SG187316A1 - Method for grinding thin sheet-like workpiece and double-end surface grinder - Google Patents
Method for grinding thin sheet-like workpiece and double-end surface grinder Download PDFInfo
- Publication number
- SG187316A1 SG187316A1 SG2012046975A SG2012046975A SG187316A1 SG 187316 A1 SG187316 A1 SG 187316A1 SG 2012046975 A SG2012046975 A SG 2012046975A SG 2012046975 A SG2012046975 A SG 2012046975A SG 187316 A1 SG187316 A1 SG 187316A1
- Authority
- SG
- Singapore
- Prior art keywords
- carrier
- static pressure
- guides
- workpiece
- carrier ring
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 37
- 230000003068 static effect Effects 0.000 claims abstract description 279
- 230000002093 peripheral effect Effects 0.000 claims abstract description 39
- 239000012530 fluid Substances 0.000 claims description 23
- 208000036366 Sensation of pressure Diseases 0.000 abstract 1
- 208000033641 Ring chromosome 5 syndrome Diseases 0.000 description 92
- 238000005259 measurement Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000012050 conventional carrier Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
- B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011152022A JP5627114B2 (ja) | 2011-07-08 | 2011-07-08 | 薄板状ワークの研削方法及び両頭平面研削盤 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG187316A1 true SG187316A1 (en) | 2013-02-28 |
Family
ID=46507898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2012046975A SG187316A1 (en) | 2011-07-08 | 2012-06-22 | Method for grinding thin sheet-like workpiece and double-end surface grinder |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP2543475B1 (fr) |
| JP (1) | JP5627114B2 (fr) |
| KR (1) | KR101911553B1 (fr) |
| SG (1) | SG187316A1 (fr) |
| TW (1) | TWI604918B (fr) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5724958B2 (ja) * | 2012-07-03 | 2015-05-27 | 信越半導体株式会社 | 両頭研削装置及びワークの両頭研削方法 |
| CN104259984A (zh) * | 2014-09-18 | 2015-01-07 | 洛阳巨优机床有限公司 | 一种往复式双端面磨床往复送料板一浮一定式装置 |
| CN104369058A (zh) * | 2014-11-27 | 2015-02-25 | 石家庄轴设机电设备有限公司 | 滚子双端面磨床支撑及其使用方法 |
| CN115741453B (zh) * | 2022-11-30 | 2024-02-27 | 大连理工大学 | 一种多传感器融合的智能双面研磨机 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3431681A (en) * | 1965-07-23 | 1969-03-11 | Landis Tool Co | Work support shoe assembly |
| JP3673904B2 (ja) | 1996-12-03 | 2005-07-20 | 光洋機械工業株式会社 | 薄板円板状ワークの両面研削装置 |
| JP3702379B2 (ja) | 1996-12-13 | 2005-10-05 | 光洋機械工業株式会社 | 薄板円板状ワークの両面研削装置 |
| JP2002036078A (ja) * | 2001-06-25 | 2002-02-05 | Koyo Mach Ind Co Ltd | 薄板円板状ワークの両面研削装置 |
| JP3993856B2 (ja) * | 2004-01-22 | 2007-10-17 | 光洋機械工業株式会社 | 両頭平面研削装置 |
| JP4143563B2 (ja) * | 2004-03-16 | 2008-09-03 | 住友重機械工業株式会社 | ワーク保持装置及び両面加工装置 |
| JP4780142B2 (ja) * | 2008-05-22 | 2011-09-28 | 信越半導体株式会社 | ウェーハの製造方法 |
| JP2010042488A (ja) * | 2008-08-15 | 2010-02-25 | Mori Seiki Co Ltd | ワーク受け及びこれを備えた研削盤 |
-
2011
- 2011-07-08 JP JP2011152022A patent/JP5627114B2/ja active Active
-
2012
- 2012-06-22 SG SG2012046975A patent/SG187316A1/en unknown
- 2012-06-27 KR KR1020120069087A patent/KR101911553B1/ko active IP Right Grant
- 2012-07-06 TW TW101124333A patent/TWI604918B/zh active
- 2012-07-06 EP EP12175279.4A patent/EP2543475B1/fr active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TW201313386A (zh) | 2013-04-01 |
| KR101911553B1 (ko) | 2018-10-24 |
| EP2543475A3 (fr) | 2017-01-04 |
| KR20130006303A (ko) | 2013-01-16 |
| TWI604918B (zh) | 2017-11-11 |
| EP2543475A2 (fr) | 2013-01-09 |
| JP2013018065A (ja) | 2013-01-31 |
| JP5627114B2 (ja) | 2014-11-19 |
| EP2543475B1 (fr) | 2019-03-27 |
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