TWI590333B - 高效能高準確度加熱驅動器 - Google Patents
高效能高準確度加熱驅動器 Download PDFInfo
- Publication number
- TWI590333B TWI590333B TW103144545A TW103144545A TWI590333B TW I590333 B TWI590333 B TW I590333B TW 103144545 A TW103144545 A TW 103144545A TW 103144545 A TW103144545 A TW 103144545A TW I590333 B TWI590333 B TW I590333B
- Authority
- TW
- Taiwan
- Prior art keywords
- switch
- control signal
- temperature
- power
- transistor
- Prior art date
Links
- 229910052736 halogen Inorganic materials 0.000 claims description 31
- 150000002367 halogens Chemical class 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 22
- 235000012431 wafers Nutrition 0.000 description 29
- 238000010586 diagram Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24C—DOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
- F24C15/00—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24C—DOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
- F24C15/00—Details
- F24C15/24—Radiant bodies or panels for radiation heaters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B1/00—Details of electric heating devices
- H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
- H05B1/0227—Applications
- H05B1/023—Industrial applications
- H05B1/0233—Industrial applications for semiconductors manufacturing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/0033—Heating devices using lamps
- H05B3/0038—Heating devices using lamps for industrial applications
- H05B3/0047—Heating devices using lamps for industrial applications for semiconductor manufacture
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Control Of Resistance Heating (AREA)
- Circuit Arrangement For Electric Light Sources In General (AREA)
- Control Of Temperature (AREA)
- Control Of Electrical Variables (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/708,648 US8548312B2 (en) | 2010-02-19 | 2010-02-19 | High efficiency high accuracy heater driver |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201517176A TW201517176A (zh) | 2015-05-01 |
| TWI590333B true TWI590333B (zh) | 2017-07-01 |
Family
ID=44476555
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103144545A TWI590333B (zh) | 2010-02-19 | 2011-02-16 | 高效能高準確度加熱驅動器 |
| TW100105125A TWI474403B (zh) | 2010-02-19 | 2011-02-16 | 高效能高準確度加熱驅動器 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100105125A TWI474403B (zh) | 2010-02-19 | 2011-02-16 | 高效能高準確度加熱驅動器 |
Country Status (8)
| Country | Link |
|---|---|
| US (3) | US8548312B2 (enExample) |
| EP (1) | EP2537178A4 (enExample) |
| JP (3) | JP5887282B2 (enExample) |
| KR (2) | KR101890155B1 (enExample) |
| CN (2) | CN104617013B (enExample) |
| SG (1) | SG183187A1 (enExample) |
| TW (2) | TWI590333B (enExample) |
| WO (1) | WO2011103391A2 (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10734257B2 (en) * | 2012-04-25 | 2020-08-04 | Applied Materials, Inc. | Direct current lamp driver for substrate processing |
| US9734659B2 (en) * | 2014-08-06 | 2017-08-15 | Mido Play Inc. | Single platform system for multiple jurisdiction lotteries and social media |
| TW201626858A (zh) | 2015-01-05 | 2016-07-16 | 應用材料股份有限公司 | 用於低壓環境的燈驅動器（二） |
| TWI612259B (zh) * | 2016-02-26 | 2018-01-21 | 財團法人工業技術研究院 | 加熱設備以及加熱方法 |
| US10908195B2 (en) | 2016-06-15 | 2021-02-02 | Watlow Electric Manufacturing Company | System and method for controlling power to a heater |
| KR102737698B1 (ko) * | 2016-06-15 | 2024-12-02 | 와틀로 일렉트릭 매뉴팩츄어링 컴파니 | 열시스템용 전력 변환기 |
| KR102547953B1 (ko) * | 2017-08-10 | 2023-06-26 | 와틀로 일렉트릭 매뉴팩츄어링 컴파니 | 히터에 공급되는 전력을 제어하는 시스템 및 방법 |
| CN109429382A (zh) * | 2017-08-24 | 2019-03-05 | 江苏威能电气有限公司 | 快速升降温加热器 |
| DE102018203945B4 (de) | 2018-03-15 | 2023-08-10 | Siltronic Ag | Verfahren zur Herstellung von Halbleiterscheiben |
| CN110554717B (zh) * | 2019-08-15 | 2021-08-24 | 国电南瑞科技股份有限公司 | 适用于电力电子装置温度闭环调节的散热风扇设速方法 |
| CN113405323A (zh) * | 2021-07-21 | 2021-09-17 | 东方凯特瑞(成都)环保科技有限公司 | 一种用于蜂窝scr脱硝催化剂的微波干燥方法及装置 |
| CN114060892B (zh) * | 2021-11-29 | 2023-05-16 | 奥普家居股份有限公司 | 一种恒温浴霸及其控制方法、存储介质 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4438356A (en) | 1982-03-24 | 1984-03-20 | International Rectifier Corporation | Solid state relay circuit employing MOSFET power switching devices |
| JPH0327408A (ja) * | 1989-06-24 | 1991-02-05 | Matsushita Electric Works Ltd | デユーテイ制御装置 |
| JP3215613B2 (ja) * | 1995-10-04 | 2001-10-09 | 古河電池株式会社 | 力率制御回路 |
| US5751896A (en) | 1996-02-22 | 1998-05-12 | Micron Technology, Inc. | Method and apparatus to compensate for non-uniform film growth during chemical vapor deposition |
| US5841110A (en) | 1997-08-27 | 1998-11-24 | Steag-Ast Gmbh | Method and apparatus for improved temperature control in rapid thermal processing (RTP) systems |
| JP3304894B2 (ja) * | 1998-09-28 | 2002-07-22 | ウシオ電機株式会社 | フィラメントランプ点灯装置 |
| JP2000235886A (ja) | 1998-12-14 | 2000-08-29 | Tokyo Electron Ltd | 加熱手段の温度制御装置および温度制御方法 |
| JP3988338B2 (ja) * | 1999-10-07 | 2007-10-10 | ウシオ電機株式会社 | 光照射式急速加熱処理装置の制御装置 |
| US6259072B1 (en) | 1999-11-09 | 2001-07-10 | Axcelis Technologies, Inc. | Zone controlled radiant heating system utilizing focused reflector |
| KR100432135B1 (ko) * | 2001-06-30 | 2004-05-17 | 동부전자 주식회사 | 급속 열처리 장치 |
| US20030029859A1 (en) | 2001-08-08 | 2003-02-13 | Applied Materials, Inc. | Lamphead for a rapid thermal processing chamber |
| US20080090309A1 (en) | 2003-10-27 | 2008-04-17 | Ranish Joseph M | Controlled annealing method |
| US20060000551A1 (en) * | 2004-06-30 | 2006-01-05 | Saldana Miguel A | Methods and apparatus for optimal temperature control in a plasma processing system |
| US7283734B2 (en) | 2004-08-24 | 2007-10-16 | Fujitsu Limited | Rapid thermal processing apparatus and method of manufacture of semiconductor device |
| WO2006107013A1 (ja) * | 2005-04-04 | 2006-10-12 | Kokusai Electric Semiconductor Service Inc. | 供給電力調整器及び半導体製造装置 |
| JP2007095889A (ja) | 2005-09-28 | 2007-04-12 | Ushio Inc | 光照射式加熱方法 |
| JP4687393B2 (ja) * | 2005-11-01 | 2011-05-25 | 日本放送協会 | 調光器 |
| TW200921791A (en) * | 2007-11-05 | 2009-05-16 | United Microelectronics Corp | Method of cleaning transparent device in a thermal process apparatus, thermal process apparatus and process using the same thermal process apparatus |
| KR20090069907A (ko) * | 2007-12-26 | 2009-07-01 | 에이피시스템 주식회사 | 가열램프 제어장치 및 제어방법 |
| JP5282409B2 (ja) | 2008-02-25 | 2013-09-04 | ウシオ電機株式会社 | 光照射式加熱方法及び光照射式加熱装置 |
| KR101606736B1 (ko) * | 2008-07-07 | 2016-03-28 | 램 리써치 코포레이션 | 플라즈마 프로세싱 챔버에서 플라즈마 불안정성을 검출하기 위한 패시브 용량성-결합된 정전식 (ｃｃｅ) 프로브 장치 |
-
2010
- 2010-02-19 US US12/708,648 patent/US8548312B2/en active Active
-
2011
- 2011-02-16 TW TW103144545A patent/TWI590333B/zh active
- 2011-02-16 TW TW100105125A patent/TWI474403B/zh active
- 2011-02-18 JP JP2012554050A patent/JP5887282B2/ja not_active Expired - Fee Related
- 2011-02-18 EP EP11745298.7A patent/EP2537178A4/en not_active Withdrawn
- 2011-02-18 KR KR1020187002546A patent/KR101890155B1/ko active Active
- 2011-02-18 KR KR1020127024467A patent/KR101824234B1/ko active Active
- 2011-02-18 SG SG2012058095A patent/SG183187A1/en unknown
- 2011-02-18 WO PCT/US2011/025391 patent/WO2011103391A2/en not_active Ceased
- 2011-02-18 CN CN201410718136.6A patent/CN104617013B/zh not_active Expired - Fee Related
- 2011-02-18 CN CN201180009496.3A patent/CN102763201B/zh not_active Expired - Fee Related
-
2013
- 2013-08-29 US US14/013,151 patent/US9612020B2/en active Active
-
2015
- 2015-10-29 JP JP2015212586A patent/JP6324938B2/ja active Active
-
2017
- 2017-02-23 US US15/440,336 patent/US20170162408A1/en not_active Abandoned
-
2018
- 2018-01-10 JP JP2018001671A patent/JP2018093210A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| KR20180014208A (ko) | 2018-02-07 |
| KR101890155B1 (ko) | 2018-08-21 |
| SG183187A1 (en) | 2012-09-27 |
| TWI474403B (zh) | 2015-02-21 |
| US20170162408A1 (en) | 2017-06-08 |
| JP5887282B2 (ja) | 2016-03-16 |
| CN102763201A (zh) | 2012-10-31 |
| CN104617013B (zh) | 2017-11-14 |
| TW201517176A (zh) | 2015-05-01 |
| KR101824234B1 (ko) | 2018-01-31 |
| CN102763201B (zh) | 2015-07-15 |
| US20140027440A1 (en) | 2014-01-30 |
| CN104617013A (zh) | 2015-05-13 |
| WO2011103391A3 (en) | 2012-02-09 |
| JP2016076708A (ja) | 2016-05-12 |
| KR20120137367A (ko) | 2012-12-20 |
| EP2537178A4 (en) | 2013-07-17 |
| WO2011103391A2 (en) | 2011-08-25 |
| JP2013520801A (ja) | 2013-06-06 |
| TW201145395A (en) | 2011-12-16 |
| US20110206358A1 (en) | 2011-08-25 |
| EP2537178A2 (en) | 2012-12-26 |
| JP6324938B2 (ja) | 2018-05-16 |
| US8548312B2 (en) | 2013-10-01 |
| US9612020B2 (en) | 2017-04-04 |
| JP2018093210A (ja) | 2018-06-14 |
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