SG183187A1 - High efficiency high accuracy heater driver - Google Patents

High efficiency high accuracy heater driver Download PDF

Info

Publication number
SG183187A1
SG183187A1 SG2012058095A SG2012058095A SG183187A1 SG 183187 A1 SG183187 A1 SG 183187A1 SG 2012058095 A SG2012058095 A SG 2012058095A SG 2012058095 A SG2012058095 A SG 2012058095A SG 183187 A1 SG183187 A1 SG 183187A1
Authority
SG
Singapore
Prior art keywords
switch
temperature
power
control signal
wafer
Prior art date
Application number
SG2012058095A
Other languages
English (en)
Inventor
Alexander Goldin
Oleg V Serebryanov
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG183187A1 publication Critical patent/SG183187A1/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24C—DOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
    • F24C15/00—Details
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24C—DOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
    • F24C15/00—Details
    • F24C15/24—Radiant bodies or panels for radiation heaters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227—Applications
    • H05B1/023—Industrial applications
    • H05B1/0233—Industrial applications for semiconductors manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/0033—Heating devices using lamps
    • H05B3/0038—Heating devices using lamps for industrial applications
    • H05B3/0047—Heating devices using lamps for industrial applications for semiconductor manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Control Of Resistance Heating (AREA)
  • Circuit Arrangement For Electric Light Sources In General (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Control Of Temperature (AREA)
  • Control Of Electrical Variables (AREA)
SG2012058095A 2010-02-19 2011-02-18 High efficiency high accuracy heater driver SG183187A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/708,648 US8548312B2 (en) 2010-02-19 2010-02-19 High efficiency high accuracy heater driver
PCT/US2011/025391 WO2011103391A2 (en) 2010-02-19 2011-02-18 High efficiency high accuracy heater driver

Publications (1)

Publication Number Publication Date
SG183187A1 true SG183187A1 (en) 2012-09-27

Family

ID=44476555

Family Applications (1)

Application Number Title Priority Date Filing Date
SG2012058095A SG183187A1 (en) 2010-02-19 2011-02-18 High efficiency high accuracy heater driver

Country Status (8)

Country Link
US (3) US8548312B2 (enExample)
EP (1) EP2537178A4 (enExample)
JP (3) JP5887282B2 (enExample)
KR (2) KR101824234B1 (enExample)
CN (2) CN102763201B (enExample)
SG (1) SG183187A1 (enExample)
TW (2) TWI474403B (enExample)
WO (1) WO2011103391A2 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10734257B2 (en) * 2012-04-25 2020-08-04 Applied Materials, Inc. Direct current lamp driver for substrate processing
US9734659B2 (en) * 2014-08-06 2017-08-15 Mido Play Inc. Single platform system for multiple jurisdiction lotteries and social media
TW201626858A (zh) 2015-01-05 2016-07-16 應用材料股份有限公司 用於低壓環境的燈驅動器（二）
TWI612259B (zh) * 2016-02-26 2018-01-21 財團法人工業技術研究院 加熱設備以及加熱方法
US10908195B2 (en) 2016-06-15 2021-02-02 Watlow Electric Manufacturing Company System and method for controlling power to a heater
EP3813099B1 (en) 2016-06-15 2022-08-03 Watlow Electric Manufacturing Company Power converter for a thermal system
TWI790533B (zh) * 2017-08-10 2023-01-21 美商瓦特洛威電子製造公司 控制送至加熱器之電力的系統及方法
CN109429382A (zh) * 2017-08-24 2019-03-05 江苏威能电气有限公司 快速升降温加热器
DE102018203945B4 (de) 2018-03-15 2023-08-10 Siltronic Ag Verfahren zur Herstellung von Halbleiterscheiben
CN110554717B (zh) * 2019-08-15 2021-08-24 国电南瑞科技股份有限公司 适用于电力电子装置温度闭环调节的散热风扇设速方法
CN113405323A (zh) * 2021-07-21 2021-09-17 东方凯特瑞(成都)环保科技有限公司 一种用于蜂窝scr脱硝催化剂的微波干燥方法及装置
CN114060892B (zh) * 2021-11-29 2023-05-16 奥普家居股份有限公司 一种恒温浴霸及其控制方法、存储介质

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US4438356A (en) 1982-03-24 1984-03-20 International Rectifier Corporation Solid state relay circuit employing MOSFET power switching devices
JPH0327408A (ja) * 1989-06-24 1991-02-05 Matsushita Electric Works Ltd デユーテイ制御装置
JP3215613B2 (ja) * 1995-10-04 2001-10-09 古河電池株式会社 力率制御回路
US5751896A (en) 1996-02-22 1998-05-12 Micron Technology, Inc. Method and apparatus to compensate for non-uniform film growth during chemical vapor deposition
US5841110A (en) 1997-08-27 1998-11-24 Steag-Ast Gmbh Method and apparatus for improved temperature control in rapid thermal processing (RTP) systems
JP3304894B2 (ja) 1998-09-28 2002-07-22 ウシオ電機株式会社 フィラメントランプ点灯装置
JP2000235886A (ja) 1998-12-14 2000-08-29 Tokyo Electron Ltd 加熱手段の温度制御装置および温度制御方法
JP3988338B2 (ja) 1999-10-07 2007-10-10 ウシオ電機株式会社 光照射式急速加熱処理装置の制御装置
US6259072B1 (en) 1999-11-09 2001-07-10 Axcelis Technologies, Inc. Zone controlled radiant heating system utilizing focused reflector
KR100432135B1 (ko) * 2001-06-30 2004-05-17 동부전자 주식회사 급속 열처리 장치
US20030029859A1 (en) * 2001-08-08 2003-02-13 Applied Materials, Inc. Lamphead for a rapid thermal processing chamber
US20080090309A1 (en) * 2003-10-27 2008-04-17 Ranish Joseph M Controlled annealing method
US20060000551A1 (en) * 2004-06-30 2006-01-05 Saldana Miguel A Methods and apparatus for optimal temperature control in a plasma processing system
US7283734B2 (en) 2004-08-24 2007-10-16 Fujitsu Limited Rapid thermal processing apparatus and method of manufacture of semiconductor device
KR100966375B1 (ko) * 2005-04-04 2010-06-28 가부시키가이샤 코쿠사이덴키 세미컨덕터 서비스 공급전력 조정기 및 반도체 제조장치
JP2007095889A (ja) 2005-09-28 2007-04-12 Ushio Inc 光照射式加熱方法
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TW200921791A (en) * 2007-11-05 2009-05-16 United Microelectronics Corp Method of cleaning transparent device in a thermal process apparatus, thermal process apparatus and process using the same thermal process apparatus
KR20090069907A (ko) * 2007-12-26 2009-07-01 에이피시스템 주식회사 가열램프 제어장치 및 제어방법
JP5282409B2 (ja) 2008-02-25 2013-09-04 ウシオ電機株式会社 光照射式加熱方法及び光照射式加熱装置
WO2010005933A2 (en) * 2008-07-07 2010-01-14 Lam Research Corporation Passive capacitively-coupled electrostatic (cce) probe arrangement for detecting plasma instabilities in a plasma processing chamber

Also Published As

Publication number Publication date
EP2537178A2 (en) 2012-12-26
CN102763201B (zh) 2015-07-15
CN102763201A (zh) 2012-10-31
CN104617013A (zh) 2015-05-13
US20110206358A1 (en) 2011-08-25
US20140027440A1 (en) 2014-01-30
CN104617013B (zh) 2017-11-14
TW201145395A (en) 2011-12-16
KR101824234B1 (ko) 2018-01-31
TWI590333B (zh) 2017-07-01
EP2537178A4 (en) 2013-07-17
JP2013520801A (ja) 2013-06-06
US8548312B2 (en) 2013-10-01
JP2016076708A (ja) 2016-05-12
KR20120137367A (ko) 2012-12-20
KR20180014208A (ko) 2018-02-07
TW201517176A (zh) 2015-05-01
US20170162408A1 (en) 2017-06-08
TWI474403B (zh) 2015-02-21
JP5887282B2 (ja) 2016-03-16
US9612020B2 (en) 2017-04-04
WO2011103391A2 (en) 2011-08-25
JP6324938B2 (ja) 2018-05-16
JP2018093210A (ja) 2018-06-14
WO2011103391A3 (en) 2012-02-09
KR101890155B1 (ko) 2018-08-21

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