品に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite electronic component,
In particular, for example, it relates to a composite electronic component in which electronic components such as an inductor and an IC are attached to a main body having a capacitance formed therein.
【0002】[0002]
【従来の技術】図9はこの発明の背景となる従来のLC
フィルタの一例を示す分解斜視図である。LCフィルタ
1は、誘電体からなる複数の層2から構成される。これ
らの層2上には、それぞれ、接地用電極3,コンデンサ
用電極4,5,コンデンサ用電極6,コンデンサ用電極
7が形成される。接地用電極3の中央部には空洞部が形
成され、さらに接地用電極3は層2の両端部に引き出さ
れる。コンデンサ用電極4,5は接地用電極3に対向す
るように形成され、接地用電極3とコンデンサ用電極
4,5との間に静電容量が形成される。2. Description of the Related Art FIG. 9 shows a conventional LC which is the background of the present invention.
It is an exploded perspective view showing an example of a filter. The LC filter 1 is composed of a plurality of layers 2 made of a dielectric material. On these layers 2, a ground electrode 3, a capacitor electrode 4,5, a capacitor electrode 6, and a capacitor electrode 7 are formed, respectively. A cavity is formed in the center of the grounding electrode 3, and the grounding electrode 3 is led out to both ends of the layer 2. The capacitor electrodes 4 and 5 are formed so as to face the ground electrode 3, and an electrostatic capacitance is formed between the ground electrode 3 and the capacitor electrodes 4 and 5.
【0003】コンデンサ用電極6は、コンデンサ用電極
4に対向するように形成され、さらにコンデンサ用電極
5の引き出し部に対応する位置に引き出される。したが
って、コンデンサ用電極4とコンデンサ用電極6との間
に、静電容量が形成される。コンデンサ用電極7は、コ
ンデンサ用電極6に対向する位置に形成され、さらにコ
ンデンサ用電極4の引き出し部に対応する位置に引き出
される。したがって、コンデンサ用電極6とコンデンサ
用電極7との間に、静電容量が形成される。The capacitor electrode 6 is formed so as to face the capacitor electrode 4, and is further drawn to a position corresponding to the lead portion of the capacitor electrode 5. Therefore, an electrostatic capacitance is formed between the capacitor electrode 4 and the capacitor electrode 6. The capacitor electrode 7 is formed at a position facing the capacitor electrode 6, and is further drawn to a position corresponding to the lead portion of the capacitor electrode 4. Therefore, an electrostatic capacitance is formed between the capacitor electrode 6 and the capacitor electrode 7.
【0004】さらに、最上部の層2には、2つの接続電
極8a,8bが形成される。接続電極8a,8bは、そ
れぞれ2つのコンデンサ用電極4,5の引き出し部に対
応する位置に引き出される。これらの接続電極8a,8
b間に、たとえばインダクタ9が接続される。そして、
外部電極によって、コンデンサ用電極4,7,接続電極
8aが接続され、コンデンサ用電極5,6,接続電極8
bが接続される。Further, two connection electrodes 8a and 8b are formed on the uppermost layer 2. The connection electrodes 8a and 8b are drawn out to the positions corresponding to the drawn-out portions of the two capacitor electrodes 4 and 5, respectively. These connection electrodes 8a, 8
For example, the inductor 9 is connected between b. And
The capacitor electrodes 4, 7 and the connection electrode 8a are connected by the external electrodes, and the capacitor electrodes 5, 6, and the connection electrode 8 are connected.
b is connected.
【0005】このLCフィルタ1は、図10(A)に示
すように、静電容量の並列回路を有する。この並列回路
は、図10(B)に示すように、等価的に1つの静電容
量で表すことができる。そして、この静電容量と並列に
インダクタンスが接続され、共振回路となっている。こ
の共振回路が、2つの静電容量を介して接地されてい
る。As shown in FIG. 10A, the LC filter 1 has a capacitance parallel circuit. This parallel circuit can be equivalently represented by one capacitance, as shown in FIG. Then, an inductance is connected in parallel with this electrostatic capacitance to form a resonance circuit. This resonance circuit is grounded via two capacitances.
【0006】[0006]
【発明が解決しようとする課題】しかしながら、このよ
うなLCフィルタでは、コンデンサ用電極6の引き出し
部が長い。そのため、この引き出し部に不要なインダク
タンスが発生し、図10(A)および図10(B)に示
すように、このインダクタンスが静電容量に直列に接続
される。このような不要なインダクタンスのために、所
望の特性を得ることができない。そこで、不要なインダ
クタンスの発生を抑えるために、スルーホールを形成し
て、このスルーホールを介して電極間を接続することが
考えられる。ところが、LCフィルタを製造するとき
に、スルーホールの形成工程が必要となり、製造が煩雑
となる。However, in such an LC filter, the lead-out portion of the capacitor electrode 6 is long. Therefore, unnecessary inductance is generated in this lead portion, and this inductance is connected in series with the capacitance as shown in FIGS. 10 (A) and 10 (B). Due to such unnecessary inductance, desired characteristics cannot be obtained. Therefore, in order to suppress the generation of unnecessary inductance, it is conceivable to form a through hole and connect the electrodes via the through hole. However, when manufacturing the LC filter, a through hole forming step is required, which makes the manufacturing complicated.
【0007】また、このLCフィルタでは、内部に形成
された電極によって静電容量が形成されているため、所
望の容量を得ることが困難である。このようなLC共振
回路では、容量ばらつきは2%以下であることが要求さ
れるが、図9に示す構造では、5%程度のばらつきが生
じる。Further, in this LC filter, it is difficult to obtain a desired capacitance because the capacitance is formed by the electrodes formed inside. In such an LC resonant circuit, the capacitance variation is required to be 2% or less, but the structure shown in FIG. 9 causes a variation of about 5%.
【0008】それゆえに、この発明の主たる目的は、不
要なインダクタンスが発生しにくく、容量ばらつきの小
さいコンデンサを有する複合電子部品を提供することで
ある。Therefore, a main object of the present invention is to provide a composite electronic component having a capacitor in which unnecessary inductance is unlikely to occur and whose capacitance variation is small.
【0009】[0009]
【課題を解決するための手段】この発明は、誘電体で形
成された本体と、本体内に形成され本体の端部に最短距
離で引き出される複数のコンデンサ用電極と、本体内に
おいて2つ以上のコンデンサ用電極に共通して対向する
ことによって静電容量の直列回路が形成される共通電極
と、静電容量に接続される電子部品とを含み、本体内に
おいて静電容量の直列回路が複数並列接続された、複合
電子部品である。According to the present invention, there is provided a main body made of a dielectric material, a plurality of capacitor electrodes formed in the main body and drawn out to the end of the main body at the shortest distance, and two or more electrodes in the main body. A plurality of series circuits of capacitance are included in the main body, including a common electrode in which a series circuit of capacitance is formed by facing in common to the capacitor electrode of, and an electronic component connected to the capacitance. It is a composite electronic component connected in parallel.
【0010】[0010]
【作用】共通電極が複数のコンデンサ用電極に共通して
対向することにより、静電容量の直列回路が複数形成さ
れ、さらにこれらの直列回路が並列接続される。静電容
量を直列接続すると、合成された静電容量は小さくな
り、容量ばらつきを小さくすることができる。さらに、
静電容量の直列回路を並列接続すると、合成された静電
容量は大きくなり、所望の容量値を得ることができる。With the common electrode facing the plurality of capacitor electrodes in common, a plurality of capacitance series circuits are formed, and these series circuits are connected in parallel. When the electrostatic capacitances are connected in series, the combined electrostatic capacitance becomes small and the variation in capacitance can be made small. further,
When a series circuit of electrostatic capacitances is connected in parallel, the combined electrostatic capacitance becomes large and a desired capacitance value can be obtained.
【0011】さらに、コンデンサ用電極からの引き出し
部を最短距離にすることにより、引き出し部における不
要なインダクタンスの発生を最小限に抑えることができ
る。Furthermore, by making the lead portion from the capacitor electrode the shortest distance, it is possible to minimize the generation of unnecessary inductance in the lead portion.
【0012】[0012]
【発明の効果】この発明によれば、静電容量の直列接続
により、容量ばらつきを小さくすることができる。した
がって、容量ばらつきの小さい静電容量を並列接続すれ
ば、ばらつきの少ない所望の容量値を得ることができ
る。さらに、不要なインダクタンスを最小限に抑えるこ
とができるため、ほぼ設計通りの特性を得ることができ
る。According to the present invention, the capacitance variation can be reduced by connecting the capacitances in series. Therefore, a desired capacitance value with less variation can be obtained by connecting in parallel capacitances with less variation in capacity. Further, since unnecessary inductance can be suppressed to a minimum, it is possible to obtain characteristics almost as designed.
【0013】この発明の上述の目的,その他の目的,特
徴および利点は、図面を参照して行う以下の実施例の詳
細な説明から一層明らかとなろう。The above-mentioned objects, other objects, features and advantages of the present invention will become more apparent from the following detailed description of the embodiments with reference to the drawings.
【0014】[0014]
【実施例】図1はこの発明の一実施例を示す斜視図であ
る。この実施例では、複合電子部品の例として、LCフ
ィルタについて説明する。LCフィルタ10は、誘電体
で形成された本体12を含む。本体12は、図2に示す
ように、複数の層で構成される。第1の層14上には、
接地用電極16が形成される。接地用電極16は、第1
の層14のほぼ全面に形成され、その中央部に空洞部1
8が形成される。さらに、接地用電極16は、第1の層
14の対向する端部に引き出される。1 is a perspective view showing an embodiment of the present invention. In this embodiment, an LC filter will be described as an example of a composite electronic component. The LC filter 10 includes a body 12 formed of a dielectric material. The main body 12 is composed of a plurality of layers, as shown in FIG. On the first layer 14,
The ground electrode 16 is formed. The ground electrode 16 is the first
Is formed on almost the entire surface of the layer 14 and the cavity 1 is formed in the center thereof.
8 is formed. Further, the ground electrode 16 is drawn out to the opposite end portion of the first layer 14.
【0015】接地用電極16上には、第2の層20が積
層される。第2の層20上には、第1のコンデンサ用電
極22および第2のコンデンサ用電極24が形成され
る。第1のコンデンサ用電極22および第2のコンデン
サ用電極24は、それぞれ空洞部18を挟んで接地用電
極16に対向するように形成される。そして、第1のコ
ンデンサ用電極22および第2のコンデンサ用電極24
は、第2の層20の一方端側に引き出される。A second layer 20 is laminated on the ground electrode 16. A first capacitor electrode 22 and a second capacitor electrode 24 are formed on the second layer 20. The first capacitor electrode 22 and the second capacitor electrode 24 are formed so as to face the ground electrode 16 with the cavity 18 interposed therebetween. Then, the first capacitor electrode 22 and the second capacitor electrode 24
Are drawn to the one end side of the second layer 20.
【0016】第1のコンデンサ用電極22および第2の
コンデンサ用電極24の上には、第3の層26が積層さ
れる。第3の層26の中央部には、共通電極28が形成
される。共通電極28は、第1のコンデンサ用電極22
および第2のコンデンサ用電極24の両方に対向するよ
うに形成される。A third layer 26 is laminated on the first capacitor electrode 22 and the second capacitor electrode 24. A common electrode 28 is formed in the center of the third layer 26. The common electrode 28 is the first capacitor electrode 22.
And the second capacitor electrode 24.
【0017】共通電極28上には、第4の層30が積層
される。第4の層30上には、第3のコンデンサ用電極
32および第4のコンデンサ用電極34が形成される。
第3のコンデンサ用電極32および第4のコンデンサ用
電極34は、それぞれ第1のコンデンサ用電極22およ
び第2のコンデンサ用電極24に対向する位置に形成さ
れる。したがって、共通電極28は、第3のコンデンサ
用電極32および第4のコンデンサ用電極34の両方に
共通して対向する。これらの第3のコンデンサ用電極3
2および第4のコンデンサ用電極34も、第4の層30
の一方端側に引き出される。A fourth layer 30 is laminated on the common electrode 28. A third capacitor electrode 32 and a fourth capacitor electrode 34 are formed on the fourth layer 30.
The third capacitor electrode 32 and the fourth capacitor electrode 34 are formed at positions facing the first capacitor electrode 22 and the second capacitor electrode 24, respectively. Therefore, the common electrode 28 is opposed to both the third capacitor electrode 32 and the fourth capacitor electrode 34 in common. These third capacitor electrodes 3
The second and fourth capacitor electrodes 34 are also connected to the fourth layer 30.
Is pulled out to one end side.
【0018】第3のコンデンサ用電極32および第4の
コンデンサ用電極34の上には、第5の層36が積層さ
れる。第5の層36上には、2つの接続電極38,40
が形成される。これらの接続電極38,40は、第5の
層36の一方端側に引き出される。そして、接続電極3
8,40間には、インダクタ42が接続される。A fifth layer 36 is laminated on the third capacitor electrode 32 and the fourth capacitor electrode 34. Two connection electrodes 38, 40 are provided on the fifth layer 36.
Is formed. These connection electrodes 38 and 40 are drawn out to the one end side of the fifth layer 36. And the connection electrode 3
An inductor 42 is connected between 8 and 40.
【0019】これらの第1の層14〜第5の層36は一
体化され、その側面には外部電極44a,44b,44
c,44dが形成される。外部電極44aは、第1のコ
ンデンサ用電極22,第3のコンデンサ用電極32およ
び接続電極38に接続される。また、外部電極44c
は、第2のコンデンサ用電極24,第4のコンデンサ用
電極34および接続電極40に接続される。さらに、外
部電極44bおよび44dは、接地用電極16に接続さ
れる。These first layer 14 to fifth layer 36 are integrated, and external electrodes 44a, 44b, 44 are formed on the side surfaces thereof.
c, 44d are formed. The external electrode 44a is connected to the first capacitor electrode 22, the third capacitor electrode 32, and the connection electrode 38. Also, the external electrode 44c
Is connected to the second capacitor electrode 24, the fourth capacitor electrode 34, and the connection electrode 40. Further, the external electrodes 44b and 44d are connected to the ground electrode 16.
【0020】このLCフィルタ10では、図3(A)に
示すように、第1のコンデンサ用電極22と共通電極2
8との間に静電容量が形成され、第2のコンデンサ用電
極24と共通電極28との間にも静電容量が形成され
る。したがって、インダクタ42で形成されるインダク
タンスに並列に、静電容量の直列回路が接続される。さ
らに、第3のコンデンサ用電極32と共通電極28との
間に静電容量が形成され、第4のコンデンサ用電極34
と共通電極28との間にも静電容量が形成される。した
がって、インダクタ42で形成されるインダクタンスに
並列に、別の静電容量の直列回路が接続される。つま
り、このLCフィルタ10では、2つの静電容量の直列
回路とインダクタンスとが並列接続されている。さら
に、第1のコンデンサ用電極22と接地用電極16との
間および第2のコンデンサ用電極24と接地用電極16
との間に静電容量が形成される。したがって、インダク
タンスと静電容量とで形成される回路は、2つの静電容
量を介して接地される。In this LC filter 10, as shown in FIG. 3A, the first capacitor electrode 22 and the common electrode 2 are provided.
A capacitance is formed between the second capacitor electrode 24 and the common electrode 28. Therefore, a series circuit of capacitance is connected in parallel with the inductance formed by the inductor 42. Further, electrostatic capacitance is formed between the third capacitor electrode 32 and the common electrode 28, and the fourth capacitor electrode 34 is formed.
A capacitance is also formed between the common electrode 28 and the common electrode 28. Therefore, a series circuit of another capacitance is connected in parallel with the inductance formed by the inductor 42. That is, in this LC filter 10, a series circuit of two capacitances and an inductance are connected in parallel. Furthermore, between the first capacitor electrode 22 and the ground electrode 16 and between the second capacitor electrode 24 and the ground electrode 16
A capacitance is formed between and. Therefore, the circuit formed by the inductance and the capacitance is grounded via the two capacitances.
【0021】図3(A)に示す回路は、等価的に図3
(B)に示す回路で表すことができる。図3(B)で
は、図3(A)の4つの静電容量が1つの静電容量で表
されているが、これは図3(A)の4つの静電容量の合
成容量を表す。このLCフィルタ10では、インダクタ
ンスと静電容量との並列回路によって、共振回路が形成
されている。静電容量が直列接続されると、その合成容
量は小さくなる。したがって、コンデンサ用電極と共通
電極との間に形成される静電容量にばらつきがあって
も、直列接続にすることによって、誤差を小さくするこ
とができる。さらに、静電容量の直列回路を並列接続す
ることによって、大きい合成容量を得ることができる。
したがって、所望の静電容量を得ることができる。しか
も、ばらつきの小さい静電容量を合成しているため、全
体としての合成容量もばらつきの小さいものとなってい
る。The circuit shown in FIG. 3A is equivalently shown in FIG.
It can be represented by the circuit shown in FIG. In FIG. 3B, the four capacitances of FIG. 3A are represented by one capacitance, which represents a combined capacitance of the four capacitances of FIG. 3A. In this LC filter 10, a resonance circuit is formed by a parallel circuit of an inductance and an electrostatic capacitance. When the capacitances are connected in series, the combined capacitance becomes small. Therefore, even if the capacitance formed between the capacitor electrode and the common electrode varies, the error can be reduced by connecting in series. Furthermore, a large combined capacitance can be obtained by connecting a series circuit of capacitances in parallel.
Therefore, a desired capacitance can be obtained. Moreover, since the electrostatic capacities with small variations are combined, the combined capacity as a whole also has small fluctuations.
【0022】また、このLCフィルタ10では、コンデ
ンサ用電極22,24,32,34や接地用電極16の
引き出し部が、最短距離で各層の端部に引き出されてい
る。したがって、これらの電極の引き出し部に発生する
インダクタンスを最小限に抑えることができる。このよ
うに、静電容量のばらつきが小さく、不要なインダクタ
ンスの発生が少ないため、ほぼ設計通りの特性を得るこ
とができる。しかも、静電容量のばらつきが少ないた
め、調整のためのトリミングなどの作業を行う必要がな
くなる。Further, in this LC filter 10, the lead-out portions of the capacitor electrodes 22, 24, 32, 34 and the grounding electrode 16 are led out to the end portion of each layer at the shortest distance. Therefore, the inductance generated in the lead-out portions of these electrodes can be minimized. In this way, the variation in capacitance is small and the generation of unnecessary inductance is small, so that the characteristics almost as designed can be obtained. Moreover, since there is little variation in electrostatic capacitance, it is not necessary to perform work such as trimming for adjustment.
【0023】また、図4(A)および図4(B)に示す
ように、接地用電極16をインダクンタンスを介して接
地することにより、2次の遅延等価器を作製することが
できる。図4(B)に示す回路では、3つの静電容量が
Δ結線されている。As shown in FIGS. 4 (A) and 4 (B), the grounding electrode 16 is grounded via the inductance to make a second-order delay equalizer. In the circuit shown in FIG. 4B, three capacitances are Δ-connected.
【0024】図5は、ハイパスフィルタを示す分解斜視
図である。このハイパスフィルタ50では、第1の層5
2上に、第1,第2および第3のコンデンサ用電極5
4,56,58が形成される。また、第2の層60上に
は、2つの共通電極62,64が形成される。共通電極
62はコンデンサ用電極54,56に共通して対向する
ように形成され、共通電極64はコンデンサ用電極5
6,58に共通して対向するように形成される。FIG. 5 is an exploded perspective view showing the high pass filter. In this high pass filter 50, the first layer 5
2 on the first, second and third capacitor electrodes 5
4, 56, 58 are formed. Further, two common electrodes 62 and 64 are formed on the second layer 60. The common electrode 62 is formed so as to face the capacitor electrodes 54 and 56 in common, and the common electrode 64 is the capacitor electrode 5.
6, 58 are formed so as to face each other.
【0025】さらに、第3の層66上には、第4,第5
および第6のコンデンサ用電極68,70,72が形成
される。これらのコンデンサ用電極68,70,72
は、それぞれコンデンサ用電極54,56,58に対向
する位置に形成される。また、第4の層74上には接続
電極76,78が形成され、この接続電極76,78に
インダクタ80が接続される。そして、外部電極によっ
て第1のコンデンサ用電極54,第4のコンデンサ用電
極68が接続され、第2のコンデンサ用電極56,第5
のコンデンサ用電極70,接続電極76が接続され、第
3のコンデンサ用電極58,第6のコンデンサ用電極7
2が接続される。そして、接続電極78は接地される。Further, on the third layer 66, the fourth and fifth layers are formed.
And the sixth capacitor electrodes 68, 70, 72 are formed. These capacitor electrodes 68, 70, 72
Are formed at positions facing the capacitor electrodes 54, 56, and 58, respectively. Further, connection electrodes 76 and 78 are formed on the fourth layer 74, and the inductor 80 is connected to the connection electrodes 76 and 78. Then, the first capacitor electrode 54 and the fourth capacitor electrode 68 are connected by the external electrode, and the second capacitor electrode 56 and the fifth capacitor electrode 56 are connected.
The capacitor electrode 70 and the connection electrode 76 are connected to each other, and the third capacitor electrode 58 and the sixth capacitor electrode 7 are connected.
2 are connected. Then, the connection electrode 78 is grounded.
【0026】このハイパスフィルタ50では、対向する
コンデンサ用電極と共通電極との間に静電容量が形成さ
れるため、図6(A)および図6(B)に示すように、
T型のハイパスフィルタになっている。このハイパスフ
ィルタ50においても、図1および図2に示すLCフィ
ルタと同様に、所望の静電容量を有し、容量ばらつきが
小さく、かつ不要なインダクタンスの発生が少ない。し
たがって、トリミングなどの作業を行うことなく、ほぼ
設計通りの特性を得ることができる。In this high-pass filter 50, since an electrostatic capacitance is formed between the opposing capacitor electrode and common electrode, as shown in FIGS. 6 (A) and 6 (B),
It is a T-type high-pass filter. Similar to the LC filter shown in FIGS. 1 and 2, the high-pass filter 50 also has a desired electrostatic capacitance, has a small capacitance variation, and generates less unnecessary inductance. Therefore, it is possible to obtain characteristics almost as designed without performing a work such as trimming.
【0027】図7はアクティブフィルタの例を示す分解
斜視図である。このアクティブフィルタ90では、図5
に示す本体の第1の層に第5の層92が積層される。こ
の第5の層92には、第2のコンデンサ用電極56に対
向する位置に、第7のコンデンサ用電極94が形成され
る。さらに、第4の層74には、オペアンプ96および
2つの抵抗98,100が取り付けられる。このアクテ
ィブフィルタ90は、図8(A)および図8(B)に示
す回路を有している。このアクティブフィルタ90にお
いても、所望の静電容量を有し、容量ばらつきが小さ
く、かつ不要なインダクタンスの発生が少ない。したが
って、トリミングなどの作業を行うことなく、ほぼ設計
通りの特性を得ることができる。FIG. 7 is an exploded perspective view showing an example of the active filter. The active filter 90 shown in FIG.
A fifth layer 92 is laminated to the first layer of the body shown in FIG. A seventh capacitor electrode 94 is formed on the fifth layer 92 at a position facing the second capacitor electrode 56. Further, an operational amplifier 96 and two resistors 98 and 100 are attached to the fourth layer 74. The active filter 90 has the circuits shown in FIGS. 8 (A) and 8 (B). The active filter 90 also has a desired electrostatic capacity, a small capacity variation, and a small amount of unnecessary inductance. Therefore, it is possible to obtain characteristics almost as designed without performing a work such as trimming.
【図1】この発明の一実施例としてのLCフィルタを示
す斜視図である。FIG. 1 is a perspective view showing an LC filter as an embodiment of the present invention.
【図2】図1に示すLCフィルタに用いられる本体の分
解斜視図である。FIG. 2 is an exploded perspective view of a main body used in the LC filter shown in FIG.
【図3】(A)は図1および図2に示すLCフィルタの
等価回路図であり、(B)はその一部を合成した等価回
路図である。FIG. 3A is an equivalent circuit diagram of the LC filter shown in FIGS. 1 and 2, and FIG. 3B is an equivalent circuit diagram obtained by combining a part thereof.
【図4】(A)はこの発明の他の実施例としての遅延等
価器を示す等価回路図であり、(B)はその一部を合成
した等価回路図である。FIG. 4A is an equivalent circuit diagram showing a delay equalizer as another embodiment of the present invention, and FIG. 4B is an equivalent circuit diagram obtained by combining a part thereof.
【図5】この発明のさらに他の実施例としてのハイパス
フィルタを示す分解斜視図である。FIG. 5 is an exploded perspective view showing a high pass filter as still another embodiment of the present invention.
【図6】(A)は図5に示すハイパスフィルタの等価回
路図であり、(B)はその一部を合成した等価回路図で
ある。6A is an equivalent circuit diagram of the high-pass filter shown in FIG. 5, and FIG. 6B is an equivalent circuit diagram obtained by combining a part thereof.
【図7】この発明の別の実施例としてのアクティブフィ
ルタを示す分解斜視図である。FIG. 7 is an exploded perspective view showing an active filter as another embodiment of the present invention.
【図8】(A)は図7に示すアクティブフィルタの等価
回路図であり、(B)はその一部を合成した等価回路図
である。8A is an equivalent circuit diagram of the active filter shown in FIG. 7, and FIG. 8B is an equivalent circuit diagram obtained by combining a part thereof.
【図9】この発明の背景となる従来のLCフィルタの一
例を示す分解斜視図である。FIG. 9 is an exploded perspective view showing an example of a conventional LC filter which is the background of the present invention.
【図10】(A)は図9に示す従来のLCフィルタの等
価回路図であり、(B)はその一部を合成した等価回路
図である。10A is an equivalent circuit diagram of the conventional LC filter shown in FIG. 9, and FIG. 10B is an equivalent circuit diagram obtained by combining a part thereof.
10 LCフィルタ 12 本体 14 第1の層 20 第2の層 22 第1のコンデンサ用電極 24 第2のコンデンサ用電極 26 第3の層 28 共通電極 30 第4の層 32 第3のコンデンサ用電極 34 第4のコンデンサ用電極 36 第5の層 42 インダクタ 50 ハイパスフィルタ 90 アクティブフィルタ 10 LC Filter 12 Main Body 14 First Layer 20 Second Layer 22 First Capacitor Electrode 24 Second Capacitor Electrode 26 Third Layer 28 Common Electrode 30 Fourth Layer 32 Third Capacitor Electrode 34 Fourth capacitor electrode 36 Fifth layer 42 Inductor 50 High-pass filter 90 Active filter
Claims (1)
出される複数のコンデンサ用電極、 前記本体内において2つ以上の前記コンデンサ用電極に
共通して対向することによって静電容量の直列回路が形
成される共通電極、および前記静電容量に接続される電
子部品を含み、 前記本体内において前記静電容量の直列回路が複数並列
接続された、複合電子部品。1. A main body formed of a dielectric material, a plurality of capacitor electrodes formed in the main body and drawn out to an end portion of the main body at the shortest distance, and common to two or more capacitor electrodes in the main body. A plurality of series circuits of the capacitance are connected in parallel in the main body, including a common electrode in which a series circuit of the capacitance is formed by facing each other, and an electronic component connected to the capacitance. , Composite electronic components.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4358136A JP2822825B2 (en) | 1992-12-26 | 1992-12-26 | Composite electronic components |
DE19934342818 DE4342818C2 (en) | 1992-12-26 | 1993-12-15 | Composite electronic component |
GB9326361A GB2273818B (en) | 1992-12-26 | 1993-12-23 | Composite electronic component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4358136A JP2822825B2 (en) | 1992-12-26 | 1992-12-26 | Composite electronic components |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH06204397A true JPH06204397A (en) | 1994-07-22 |
JP2822825B2 JP2822825B2 (en) | 1998-11-11 |
Family
ID=18457734
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4358136A Expired - Lifetime JP2822825B2 (en) | 1992-12-26 | 1992-12-26 | Composite electronic components |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2822825B2 (en) |
DE (1) | DE4342818C2 (en) |
GB (1) | GB2273818B (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008028282A (en) * | 2006-07-25 | 2008-02-07 | Rohm Co Ltd | Semiconductor device |
CN100454758C (en) * | 2004-12-15 | 2009-01-21 | Tdk株式会社 | Surge absorption circuit and laminated surge absorption device |
WO2011158546A1 (en) * | 2010-06-16 | 2011-12-22 | 株式会社村田製作所 | Stacked filter |
KR20160052108A (en) * | 2014-11-04 | 2016-05-12 | 삼성전기주식회사 | Multi-layered chip component and board having the same mounted thereon |
KR20160052110A (en) * | 2014-11-04 | 2016-05-12 | 삼성전기주식회사 | Multi-layered chip component and board having the same mounted thereon |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19812836A1 (en) * | 1998-03-24 | 1999-09-30 | Pemetzrieder Neosid | Inductive miniature component for SMD assembly |
DE10064447C2 (en) | 2000-12-22 | 2003-01-02 | Epcos Ag | Electrical multilayer component and interference suppression circuit with the component |
KR100461719B1 (en) | 2002-04-25 | 2004-12-14 | 삼성전기주식회사 | Dielectric laminated filter |
JP2004336250A (en) * | 2003-05-02 | 2004-11-25 | Taiyo Yuden Co Ltd | Antenna matching circuit, and mobile communication apparatus and dielectric antenna having the same |
DE102008004470A1 (en) | 2007-12-05 | 2009-06-10 | Rohde & Schwarz Gmbh & Co. Kg | Electrical circuit arrangement with concentrated elements in multilayer substrates |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE754515R (en) * | 1969-08-06 | 1971-02-08 | Siemens Ag | NETWORK |
US3721871A (en) * | 1969-08-12 | 1973-03-20 | J Heron | High voltage monolithic ceramic capacitor |
US4063201A (en) * | 1973-06-16 | 1977-12-13 | Sony Corporation | Printed circuit with inductively coupled printed coil elements and a printed element forming a mutual inductance therewith |
US4342143A (en) * | 1974-02-04 | 1982-08-03 | Jennings Thomas A | Method of making multiple electrical components in integrated microminiature form |
DE2515747C2 (en) * | 1975-04-10 | 1982-07-01 | Draloric Electronic GmbH, 8500 Nürnberg | Multiple capacitor, for use in communication cables |
JPS609220U (en) * | 1983-06-28 | 1985-01-22 | 株式会社村田製作所 | LC composite parts |
JPH0693589B2 (en) * | 1989-03-23 | 1994-11-16 | 株式会社村田製作所 | LC filter |
JP3088021B2 (en) * | 1990-12-20 | 2000-09-18 | 株式会社村田製作所 | Voltage controlled oscillator |
-
1992
- 1992-12-26 JP JP4358136A patent/JP2822825B2/en not_active Expired - Lifetime
-
1993
- 1993-12-15 DE DE19934342818 patent/DE4342818C2/en not_active Expired - Lifetime
- 1993-12-23 GB GB9326361A patent/GB2273818B/en not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100454758C (en) * | 2004-12-15 | 2009-01-21 | Tdk株式会社 | Surge absorption circuit and laminated surge absorption device |
JP2008028282A (en) * | 2006-07-25 | 2008-02-07 | Rohm Co Ltd | Semiconductor device |
WO2011158546A1 (en) * | 2010-06-16 | 2011-12-22 | 株式会社村田製作所 | Stacked filter |
KR20160052108A (en) * | 2014-11-04 | 2016-05-12 | 삼성전기주식회사 | Multi-layered chip component and board having the same mounted thereon |
KR20160052110A (en) * | 2014-11-04 | 2016-05-12 | 삼성전기주식회사 | Multi-layered chip component and board having the same mounted thereon |
Also Published As
Publication number | Publication date |
---|---|
GB2273818B (en) | 1996-04-10 |
GB2273818A (en) | 1994-06-29 |
JP2822825B2 (en) | 1998-11-11 |
GB9326361D0 (en) | 1994-02-23 |
DE4342818A1 (en) | 1994-06-30 |
DE4342818C2 (en) | 2001-06-28 |
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