JP3116473B2 - Method for manufacturing reactance substrate and method for manufacturing dielectric filter - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dielectric filter using, for example, a reactance substrate and a coupling substrate constituting a capacitor or a coil. The present invention relates to a manufacturing method adapted to miniaturization.

[0002]

2. Description of the Related Art For example, when a capacitor substrate is manufactured, a method shown in FIGS. 16 and 17 is conventionally used. This is because a grid-shaped cut line A
The capacitor electrode 2 is formed by pattern printing etching or the like in each area defined by the cut line A, and the electrode 3 is formed on the entire lower surface of the mother substrate 1. Thereafter, the mother substrate 1 is cut along the cut line A, whereby a large number of capacitor substrates 1a are manufactured. Here, the capacitance C of the capacitor substrate 1a is
It is determined by the thickness, dielectric constant, and electrode area of the capacitor electrode 2 of the substrate 1a. In this case, there is a variation in the dielectric constant and the thickness between the lots when the capacitor electrodes 2 are formed on the respective mother substrates 1 and between lots. is there. For this reason, conventionally, the electrode area of the capacitor electrode 2 is set to be larger than a target capacitance value, and a part 2a of the capacitor electrode 2 is cut to adjust the capacitance. Also, in the dielectric filters as shown in FIGS. 18 and 19, conventionally, a coupling substrate manufactured by the above-described method is used. This dielectric filter 4
Has a coupling substrate 5 disposed on three stages of dielectric resonators R1 to R3, and a plurality of capacitor electrodes 6a to 6
e, the input / output terminal 7 is connected to the capacitor electrodes 6a and 6e at both ends, and the coupling terminals 8 of the dielectric resonators R1 to R3 are connected to the capacitor electrodes 6b to 6d at the center. And the resonators are coupled by a capacitor C. Also in the case of the dielectric filter 4, a part of each of the capacitor electrodes 6a to 6e of the coupling substrate 5 is trimmed and adjusted in order to eliminate the variation in capacitance.

[0003]

However, in the above-described conventional capacitor substrate and dielectric filter, a trimming operation for obtaining a target capacitance is required. There is a problem that productivity is low. Also, when manufacturing a conventional capacitor substrate, since the capacitor electrode is formed in a region defined by the cut line of the mother substrate, extra space is created at the peripheral portion of the capacitor substrate, and the size of the component increases accordingly. There are also problems.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional circumstances, and it is possible to improve the productivity by eliminating the need for adjusting the capacitance by trimming and to reduce the size of the substrate by eliminating an extra space. It is an object to provide a method and a method for manufacturing a dielectric filter.

[0005]

According to a first aspect of the present invention, there is provided an electrode forming step of forming a strip-shaped electrode on a mother substrate, and cutting the mother substrate to a predetermined size for each production lot of the mother substrate. A preparatory test step of forming a test substrate, calculating a cut size that is a target reactance value from the cut size and the reactance value of the preceding test substrate, and setting the calculated size as a cut size; And a cutting step of cutting the mother substrate. The invention according to claim 2 is an electrode forming step of forming a strip-shaped electrode on the mother substrate, and cutting the mother substrate to a predetermined size for each production lot of the mother substrate to form a preliminary test substrate, A cutting test step of calculating a cutting dimension that becomes a target reactance value from the reactance value of the preceding test board and setting the calculated dimension as a cutting dimension, and a cutting step of cutting the mother board for each cutting dimension And a method of manufacturing a dielectric filter using a reactance substrate manufactured by the method. According to a third aspect of the present invention, there is provided a method of manufacturing a dielectric filter, comprising the steps of: providing a coupling substrate on a plurality of dielectric resonators; and forming a capacitive electrode for capacitively coupling the resonators on the coupling substrate. An electrode forming step of forming a strip-shaped electrode on the mother substrate, cutting the mother substrate into a predetermined size for each production lot of the mother substrate to form a pre-test substrate, and determining the cut size and the capacitance value of the pre-test substrate. A preparatory test step of calculating a cutting dimension to be a target capacitance value and setting the calculated dimension as a cutting dimension, and a cutting step of cutting the mother substrate for each of the cutting dimensions, are manufactured by this. It is characterized in that a capacitor substrate is used as the coupling substrate.

[0006]

According to the method of manufacturing a reactance substrate according to claim 1, a preliminary test is performed for each production lot of the mother substrate,
Specifically, a pre-test substrate is formed by cutting into predetermined dimensions according to the dielectric constant, substrate thickness, inter-electrode dimension, electrode thickness, and the like, and a target is determined from the cut size and the reactance value of the pre-test substrate. The cutting dimensions were calculated to be the reactance value, and the calculated dimensions were set as the cut dimensions.By cutting the mother substrate along the set cut dimensions, a large number of the same reactance values were obtained. The reactance substrate can be easily and accurately manufactured. As a result, the conventional trimming operation can be omitted, and the productivity can be improved accordingly. Further, in the present invention, since the reactance substrate is manufactured by cutting the electrodes of the mother substrate, the electrodes formed by this are located up to both ends of the reactance substrate. As a result, it is possible to reduce the extra space as in the related art, to reduce the size of the components, and to increase the number of products manufactured per mother board. According to the method of manufacturing a dielectric filter according to the second and third aspects of the present invention, the substrate manufactured by the same method as the above-described manufacturing method is used as the coupling substrate. Productivity can be improved and parts can be downsized.

[0007]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 and 2 are views for explaining a method of manufacturing a reactance substrate according to the first aspect of the present invention. In this embodiment, a case where the present invention is applied to a capacitor substrate will be described as an example. In the figure, reference numeral 10 denotes a capacitor substrate of the present embodiment, which is a substrate main body 10a having a predetermined dielectric constant and thickness.
The electrode 11 is formed on the entire lower surface of the substrate 10 and the capacitor electrode 12 is formed on the upper surface of the substrate body 10a.
A capacity is obtained between the twelve. This capacitor substrate 10 is manufactured by the following procedure.

First, an entire surface electrode 14 is formed on the entire lower surface of the mother substrate 13 by, for example, printing.
A plurality of strip-shaped electrodes 15 extending over both end edges of the upper face 3 are formed in parallel with a predetermined gap t. Next, a cut line A is formed at the center of the gap t between the electrodes 15 of the mother substrate 13. Next, the mother substrate 1
A cut dimension W in the longitudinal direction of the electrode 15 is set from one end of the electrode 3, and a cut line A ′ is formed for each dimension W. The cut dimension W is set to a length according to the electrode area at which a target capacitance value is obtained. Specifically, for each manufacturing lot such as a substrate lot, a polishing lot, and an electrode forming lot of the mother substrate 13, predetermined dimensions are set according to the dielectric constant, substrate thickness, inter-electrode dimensions, electrode thickness, and the like of the mother substrate 13. The precut test board is formed by cutting, and the precut test is performed to calculate the cut dimension from the cut dimension and the reactance value of the precedent test board so as to obtain a target reactance value, thereby determining the cut dimension W. Then, the mother substrate 13 is cut along cut lines A and A '. Thus, a number of capacitor substrates 10 having the same capacitance value are formed. Here, the variation in the dielectric constant, the substrate thickness, the electrode size, and the like in each capacitor substrate 10 formed by the one mother substrate 13 is extremely small with respect to the required capacitance variation. No capacity adjustment is required. When the substrate lot, the polishing lot, or the electrode forming lot changes, a new preceding test is performed to set the cut size.

As described above, according to the present embodiment, the preliminary test is performed for each production lot of the mother substrate 13 so that
A cut dimension W for obtaining a desired capacitance value is set, and the mother board 13 is cut along the dimension W to form a large number of capacitor boards 10. Therefore, it is only necessary to set the cut dimension W by a preliminary test. A large number of capacitor substrates 10 having the same capacitance value can be manufactured, so that the conventional trimming operation can be omitted, and the productivity can be improved accordingly. Also,
In the present embodiment, since the capacitor substrate 10 is formed by cutting the electrode 15 of the mother substrate 13, extra space as in the related art can be reduced, and the dimension of the capacitor substrate 10 in the direction of the electrode 12 can be reduced. The components can be miniaturized, the number of capacitor substrates 10 manufactured from the mother substrate 13 can be increased, and the component cost can be reduced.

In the above embodiment, the case where one capacitor electrode 12 is formed on the substrate body 10a has been described as an example, but the present invention is not limited to this. FIGS. 3 to 7 are views for explaining a modification of the above embodiment. In the drawings, the same reference numerals as those in FIG. 1 denote the same or corresponding parts. FIG. 3A shows the mother substrate 13.
By forming a full-surface electrode on the lower surface of the substrate, forming two electrodes 16a and 16b having different electrode widths on the upper surface, and setting a cut dimension W for obtaining a target capacitance value of each of the electrodes 16a and 16b, This is an example in which a capacitor substrate is formed. FIG. 3B shows three electrodes 17 having different electrode widths on the mother substrate 13.
This is an example in which a, 17b, and 17c are formed, and the cut dimension W of each of the electrodes 17a to 17c is set to form a triple capacitor substrate.

FIG. 4 (a) and FIG. 4 (b)
A common electrode 18 is formed in the center of the lower surface of the mother substrate 13, and a pair of electrodes 19a and 19b are formed on the upper surface.
This is an example in which a capacitor substrate is formed by setting a cut dimension W of each electrode. FIG.
5 (a) and FIG. 5 (b) show the electrodes 20 at both ends and the center of the lower surface of the mother substrate 13 with spaces between them.
a, 20b, 20c are formed, and the electrodes 21a, 2c are formed at the center of the upper surface and at the portion facing the gap between the electrodes 20a to 20c.
This is an example of forming a capacitor substrate by forming 1b and 21c.

FIG. 6 (a) and FIG. 6 (b)
Electrodes 22a and 22b are formed at both ends of the lower surface of the mother substrate 13, and electrodes 23a and 23b are formed at both ends and the center of the upper surface.
This is an example in which b and 23c are formed and a gap capacitance is formed between the electrodes 23a to 23c.

FIGS. 7A and 7B show an example in which a saw-tooth or spiral gap t is formed on a mother substrate 13 to form an electrode 24 and an electrode 25, respectively. In any of the above-described modifications, a large number of capacitor substrates having the same capacitance value can be manufactured only by setting the cut dimension W at which a target capacitance value is obtained, and the same effect as in the above-described embodiment can be obtained. can get.

FIG. 8 shows an example in which a linear electrode 26 and a spiral electrode 27 are formed on a mother substrate 13, thereby forming a coil substrate. Also in the case of this example, the same effect as in the above-described embodiment can be obtained by setting the cut dimension W at which a desired inductance value is obtained.

FIGS. 9 to 12 are views for explaining a method of manufacturing a dielectric filter according to the second and third aspects of the present invention. In the figure, reference numeral 30 denotes a dielectric filter of the present embodiment, which is a three-stage dielectric coaxial resonator R1, R2, R3.
Are arranged in parallel, the resonators R1 to R3 are capacitively coupled via a coupling substrate 31, and are housed in a metal case (not shown). The dielectric coaxial resonator R
1 to R3 are formed in the dielectric block 32 having a rectangular parallelepiped shape.
The electrode film 3 is formed on the inner peripheral surface of the through hole 33 and on the outer surface of the dielectric block 32 except for the open end surface 32a.
4 are formed, and the coupling terminal 35 is provided in the through hole 33.
Is press-fitted. Further, input / output electrodes 36 are formed on both ends of the lower surface of the coupling substrate 31, and input / output terminals 37 are connected to the respective electrodes 36. Also,
The center of the lower surface of the coupling substrate 31 has a capacitor electrode 3
The coupling terminal 35 of the dielectric resonator R2 is connected to the electrode 38. Further, the capacitor electrodes 38 are provided at both ends of the upper surface of the coupling substrate 31.
And a pair of capacitor electrodes 39, 4
0 is formed, and the coupling terminals 35 of the dielectric resonators R1 and R3 are connected to the electrodes 39 and 40, respectively. As a result, the dielectric resonators R1 to R3 are coupled to each other by the capacitors C2 and C3, and the external circuits are connected to the capacitors C1 and C3.
4 form a filter 30 combined.

Then, as shown in FIG. 12, the coupling substrate 31 has the electrodes 36,
Electrodes corresponding to 38 to 40 are pattern-formed, a cut dimension W for obtaining a target capacitance value of each of the electrodes 36 and 38 to 40 is set, and the mother substrate 41 is cut along a cut line A of this dimension W. The basic manufacturing method is the same as in the above embodiment.

According to the dielectric filter 30 of this embodiment,
A cut dimension W for obtaining a target capacitance value of each of the electrodes 36, 38 to 40 formed on the mother substrate 41 is set, and cut along the cut line A of this dimension W.
1, a large number of coupling substrates 31 having the same capacitance value can be manufactured only by setting the cut dimension W.
The design of the substrate 31 can be facilitated, and the same effects as in the above embodiment can be obtained. Further, the size of the coupling substrate 31 in the width direction can be reduced, and the filter 30 as a whole can be reduced in size accordingly, and the same effect as in the above embodiment can be obtained from this point.

FIGS. 13 to 15 show another example of the above embodiment, in which the present invention is applied to a dielectric filter to which a polar capacitance is added. 9 to 12 in the drawings.
The same reference numerals indicate the same or corresponding parts. The dielectric filter 45 includes a coupling substrate 4 and dielectric coaxial resonators R1 to R3.
6 and the basic structure is the same as in the above embodiment. Capacitor electrodes 47a, 47b, 47c are formed at the center and both ends of the upper surface of the coupling substrate 46, and coupling capacitances C2, C3 are formed between gaps of the electrodes 47a to 47c. Input / output electrodes 48, 48 are formed at both ends of the lower surface of the coupling substrate 46.
External coupling capacitors C1 and C4 are formed by 7a and 47c. A polar electrode 49 is formed in the center of the lower surface of the coupling substrate 46, and a polar capacitance C5 is formed by the polar electrode 49 and the capacitor electrode 47b.
Then, as shown in FIG. 15, the coupling substrate 46 has a pattern in which electrodes corresponding to the electrodes 47 to 49 are formed on both main surfaces of the mother substrate 41, and the target capacitance value of each of the electrodes 47 to 49 is The cut size W to be obtained is set, and this size W
Is manufactured by cutting along the cut line A.

According to the dielectric filter 45, the cut size W at which the target capacitance value of each of the electrodes 47 to 49 of the mother substrate 41 is obtained is set, and the cut substrate is cut for each size W to form the coupling substrate 46. The same effects as those of the above embodiment can be obtained. In addition, since the polar electrode 49 is formed on the coupling substrate 46 to obtain the polar capacitance C5, the number of components can be reduced and the cost can be reduced. This is because the polarized capacitance in the conventional dielectric filter is such that a chip capacitor is separately provided on the coupling substrate, which can be eliminated.

[0020]

As described above, according to the method of manufacturing a reactance substrate according to the first aspect of the present invention, a pre-test is performed for each production lot of a mother substrate, and a cut corresponding to a target reactance value is obtained from the pre-test. Now that the dimensions have been set,
According to the method of manufacturing a dielectric filter according to the second and third aspects of the present invention, a cut size is set by performing a preliminary test for each mother substrate manufacturing lot in the same manner as described above, and the substrate manufactured thereby is used. Therefore, there is an effect that the productivity can be improved by eliminating the need for the conventional electrode adjustment by the trimming operation, and the size can be reduced.

[Brief description of the drawings]

FIG. 1 is a plan view showing a mother substrate for describing a method of manufacturing a reactance substrate according to the first embodiment of the present invention.

FIG. 2 is a perspective view showing the capacitor substrate of the embodiment.

FIG. 3 is a plan view of a mother substrate showing a modification of the above embodiment.

FIG. 4 is a view of a mother board showing a modification of the above embodiment.

FIG. 5 is a view of a mother substrate showing a modification of the above embodiment.

FIG. 6 is a view of a mother substrate showing a modification of the above embodiment.

FIG. 7 is a plan view of a mother substrate showing a modification of the above embodiment.

FIG. 8 is a plan view showing a coil substrate according to another example of the embodiment.

FIG. 9 is a partial cross-sectional plan view for explaining a method for manufacturing a dielectric filter according to the second and third aspects of the present invention.

FIG. 10 is a front view of the dielectric filter of the above embodiment.

FIG. 11 is an equivalent circuit diagram of the dielectric filter of the embodiment.

FIG. 12 is a plan view showing a mother substrate of the embodiment.

FIG. 13 is a front view of a dielectric filter to which a polar capacitance is added according to another example of the above embodiment.

FIG. 14 is an equivalent circuit diagram of the dielectric filter of another example.

FIG. 15 is a plan view showing a mother board of another example.

FIG. 16 is a plan view showing a conventional mother substrate.

FIG. 17 is a perspective view showing a conventional capacitor substrate.

FIG. 18 is a plan view showing a conventional dielectric filter.

FIG. 19 is a front view of a conventional coupling substrate.

[Explanation of symbols]

 Reference Signs List 10 capacitor substrate (reactance substrate) 13, 41 mother substrate 14 to 27 electrode 30, 45 dielectric filter 31, 46 coupling substrate W cut dimension R1 to R3 dielectric resonator

────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-63-102217 (JP, A) JP-A-2-87801 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01G 4/00-4/40 H01G 13/00-13/06

Claims (3)

(57) [Claims] An electrode forming step of forming a strip-shaped electrode on the mother substrate; and forming the mother substrate for each production lot of the mother substrate.
The board is cut to a predetermined size to form a pre-test board, and the
From the cutting dimensions and the reactance value of the preceding test board,
The cut dimension that is the reactance value to be calculated is calculated, and the calculated
And a cutting step of cutting the mother substrate for each of the cut dimensions. 2. An electrode forming step of forming a strip-shaped electrode on a mother substrate;
The board is cut to a predetermined size to form a pre-test board, and the
From the cutting dimensions and the reactance value of the preceding test board,
The cut dimension that is the reactance value to be calculated is calculated, and the calculated
A method for producing a dielectric filter, comprising: a preliminary test step of setting a measured dimension as a cut dimension; and a cutting step of cutting the mother substrate for each of the cut dimensions, and using a reactance substrate produced thereby. . 3. A method of manufacturing a dielectric filter, comprising: providing a coupling substrate on a plurality of dielectric resonators; and forming a capacitive electrode for capacitively coupling the resonators on the coupling substrate. An electrode forming step of forming the above-mentioned electrodes, and providing the mother substrate for each production lot of the mother substrate.
Cut to a predetermined size to form a pre-test board, and
And the capacitance value of the preceding test board
Calculate the cutting dimensions and use the calculated dimensions as the cutting dimensions
A method for manufacturing a dielectric filter, comprising: a preceding test step for setting ; and a cutting step for cutting the mother substrate for each of the cut dimensions, and using the capacitor substrate manufactured by this as the coupling substrate.