CN102763201B - 高效率高准确度加热器驱动器 - Google Patents

高效率高准确度加热器驱动器 Download PDF

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Publication number
CN102763201B
CN102763201B CN201180009496.3A CN201180009496A CN102763201B CN 102763201 B CN102763201 B CN 102763201B CN 201180009496 A CN201180009496 A CN 201180009496A CN 102763201 B CN102763201 B CN 102763201B
Authority
CN
China
Prior art keywords
transistor
temperature
rapid thermal
thermal processing
processing chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201180009496.3A
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English (en)
Chinese (zh)
Other versions
CN102763201A (zh
Inventor
亚历山大·戈尔丁
欧勒格·V·塞雷布里安诺夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to CN201410718136.6A priority Critical patent/CN104617013B/zh
Publication of CN102763201A publication Critical patent/CN102763201A/zh
Application granted granted Critical
Publication of CN102763201B publication Critical patent/CN102763201B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24C—DOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
    • F24C15/00—Details
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24C—DOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
    • F24C15/00—Details
    • F24C15/24—Radiant bodies or panels for radiation heaters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227—Applications
    • H05B1/023—Industrial applications
    • H05B1/0233—Industrial applications for semiconductors manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/0033—Heating devices using lamps
    • H05B3/0038—Heating devices using lamps for industrial applications
    • H05B3/0047—Heating devices using lamps for industrial applications for semiconductor manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Control Of Resistance Heating (AREA)
  • Circuit Arrangement For Electric Light Sources In General (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Control Of Temperature (AREA)
  • Control Of Electrical Variables (AREA)
CN201180009496.3A 2010-02-19 2011-02-18 高效率高准确度加热器驱动器 Expired - Fee Related CN102763201B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410718136.6A CN104617013B (zh) 2010-02-19 2011-02-18 高效率高准确度加热器驱动器

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/708,648 US8548312B2 (en) 2010-02-19 2010-02-19 High efficiency high accuracy heater driver
US12/708,648 2010-02-19
PCT/US2011/025391 WO2011103391A2 (en) 2010-02-19 2011-02-18 High efficiency high accuracy heater driver

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201410718136.6A Division CN104617013B (zh) 2010-02-19 2011-02-18 高效率高准确度加热器驱动器

Publications (2)

Publication Number Publication Date
CN102763201A CN102763201A (zh) 2012-10-31
CN102763201B true CN102763201B (zh) 2015-07-15

Family

ID=44476555

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201180009496.3A Expired - Fee Related CN102763201B (zh) 2010-02-19 2011-02-18 高效率高准确度加热器驱动器
CN201410718136.6A Expired - Fee Related CN104617013B (zh) 2010-02-19 2011-02-18 高效率高准确度加热器驱动器

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201410718136.6A Expired - Fee Related CN104617013B (zh) 2010-02-19 2011-02-18 高效率高准确度加热器驱动器

Country Status (8)

Country Link
US (3) US8548312B2 (enExample)
EP (1) EP2537178A4 (enExample)
JP (3) JP5887282B2 (enExample)
KR (2) KR101824234B1 (enExample)
CN (2) CN102763201B (enExample)
SG (1) SG183187A1 (enExample)
TW (2) TWI474403B (enExample)
WO (1) WO2011103391A2 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10734257B2 (en) * 2012-04-25 2020-08-04 Applied Materials, Inc. Direct current lamp driver for substrate processing
US9734659B2 (en) * 2014-08-06 2017-08-15 Mido Play Inc. Single platform system for multiple jurisdiction lotteries and social media
TW201626858A (zh) 2015-01-05 2016-07-16 應用材料股份有限公司 用於低壓環境的燈驅動器（二）
TWI612259B (zh) * 2016-02-26 2018-01-21 財團法人工業技術研究院 加熱設備以及加熱方法
US10908195B2 (en) 2016-06-15 2021-02-02 Watlow Electric Manufacturing Company System and method for controlling power to a heater
EP3813099B1 (en) 2016-06-15 2022-08-03 Watlow Electric Manufacturing Company Power converter for a thermal system
TWI790533B (zh) * 2017-08-10 2023-01-21 美商瓦特洛威電子製造公司 控制送至加熱器之電力的系統及方法
CN109429382A (zh) * 2017-08-24 2019-03-05 江苏威能电气有限公司 快速升降温加热器
DE102018203945B4 (de) 2018-03-15 2023-08-10 Siltronic Ag Verfahren zur Herstellung von Halbleiterscheiben
CN110554717B (zh) * 2019-08-15 2021-08-24 国电南瑞科技股份有限公司 适用于电力电子装置温度闭环调节的散热风扇设速方法
CN113405323A (zh) * 2021-07-21 2021-09-17 东方凯特瑞(成都)环保科技有限公司 一种用于蜂窝scr脱硝催化剂的微波干燥方法及装置
CN114060892B (zh) * 2021-11-29 2023-05-16 奥普家居股份有限公司 一种恒温浴霸及其控制方法、存储介质

Citations (4)

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EP1100114A2 (en) * 1999-11-09 2001-05-16 Axcelis Technologies, Inc. Zone controlled radiant heating system utilizing focused reflector
US20030029859A1 (en) * 2001-08-08 2003-02-13 Applied Materials, Inc. Lamphead for a rapid thermal processing chamber
TW545083B (en) * 1999-10-07 2003-08-01 Ushio Electric Inc Control apparatus for a light radiation-type rapid heating and processing device
US20080019679A1 (en) * 2004-08-24 2008-01-24 Fujitsu Limited Rapid thermal processing apparatus and method of manufacture of semiconductor device

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US4438356A (en) 1982-03-24 1984-03-20 International Rectifier Corporation Solid state relay circuit employing MOSFET power switching devices
JPH0327408A (ja) * 1989-06-24 1991-02-05 Matsushita Electric Works Ltd デユーテイ制御装置
JP3215613B2 (ja) * 1995-10-04 2001-10-09 古河電池株式会社 力率制御回路
US5751896A (en) 1996-02-22 1998-05-12 Micron Technology, Inc. Method and apparatus to compensate for non-uniform film growth during chemical vapor deposition
US5841110A (en) 1997-08-27 1998-11-24 Steag-Ast Gmbh Method and apparatus for improved temperature control in rapid thermal processing (RTP) systems
JP3304894B2 (ja) 1998-09-28 2002-07-22 ウシオ電機株式会社 フィラメントランプ点灯装置
JP2000235886A (ja) 1998-12-14 2000-08-29 Tokyo Electron Ltd 加熱手段の温度制御装置および温度制御方法
KR100432135B1 (ko) * 2001-06-30 2004-05-17 동부전자 주식회사 급속 열처리 장치
US20080090309A1 (en) * 2003-10-27 2008-04-17 Ranish Joseph M Controlled annealing method
US20060000551A1 (en) * 2004-06-30 2006-01-05 Saldana Miguel A Methods and apparatus for optimal temperature control in a plasma processing system
KR100966375B1 (ko) * 2005-04-04 2010-06-28 가부시키가이샤 코쿠사이덴키 세미컨덕터 서비스 공급전력 조정기 및 반도체 제조장치
JP2007095889A (ja) 2005-09-28 2007-04-12 Ushio Inc 光照射式加熱方法
JP4687393B2 (ja) * 2005-11-01 2011-05-25 日本放送協会 調光器
TW200921791A (en) * 2007-11-05 2009-05-16 United Microelectronics Corp Method of cleaning transparent device in a thermal process apparatus, thermal process apparatus and process using the same thermal process apparatus
KR20090069907A (ko) * 2007-12-26 2009-07-01 에이피시스템 주식회사 가열램프 제어장치 및 제어방법
JP5282409B2 (ja) 2008-02-25 2013-09-04 ウシオ電機株式会社 光照射式加熱方法及び光照射式加熱装置
WO2010005933A2 (en) * 2008-07-07 2010-01-14 Lam Research Corporation Passive capacitively-coupled electrostatic (cce) probe arrangement for detecting plasma instabilities in a plasma processing chamber

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW545083B (en) * 1999-10-07 2003-08-01 Ushio Electric Inc Control apparatus for a light radiation-type rapid heating and processing device
EP1100114A2 (en) * 1999-11-09 2001-05-16 Axcelis Technologies, Inc. Zone controlled radiant heating system utilizing focused reflector
US20030029859A1 (en) * 2001-08-08 2003-02-13 Applied Materials, Inc. Lamphead for a rapid thermal processing chamber
US20080019679A1 (en) * 2004-08-24 2008-01-24 Fujitsu Limited Rapid thermal processing apparatus and method of manufacture of semiconductor device

Also Published As

Publication number Publication date
EP2537178A2 (en) 2012-12-26
CN102763201A (zh) 2012-10-31
CN104617013A (zh) 2015-05-13
US20110206358A1 (en) 2011-08-25
US20140027440A1 (en) 2014-01-30
CN104617013B (zh) 2017-11-14
TW201145395A (en) 2011-12-16
KR101824234B1 (ko) 2018-01-31
TWI590333B (zh) 2017-07-01
EP2537178A4 (en) 2013-07-17
JP2013520801A (ja) 2013-06-06
US8548312B2 (en) 2013-10-01
JP2016076708A (ja) 2016-05-12
KR20120137367A (ko) 2012-12-20
KR20180014208A (ko) 2018-02-07
TW201517176A (zh) 2015-05-01
US20170162408A1 (en) 2017-06-08
TWI474403B (zh) 2015-02-21
JP5887282B2 (ja) 2016-03-16
US9612020B2 (en) 2017-04-04
WO2011103391A2 (en) 2011-08-25
JP6324938B2 (ja) 2018-05-16
JP2018093210A (ja) 2018-06-14
WO2011103391A3 (en) 2012-02-09
SG183187A1 (en) 2012-09-27
KR101890155B1 (ko) 2018-08-21

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SE01 Entry into force of request for substantive examination
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Granted publication date: 20150715

Termination date: 20190218