SG195563A1 - Rotatable sputter target base, rotatable sputter target, coating installation, method of producing a rotatable sputter target, target base connection means, and method of connecting a rotatable target base device for sputtering installations to a target base support - Google Patents
Rotatable sputter target base, rotatable sputter target, coating installation, method of producing a rotatable sputter target, target base connection means, and method of connecting a rotatable target base device for sputtering installations to a target base support Download PDFInfo
- Publication number
- SG195563A1 SG195563A1 SG2013077268A SG2013077268A SG195563A1 SG 195563 A1 SG195563 A1 SG 195563A1 SG 2013077268 A SG2013077268 A SG 2013077268A SG 2013077268 A SG2013077268 A SG 2013077268A SG 195563 A1 SG195563 A1 SG 195563A1
- Authority
- SG
- Singapore
- Prior art keywords
- target base
- target
- fixation
- rotatable
- cylinder
- Prior art date
Links
- 238000009434 installation Methods 0.000 title claims abstract description 59
- 238000004544 sputter deposition Methods 0.000 title claims abstract description 56
- 238000000034 method Methods 0.000 title claims abstract description 24
- 239000011248 coating agent Substances 0.000 title claims abstract description 20
- 238000000576 coating method Methods 0.000 title claims abstract description 20
- 239000007787 solid Substances 0.000 claims abstract description 74
- 230000008878 coupling Effects 0.000 claims description 53
- 238000010168 coupling process Methods 0.000 claims description 53
- 238000005859 coupling reaction Methods 0.000 claims description 53
- 125000006850 spacer group Chemical group 0.000 claims description 39
- 230000004048 modification Effects 0.000 description 45
- 238000012986 modification Methods 0.000 description 45
- 238000004519 manufacturing process Methods 0.000 description 11
- 239000013077 target material Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- 238000001816 cooling Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 238000005477 sputtering target Methods 0.000 description 2
- 238000000427 thin-film deposition Methods 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 241000283986 Lepus Species 0.000 description 1
- -1 Z-600 Chemical compound 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP08167573A EP2180501A1 (en) | 2008-10-24 | 2008-10-24 | Rotatable sputter target base, rotatable sputter target, coating installation, method of producing a rotatable sputter target, target base connection means, and method of connecting a rotatable target base device for sputtering installations to a target base support |
| US12/258,243 US20100101948A1 (en) | 2008-10-24 | 2008-10-24 | Rotatable sputter target base, rotatable sputter target, coating installation, method of producing a rotatable sputter target, target base connection means, and method of connecting a rotatable target base device for sputtering installations to a target base support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG195563A1 true SG195563A1 (en) | 2013-12-30 |
Family
ID=41319650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2013077268A SG195563A1 (en) | 2008-10-24 | 2009-10-23 | Rotatable sputter target base, rotatable sputter target, coating installation, method of producing a rotatable sputter target, target base connection means, and method of connecting a rotatable target base device for sputtering installations to a target base support |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP5762964B2 (ja) |
| KR (1) | KR20110089290A (ja) |
| CN (1) | CN102265376A (ja) |
| SG (1) | SG195563A1 (ja) |
| TW (1) | TWI476290B (ja) |
| WO (1) | WO2010046485A1 (ja) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103397301A (zh) * | 2013-07-17 | 2013-11-20 | 中国南玻集团股份有限公司 | 圆筒旋转银靶及其制备方法 |
| KR20170081680A (ko) * | 2014-11-07 | 2017-07-12 | 어플라이드 머티어리얼스, 인코포레이티드 | 비용 효율적 모놀리식 회전식 타겟 |
| CN106683988B (zh) * | 2016-12-28 | 2019-05-24 | 惠科股份有限公司 | 一种靶材装置 |
| CN107584201B (zh) * | 2017-10-31 | 2019-11-26 | 宁波江丰电子材料股份有限公司 | 一种靶材真空扩散焊接系统及方法 |
| CN109628899A (zh) * | 2019-01-24 | 2019-04-16 | 苏州罗纳尔材料科技有限公司 | 旋转锌镁靶材及其制备方法 |
| JP7245661B2 (ja) * | 2019-01-30 | 2023-03-24 | Ｊｓｗアフティ株式会社 | ターゲットおよび成膜装置並びに成膜対象物の製造方法 |
| CN113025971A (zh) * | 2021-03-01 | 2021-06-25 | 宁波江丰电子材料股份有限公司 | 一种管靶材及其用途 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53163352U (ja) * | 1977-05-31 | 1978-12-21 | ||
| JPH07228967A (ja) * | 1994-02-17 | 1995-08-29 | Mitsubishi Materials Corp | 長尺円筒状スパッタリングターゲット |
| US5591314A (en) * | 1995-10-27 | 1997-01-07 | Morgan; Steven V. | Apparatus for affixing a rotating cylindrical magnetron target to a spindle |
| EP0969238A1 (en) * | 1998-06-29 | 2000-01-05 | Sinvaco N.V. | Vacuum tight coupling for tube sections |
| DE19958666C2 (de) * | 1999-12-06 | 2003-10-30 | Heraeus Gmbh W C | Vorrichtung zur lösbaren Verbindung eines zylinderrohrförmigen Targetteiles mit einem Aufnahmeteil |
| JP4614037B2 (ja) * | 2000-09-08 | 2011-01-19 | Ａｇｃセラミックス株式会社 | 円筒状ターゲット |
| AU2003248835A1 (en) * | 2002-07-02 | 2004-01-23 | Academy Precision Materials A Division Of Academy Corporation | Rotary target and method for onsite mechanical assembly of rotary target |
| DE10231203B4 (de) * | 2002-07-10 | 2009-09-10 | Interpane Entwicklungs-Und Beratungsgesellschaft Mbh | Targetträgeranordnung |
| ATE428883T1 (de) * | 2003-03-25 | 2009-05-15 | Bekaert Advanced Coatings | Universelle vakuumskupplung für ein zylindrisches aufnahmeteil |
| US20060278519A1 (en) * | 2005-06-10 | 2006-12-14 | Leszek Malaszewski | Adaptable fixation for cylindrical magnetrons |
| KR101137906B1 (ko) * | 2006-08-03 | 2012-05-03 | 삼성코닝정밀소재 주식회사 | 회전식 타겟 어셈블리 |
| WO2009100985A1 (en) * | 2008-02-15 | 2009-08-20 | Bekaert Advanced Coatings Nv | Multiple grooved vacuum coupling |
-
2009
- 2009-10-23 TW TW098136026A patent/TWI476290B/zh active
- 2009-10-23 CN CN2009801526026A patent/CN102265376A/zh active Pending
- 2009-10-23 KR KR1020117011813A patent/KR20110089290A/ko active Search and Examination
- 2009-10-23 SG SG2013077268A patent/SG195563A1/en unknown
- 2009-10-23 WO PCT/EP2009/064013 patent/WO2010046485A1/en active Application Filing
- 2009-10-23 JP JP2011532651A patent/JP5762964B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TW201024444A (en) | 2010-07-01 |
| WO2010046485A1 (en) | 2010-04-29 |
| TWI476290B (zh) | 2015-03-11 |
| JP5762964B2 (ja) | 2015-08-12 |
| KR20110089290A (ko) | 2011-08-05 |
| JP2012506489A (ja) | 2012-03-15 |
| CN102265376A (zh) | 2011-11-30 |
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