WO2011103391A2 - High efficiency high accuracy heater driver - Google Patents

High efficiency high accuracy heater driver Download PDF

Info

Publication number
WO2011103391A2
WO2011103391A2 PCT/US2011/025391 US2011025391W WO2011103391A2 WO 2011103391 A2 WO2011103391 A2 WO 2011103391A2 US 2011025391 W US2011025391 W US 2011025391W WO 2011103391 A2 WO2011103391 A2 WO 2011103391A2
Authority
WO
WIPO (PCT)
Prior art keywords
switch
temperature
power
control signal
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2011/025391
Other languages
English (en)
French (fr)
Other versions
WO2011103391A3 (en
Inventor
Alexander Goldin
Oleg V. Serebryanov
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to KR1020187002546A priority Critical patent/KR101890155B1/ko
Priority to EP11745298.7A priority patent/EP2537178A4/en
Priority to KR1020127024467A priority patent/KR101824234B1/ko
Priority to SG2012058095A priority patent/SG183187A1/en
Priority to JP2012554050A priority patent/JP5887282B2/ja
Priority to CN201180009496.3A priority patent/CN102763201B/zh
Publication of WO2011103391A2 publication Critical patent/WO2011103391A2/en
Publication of WO2011103391A3 publication Critical patent/WO2011103391A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24C—DOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
    • F24C15/00—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24C—DOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
    • F24C15/00—Details
    • F24C15/24—Radiant bodies or panels for radiation heaters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227—Applications
    • H05B1/023—Industrial applications
    • H05B1/0233—Industrial applications for semiconductors manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/0033—Heating devices using lamps
    • H05B3/0038—Heating devices using lamps for industrial applications
    • H05B3/0047—Heating devices using lamps for industrial applications for semiconductor manufacture

Definitions

  • a method of controlling a rapid thermal process chamber that processes a wafer includes the steps of sensing a temperature of the wafer, determining a desired temperature, a temperature controller generating a first control signal and a second control signal in accordance with the temperature of the wafer and the desired temperature, the first control signal turning a first switch on and off a plurality of times per half cycle of AC power supplied to the temperature controller, the second control signal turning a second switch on and off a plurality of times per half cycle of AC power supplied to the temperature controller and the first and second switch supplying power to a plurality of halogen lamps.
  • the first switch and the second switch are turned on at different times. The first switch is turned on while the second swithch is turned off and the first switch is turned off while the second switch is turned on.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Control Of Resistance Heating (AREA)
  • Circuit Arrangement For Electric Light Sources In General (AREA)
  • Control Of Temperature (AREA)
  • Control Of Electrical Variables (AREA)
PCT/US2011/025391 2010-02-19 2011-02-18 High efficiency high accuracy heater driver Ceased WO2011103391A2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020187002546A KR101890155B1 (ko) 2010-02-19 2011-02-18 고효율 고정확도 히터 드라이버
EP11745298.7A EP2537178A4 (en) 2010-02-19 2011-02-18 HEATING DRIVER OF HIGH EFFICIENCY AND HIGH ACCURACY
KR1020127024467A KR101824234B1 (ko) 2010-02-19 2011-02-18 고효율 고정확도 히터 드라이버
SG2012058095A SG183187A1 (en) 2010-02-19 2011-02-18 High efficiency high accuracy heater driver
JP2012554050A JP5887282B2 (ja) 2010-02-19 2011-02-18 高効率／高精度ヒータドライバ
CN201180009496.3A CN102763201B (zh) 2010-02-19 2011-02-18 高效率高准确度加热器驱动器

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/708,648 2010-02-19
US12/708,648 US8548312B2 (en) 2010-02-19 2010-02-19 High efficiency high accuracy heater driver

Publications (2)

Publication Number Publication Date
WO2011103391A2 true WO2011103391A2 (en) 2011-08-25
WO2011103391A3 WO2011103391A3 (en) 2012-02-09

Family

ID=44476555

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2011/025391 Ceased WO2011103391A2 (en) 2010-02-19 2011-02-18 High efficiency high accuracy heater driver

Country Status (8)

Country Link
US (3) US8548312B2 (enExample)
EP (1) EP2537178A4 (enExample)
JP (3) JP5887282B2 (enExample)
KR (2) KR101890155B1 (enExample)
CN (2) CN104617013B (enExample)
SG (1) SG183187A1 (enExample)
TW (2) TWI590333B (enExample)
WO (1) WO2011103391A2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150004389A (ko) * 2012-04-25 2015-01-12 어플라이드 머티어리얼스, 인코포레이티드 기판 처리를 위한 직류 램프 드라이버
CN110554717A (zh) * 2019-08-15 2019-12-10 国电南瑞科技股份有限公司 适用于电力电子装置温度闭环调节的散热风扇设速方法

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US9734659B2 (en) * 2014-08-06 2017-08-15 Mido Play Inc. Single platform system for multiple jurisdiction lotteries and social media
TW201626858A (zh) 2015-01-05 2016-07-16 應用材料股份有限公司 用於低壓環境的燈驅動器（二）
TWI612259B (zh) * 2016-02-26 2018-01-21 財團法人工業技術研究院 加熱設備以及加熱方法
US10908195B2 (en) 2016-06-15 2021-02-02 Watlow Electric Manufacturing Company System and method for controlling power to a heater
KR102737698B1 (ko) * 2016-06-15 2024-12-02 와틀로 일렉트릭 매뉴팩츄어링 컴파니 열시스템용 전력 변환기
KR102547953B1 (ko) * 2017-08-10 2023-06-26 와틀로 일렉트릭 매뉴팩츄어링 컴파니 히터에 공급되는 전력을 제어하는 시스템 및 방법
CN109429382A (zh) * 2017-08-24 2019-03-05 江苏威能电气有限公司 快速升降温加热器
DE102018203945B4 (de) 2018-03-15 2023-08-10 Siltronic Ag Verfahren zur Herstellung von Halbleiterscheiben
CN113405323A (zh) * 2021-07-21 2021-09-17 东方凯特瑞(成都)环保科技有限公司 一种用于蜂窝scr脱硝催化剂的微波干燥方法及装置
CN114060892B (zh) * 2021-11-29 2023-05-16 奥普家居股份有限公司 一种恒温浴霸及其控制方法、存储介质

Citations (2)

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Publication number Priority date Publication date Assignee Title
EP1091622A2 (en) 1999-10-07 2001-04-11 Ushiodenki Kabushiki Kaisha Control apparatus for a light radiation-type rapid heating and processing device
US20060051077A1 (en) 2004-08-24 2006-03-09 Fujitsu Limited Rapid thermal processing apparatus and method of manufacture of semiconductor device

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EP1091622A2 (en) 1999-10-07 2001-04-11 Ushiodenki Kabushiki Kaisha Control apparatus for a light radiation-type rapid heating and processing device
US20060051077A1 (en) 2004-08-24 2006-03-09 Fujitsu Limited Rapid thermal processing apparatus and method of manufacture of semiconductor device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2537178A4

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150004389A (ko) * 2012-04-25 2015-01-12 어플라이드 머티어리얼스, 인코포레이티드 기판 처리를 위한 직류 램프 드라이버
KR102126364B1 (ko) * 2012-04-25 2020-06-24 어플라이드 머티어리얼스, 인코포레이티드 기판 처리를 위한 직류 램프 드라이버
CN110554717A (zh) * 2019-08-15 2019-12-10 国电南瑞科技股份有限公司 适用于电力电子装置温度闭环调节的散热风扇设速方法
CN110554717B (zh) * 2019-08-15 2021-08-24 国电南瑞科技股份有限公司 适用于电力电子装置温度闭环调节的散热风扇设速方法

Also Published As

Publication number Publication date
KR20180014208A (ko) 2018-02-07
KR101890155B1 (ko) 2018-08-21
SG183187A1 (en) 2012-09-27
TWI590333B (zh) 2017-07-01
TWI474403B (zh) 2015-02-21
US20170162408A1 (en) 2017-06-08
JP5887282B2 (ja) 2016-03-16
CN102763201A (zh) 2012-10-31
CN104617013B (zh) 2017-11-14
TW201517176A (zh) 2015-05-01
KR101824234B1 (ko) 2018-01-31
CN102763201B (zh) 2015-07-15
US20140027440A1 (en) 2014-01-30
CN104617013A (zh) 2015-05-13
WO2011103391A3 (en) 2012-02-09
JP2016076708A (ja) 2016-05-12
KR20120137367A (ko) 2012-12-20
EP2537178A4 (en) 2013-07-17
JP2013520801A (ja) 2013-06-06
TW201145395A (en) 2011-12-16
US20110206358A1 (en) 2011-08-25
EP2537178A2 (en) 2012-12-26
JP6324938B2 (ja) 2018-05-16
US8548312B2 (en) 2013-10-01
US9612020B2 (en) 2017-04-04
JP2018093210A (ja) 2018-06-14

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