SG181560A1 - Methods and systems of material removal and pattern trans - Google Patents

Methods and systems of material removal and pattern trans Download PDF

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Publication number
SG181560A1
SG181560A1 SG2012041901A SG2012041901A SG181560A1 SG 181560 A1 SG181560 A1 SG 181560A1 SG 2012041901 A SG2012041901 A SG 2012041901A SG 2012041901 A SG2012041901 A SG 2012041901A SG 181560 A1 SG181560 A1 SG 181560A1
Authority
SG
Singapore
Prior art keywords
substrate
vuv
vacuum ultraviolet
radiation source
radiation
Prior art date
Application number
SG2012041901A
Other languages
English (en)
Inventor
Gerard M Schmid
Michael N Miller
Byung-Jin Choi
Douglas J Resnick
Sidlgata V Sreenivasan
Frank Y Xu
Darren D Donaldson
Original Assignee
Molecular Imprints Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molecular Imprints Inc filed Critical Molecular Imprints Inc
Publication of SG181560A1 publication Critical patent/SG181560A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/002—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor using materials containing microcapsules; Preparing or processing such materials, e.g. by pressure; Devices or apparatus specially designed therefor
    • G03F7/0022—Devices or apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
SG2012041901A 2010-01-27 2011-01-27 Methods and systems of material removal and pattern trans SG181560A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US29873410P 2010-01-27 2010-01-27
US29909710P 2010-01-28 2010-01-28
US13/014,508 US8980751B2 (en) 2010-01-27 2011-01-26 Methods and systems of material removal and pattern transfer
PCT/US2011/022679 WO2011094383A2 (en) 2010-01-27 2011-01-27 Methods and systems of material removal and pattern transfer

Publications (1)

Publication Number Publication Date
SG181560A1 true SG181560A1 (en) 2012-07-30

Family

ID=44309278

Family Applications (1)

Application Number Title Priority Date Filing Date
SG2012041901A SG181560A1 (en) 2010-01-27 2011-01-27 Methods and systems of material removal and pattern trans

Country Status (7)

Country Link
US (1) US8980751B2 (https=)
JP (1) JP5782460B2 (https=)
KR (1) KR101947524B1 (https=)
CN (1) CN102859436B (https=)
SG (1) SG181560A1 (https=)
TW (1) TWI551386B (https=)
WO (1) WO2011094383A2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110048518A1 (en) * 2009-08-26 2011-03-03 Molecular Imprints, Inc. Nanostructured thin film inorganic solar cells
US9070803B2 (en) 2010-05-11 2015-06-30 Molecular Imprints, Inc. Nanostructured solar cell
JP5634313B2 (ja) * 2011-03-29 2014-12-03 富士フイルム株式会社 レジストパターン形成方法およびそれを用いたパターン化基板の製造方法
US9616614B2 (en) 2012-02-22 2017-04-11 Canon Nanotechnologies, Inc. Large area imprint lithography
US11669009B2 (en) 2016-08-03 2023-06-06 Board Of Regents, The University Of Texas System Roll-to-roll programmable film imprint lithography

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4113523A1 (de) 1991-04-25 1992-10-29 Abb Patent Gmbh Verfahren zur behandlung von oberflaechen
JPH09123206A (ja) 1995-10-30 1997-05-13 Towa Kk 電子部品の樹脂封止成形装置
JP4045682B2 (ja) 1999-01-26 2008-02-13 株式会社日立ハイテクノロジーズ 紫外線照射による基板処理装置
US6873087B1 (en) 1999-10-29 2005-03-29 Board Of Regents, The University Of Texas System High precision orientation alignment and gap control stages for imprint lithography processes
DE19957034B4 (de) 1999-11-26 2006-04-13 Heraeus Noblelight Gmbh Verfahren zur Behandlung von Oberflächen von Substraten und Vorrichtung
US20030155657A1 (en) * 2002-02-14 2003-08-21 Nec Electronics Corporation Manufacturing method of semiconductor device
JP2003337432A (ja) 2002-05-20 2003-11-28 Tsukuba Semi Technology:Kk 機能水を使ったレジスト除去方法、およびその装置
US6932934B2 (en) 2002-07-11 2005-08-23 Molecular Imprints, Inc. Formation of discontinuous films during an imprint lithography process
US7077992B2 (en) 2002-07-11 2006-07-18 Molecular Imprints, Inc. Step and repeat imprint lithography processes
US6936194B2 (en) 2002-09-05 2005-08-30 Molecular Imprints, Inc. Functional patterning material for imprint lithography processes
WO2004027810A2 (en) * 2002-09-20 2004-04-01 Thomas Johnston System and method for removal of materials from an article
US8349241B2 (en) 2002-10-04 2013-01-08 Molecular Imprints, Inc. Method to arrange features on a substrate to replicate features having minimal dimensional variability
US20040065252A1 (en) 2002-10-04 2004-04-08 Sreenivasan Sidlgata V. Method of forming a layer on a substrate to facilitate fabrication of metrology standards
US7179396B2 (en) 2003-03-25 2007-02-20 Molecular Imprints, Inc. Positive tone bi-layer imprint lithography method
US7396475B2 (en) 2003-04-25 2008-07-08 Molecular Imprints, Inc. Method of forming stepped structures employing imprint lithography
US7157036B2 (en) 2003-06-17 2007-01-02 Molecular Imprints, Inc Method to reduce adhesion between a conformable region and a pattern of a mold
DE10343323A1 (de) 2003-09-11 2005-04-07 Carl Zeiss Smt Ag Stempellithografieverfahren sowie Vorrichtung und Stempel für die Stempellithografie
US8076386B2 (en) 2004-02-23 2011-12-13 Molecular Imprints, Inc. Materials for imprint lithography
US7029992B2 (en) 2004-08-17 2006-04-18 Taiwan Semiconductor Manufacturing Company Low oxygen content photoresist stripping process for low dielectric constant materials
US7449416B2 (en) * 2004-09-01 2008-11-11 Axcelis Technologies, Inc. Apparatus and plasma ashing process for increasing photoresist removal rate
EP1731962B1 (en) * 2005-06-10 2008-12-31 Obducat AB Pattern replication with intermediate stamp
US20070138405A1 (en) * 2005-12-16 2007-06-21 3M Innovative Properties Company Corona etching
JP2008091685A (ja) 2006-10-03 2008-04-17 Seiko Epson Corp 素子基板およびその製造方法
US7832416B2 (en) 2006-10-10 2010-11-16 Hewlett-Packard Development Company, L.P. Imprint lithography apparatus and methods
KR100796047B1 (ko) * 2006-11-21 2008-01-21 제일모직주식회사 레지스트 하층막용 하드마스크 조성물, 이를 이용한 반도체집적회로 디바이스의 제조방법 및 그로부터 제조된 반도체집적회로 디바이스
US8337959B2 (en) 2006-11-28 2012-12-25 Nanonex Corporation Method and apparatus to apply surface release coating for imprint mold
US20080302400A1 (en) 2007-06-05 2008-12-11 Thomas Johnston System and Method for Removal of Materials from an Article
JP2009034926A (ja) 2007-08-02 2009-02-19 Sumitomo Electric Ind Ltd 樹脂パターン形成方法
US20090166317A1 (en) * 2007-12-26 2009-07-02 Canon Kabushiki Kaisha Method of processing substrate by imprinting
JP5149083B2 (ja) 2008-06-16 2013-02-20 富士フイルム株式会社 パターン形成方法、並びに基板加工方法、モールド構造体の複製方法、及びモールド構造体
US8394203B2 (en) 2008-10-02 2013-03-12 Molecular Imprints, Inc. In-situ cleaning of an imprint lithography tool

Also Published As

Publication number Publication date
JP5782460B2 (ja) 2015-09-24
US20110183521A1 (en) 2011-07-28
TWI551386B (zh) 2016-10-01
KR20120125297A (ko) 2012-11-14
TW201139032A (en) 2011-11-16
JP2013518446A (ja) 2013-05-20
CN102859436A (zh) 2013-01-02
WO2011094383A2 (en) 2011-08-04
US8980751B2 (en) 2015-03-17
KR101947524B1 (ko) 2019-02-13
WO2011094383A3 (en) 2011-09-29
CN102859436B (zh) 2015-07-15

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