SG171843A1 - Controlling ion energy distribution in plasma processing systems - Google Patents
Controlling ion energy distribution in plasma processing systems Download PDFInfo
- Publication number
- SG171843A1 SG171843A1 SG2011038601A SG2011038601A SG171843A1 SG 171843 A1 SG171843 A1 SG 171843A1 SG 2011038601 A SG2011038601 A SG 2011038601A SG 2011038601 A SG2011038601 A SG 2011038601A SG 171843 A1 SG171843 A1 SG 171843A1
- Authority
- SG
- Singapore
- Prior art keywords
- electrode
- plasma processing
- substrate
- processing system
- plasma
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 103
- 230000000737 periodic effect Effects 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims description 10
- 241000206607 Porphyra umbilicalis Species 0.000 claims description 4
- 230000008569 process Effects 0.000 claims description 4
- 150000002500 ions Chemical class 0.000 description 39
- 239000003990 capacitor Substances 0.000 description 31
- 230000000903 blocking effect Effects 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- 238000010420 art technique Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 6
- 239000010453 quartz Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 230000003071 parasitic effect Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000008030 elimination Effects 0.000 description 2
- 238000003379 elimination reaction Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Plasma Technology (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Electromagnetism (AREA)
- Drying Of Semiconductors (AREA)
- Recrystallisation Techniques (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13948808P | 2008-12-19 | 2008-12-19 | |
| US12/634,959 US9887069B2 (en) | 2008-12-19 | 2009-12-10 | Controlling ion energy distribution in plasma processing systems |
| PCT/US2009/068186 WO2010080421A2 (en) | 2008-12-19 | 2009-12-16 | Controlling ion energy distribution in plasma processing systems |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG171843A1 true SG171843A1 (en) | 2011-07-28 |
Family
ID=42264351
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2011038601A SG171843A1 (en) | 2008-12-19 | 2009-12-16 | Controlling ion energy distribution in plasma processing systems |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9887069B2 (enExample) |
| EP (1) | EP2380413A4 (enExample) |
| JP (2) | JP5888981B2 (enExample) |
| KR (2) | KR101650972B1 (enExample) |
| CN (1) | CN102257886B (enExample) |
| SG (1) | SG171843A1 (enExample) |
| TW (2) | TWI639362B (enExample) |
| WO (1) | WO2010080421A2 (enExample) |
Families Citing this family (53)
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| US9287086B2 (en) * | 2010-04-26 | 2016-03-15 | Advanced Energy Industries, Inc. | System, method and apparatus for controlling ion energy distribution |
| US11615941B2 (en) | 2009-05-01 | 2023-03-28 | Advanced Energy Industries, Inc. | System, method, and apparatus for controlling ion energy distribution in plasma processing systems |
| US9435029B2 (en) * | 2010-08-29 | 2016-09-06 | Advanced Energy Industries, Inc. | Wafer chucking system for advanced plasma ion energy processing systems |
| US9767988B2 (en) | 2010-08-29 | 2017-09-19 | Advanced Energy Industries, Inc. | Method of controlling the switched mode ion energy distribution system |
| US9309594B2 (en) * | 2010-04-26 | 2016-04-12 | Advanced Energy Industries, Inc. | System, method and apparatus for controlling ion energy distribution of a projected plasma |
| JP5909785B2 (ja) * | 2010-12-07 | 2016-04-27 | デスコ インダストリーズ， インコーポレイテッド | イオン平衡測定及び調整のための遮蔽されたコンデンサ回路を有する電離平衡装置 |
| TW201316375A (zh) * | 2011-10-05 | 2013-04-16 | Intevac Inc | 電感／電容複合式電漿供應源及具有其腔室之系統 |
| US9685297B2 (en) | 2012-08-28 | 2017-06-20 | Advanced Energy Industries, Inc. | Systems and methods for monitoring faults, anomalies, and other characteristics of a switched mode ion energy distribution system |
| JP6329542B2 (ja) * | 2012-08-28 | 2018-05-23 | アドバンスト・エナジー・インダストリーズ・インコーポレイテッドＡｄｖａｎｃｅｄ Ｅｎｅｒｇｙ Ｉｎｄｕｓｔｒｉｅｓ， Ｉｎｃ． | プラズマ処理システム、プラズマシース電圧確立方法、および当該方法を実行可能な命令を読み取り可能な記憶媒体 |
| EP2935648B1 (en) * | 2012-12-21 | 2019-08-28 | AGC Inc. | Pair of electrodes for dbd plasma process |
| US9460894B2 (en) | 2013-06-28 | 2016-10-04 | Lam Research Corporation | Controlling ion energy within a plasma chamber |
| EP2854155B1 (en) * | 2013-09-27 | 2017-11-08 | INDEOtec SA | Plasma reactor vessel and assembly, and a method of performing plasma processing |
| US10312048B2 (en) * | 2016-12-12 | 2019-06-04 | Applied Materials, Inc. | Creating ion energy distribution functions (IEDF) |
| US10510575B2 (en) | 2017-09-20 | 2019-12-17 | Applied Materials, Inc. | Substrate support with multiple embedded electrodes |
| KR20190036345A (ko) * | 2017-09-27 | 2019-04-04 | 삼성전자주식회사 | 플라즈마 처리 장치 및 플라즈마 처리 방법 |
| CN111788655B (zh) | 2017-11-17 | 2024-04-05 | 先进工程解决方案全球控股私人有限公司 | 对等离子体处理的离子偏置电压的空间和时间控制 |
| PL3711080T3 (pl) | 2017-11-17 | 2023-12-11 | Aes Global Holdings, Pte. Ltd. | Zsynchronizowane pulsowanie źródła przetwarzania plazmy oraz polaryzacji podłoża |
| KR102877884B1 (ko) | 2017-11-17 | 2025-11-04 | 에이이에스 글로벌 홀딩스 피티이 리미티드 | 플라즈마 프로세싱 시스템에서 변조 공급기들의 개선된 적용 |
| US11437221B2 (en) | 2017-11-17 | 2022-09-06 | Advanced Energy Industries, Inc. | Spatial monitoring and control of plasma processing environments |
| US12230476B2 (en) | 2017-11-17 | 2025-02-18 | Advanced Energy Industries, Inc. | Integrated control of a plasma processing system |
| CN108333453B (zh) * | 2018-03-20 | 2020-11-10 | 江苏邦士医疗科技有限公司 | 降低信号源内部冲击电流及等离子体产生的软件处理算法 |
| KR102592922B1 (ko) * | 2018-06-21 | 2023-10-23 | 삼성전자주식회사 | 기판 처리 장치, 신호 소스 장치, 물질막의 처리 방법, 및 반도체 소자의 제조 방법 |
| KR102600003B1 (ko) | 2018-10-30 | 2023-11-09 | 삼성전자주식회사 | 반도체 공정 챔버 및 반도체 소자의 제조 방법 |
| US11476145B2 (en) | 2018-11-20 | 2022-10-18 | Applied Materials, Inc. | Automatic ESC bias compensation when using pulsed DC bias |
| KR102744694B1 (ko) * | 2019-01-10 | 2024-12-19 | 삼성전자주식회사 | 플라즈마 처리 방법 및 플라즈마 처리 장치 |
| JP7451540B2 (ja) | 2019-01-22 | 2024-03-18 | アプライド マテリアルズ インコーポレイテッド | パルス状電圧波形を制御するためのフィードバックループ |
| US20230352264A1 (en) * | 2019-05-07 | 2023-11-02 | Applied Materials, Inc. | Creating Ion Energy Distribution Functions (IEDF) |
| JP7603649B2 (ja) | 2019-07-12 | 2024-12-20 | エーイーエス グローバル ホールディングス， プライベート リミテッド | 単一制御型スイッチを伴うバイアス供給装置 |
| NL2023935B1 (en) * | 2019-10-02 | 2021-05-31 | Prodrive Tech Bv | Determining an optimal ion energy for plasma processing of a dielectric substrate |
| CN112670149B (zh) * | 2019-10-15 | 2025-06-24 | 北京烁科中科信电子装备有限公司 | 一种消除电极电荷积累的方法 |
| JP7411463B2 (ja) * | 2020-03-17 | 2024-01-11 | 東京エレクトロン株式会社 | 検査方法及び検査装置 |
| US12125674B2 (en) | 2020-05-11 | 2024-10-22 | Advanced Energy Industries, Inc. | Surface charge and power feedback and control using a switch mode bias system |
| US11462389B2 (en) | 2020-07-31 | 2022-10-04 | Applied Materials, Inc. | Pulsed-voltage hardware assembly for use in a plasma processing system |
| US11798790B2 (en) | 2020-11-16 | 2023-10-24 | Applied Materials, Inc. | Apparatus and methods for controlling ion energy distribution |
| US11901157B2 (en) | 2020-11-16 | 2024-02-13 | Applied Materials, Inc. | Apparatus and methods for controlling ion energy distribution |
| US11948780B2 (en) | 2021-05-12 | 2024-04-02 | Applied Materials, Inc. | Automatic electrostatic chuck bias compensation during plasma processing |
| US11791138B2 (en) | 2021-05-12 | 2023-10-17 | Applied Materials, Inc. | Automatic electrostatic chuck bias compensation during plasma processing |
| US11967483B2 (en) | 2021-06-02 | 2024-04-23 | Applied Materials, Inc. | Plasma excitation with ion energy control |
| US11810760B2 (en) | 2021-06-16 | 2023-11-07 | Applied Materials, Inc. | Apparatus and method of ion current compensation |
| US11569066B2 (en) | 2021-06-23 | 2023-01-31 | Applied Materials, Inc. | Pulsed voltage source for plasma processing applications |
| US11776788B2 (en) | 2021-06-28 | 2023-10-03 | Applied Materials, Inc. | Pulsed voltage boost for substrate processing |
| US11476090B1 (en) | 2021-08-24 | 2022-10-18 | Applied Materials, Inc. | Voltage pulse time-domain multiplexing |
| US12106938B2 (en) | 2021-09-14 | 2024-10-01 | Applied Materials, Inc. | Distortion current mitigation in a radio frequency plasma processing chamber |
| US11694876B2 (en) | 2021-12-08 | 2023-07-04 | Applied Materials, Inc. | Apparatus and method for delivering a plurality of waveform signals during plasma processing |
| US11942309B2 (en) | 2022-01-26 | 2024-03-26 | Advanced Energy Industries, Inc. | Bias supply with resonant switching |
| US11670487B1 (en) | 2022-01-26 | 2023-06-06 | Advanced Energy Industries, Inc. | Bias supply control and data processing |
| US12046448B2 (en) | 2022-01-26 | 2024-07-23 | Advanced Energy Industries, Inc. | Active switch on time control for bias supply |
| US20250259821A1 (en) * | 2022-04-25 | 2025-08-14 | Lam Research Corporation | Method to enhance etch rate and improve critical dimension of features and mask selectivity |
| US11972924B2 (en) | 2022-06-08 | 2024-04-30 | Applied Materials, Inc. | Pulsed voltage source for plasma processing applications |
| US12315732B2 (en) | 2022-06-10 | 2025-05-27 | Applied Materials, Inc. | Method and apparatus for etching a semiconductor substrate in a plasma etch chamber |
| US11978613B2 (en) | 2022-09-01 | 2024-05-07 | Advanced Energy Industries, Inc. | Transition control in a bias supply |
| US12272524B2 (en) | 2022-09-19 | 2025-04-08 | Applied Materials, Inc. | Wideband variable impedance load for high volume manufacturing qualification and on-site diagnostics |
| US12111341B2 (en) | 2022-10-05 | 2024-10-08 | Applied Materials, Inc. | In-situ electric field detection method and apparatus |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100324792B1 (ko) * | 1993-03-31 | 2002-06-20 | 히가시 데쓰로 | 플라즈마처리장치 |
| US6391147B2 (en) * | 1994-04-28 | 2002-05-21 | Tokyo Electron Limited | Plasma treatment method and apparatus |
| EP0801809A2 (en) * | 1995-06-19 | 1997-10-22 | The University Of Tennessee Research Corporation | Discharge methods and electrodes for generating plasmas at one atmosphere of pressure, and materials treated therewith |
| US6902683B1 (en) | 1996-03-01 | 2005-06-07 | Hitachi, Ltd. | Plasma processing apparatus and plasma processing method |
| TW335517B (en) | 1996-03-01 | 1998-07-01 | Hitachi Ltd | Apparatus and method for processing plasma |
| FR2782837B1 (fr) * | 1998-08-28 | 2000-09-29 | Air Liquide | Procede et dispositif de traitement de surface par plasma a pression atmospherique |
| US6201208B1 (en) | 1999-11-04 | 2001-03-13 | Wisconsin Alumni Research Foundation | Method and apparatus for plasma processing with control of ion energy distribution at the substrates |
| TW511398B (en) | 2000-09-12 | 2002-11-21 | Tokyo Electron Ltd | Apparatus and method to control the uniformity of plasma by reducing radial loss |
| JP4557400B2 (ja) * | 2000-09-14 | 2010-10-06 | キヤノン株式会社 | 堆積膜形成方法 |
| US6806201B2 (en) * | 2000-09-29 | 2004-10-19 | Hitachi, Ltd. | Plasma processing apparatus and method using active matching |
| US6957595B2 (en) | 2001-07-13 | 2005-10-25 | Deere & Co. | Tilt steering wheel mechanism |
| US6984288B2 (en) * | 2001-08-08 | 2006-01-10 | Lam Research Corporation | Plasma processor in plasma confinement region within a vacuum chamber |
| JP3898612B2 (ja) | 2001-09-20 | 2007-03-28 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置及び処理方法 |
| JP4319514B2 (ja) * | 2002-11-29 | 2009-08-26 | 株式会社日立ハイテクノロジーズ | サグ補償機能付き高周波電源を有するプラズマ処理装置 |
| US20040118344A1 (en) * | 2002-12-20 | 2004-06-24 | Lam Research Corporation | System and method for controlling plasma with an adjustable coupling to ground circuit |
| JP4365227B2 (ja) | 2004-01-14 | 2009-11-18 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置およびプラズマ処理方法 |
| US20050241762A1 (en) * | 2004-04-30 | 2005-11-03 | Applied Materials, Inc. | Alternating asymmetrical plasma generation in a process chamber |
| US7740737B2 (en) * | 2004-06-21 | 2010-06-22 | Tokyo Electron Limited | Plasma processing apparatus and method |
| KR100586402B1 (ko) | 2005-04-15 | 2006-06-08 | (주) 브이에스아이 | 플라즈마 이온주입장치 및 이온주입방법 |
| JP5031252B2 (ja) | 2006-03-30 | 2012-09-19 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| JP5199595B2 (ja) * | 2007-03-27 | 2013-05-15 | 東京エレクトロン株式会社 | プラズマ処理装置及びそのクリーニング方法 |
| KR20080111627A (ko) * | 2007-06-19 | 2008-12-24 | 삼성전자주식회사 | 플라즈마 공정장치 및 그 방법 |
| US8133359B2 (en) * | 2007-11-16 | 2012-03-13 | Advanced Energy Industries, Inc. | Methods and apparatus for sputtering deposition using direct current |
-
2009
- 2009-12-10 US US12/634,959 patent/US9887069B2/en active Active
- 2009-12-16 EP EP09837888.8A patent/EP2380413A4/en not_active Withdrawn
- 2009-12-16 SG SG2011038601A patent/SG171843A1/en unknown
- 2009-12-16 JP JP2011542363A patent/JP5888981B2/ja not_active Expired - Fee Related
- 2009-12-16 WO PCT/US2009/068186 patent/WO2010080421A2/en not_active Ceased
- 2009-12-16 KR KR1020117013687A patent/KR101650972B1/ko active Active
- 2009-12-16 CN CN200980150484.5A patent/CN102257886B/zh active Active
- 2009-12-16 KR KR1020157022471A patent/KR101679528B1/ko active Active
- 2009-12-18 TW TW104131082A patent/TWI639362B/zh active
- 2009-12-18 TW TW098143689A patent/TWI516174B/zh not_active IP Right Cessation
-
2014
- 2014-08-11 JP JP2014163626A patent/JP5883481B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TWI516174B (zh) | 2016-01-01 |
| KR101679528B1 (ko) | 2016-11-24 |
| JP5888981B2 (ja) | 2016-03-22 |
| TW201031279A (en) | 2010-08-16 |
| JP5883481B2 (ja) | 2016-03-15 |
| TWI639362B (zh) | 2018-10-21 |
| KR101650972B1 (ko) | 2016-08-24 |
| WO2010080421A2 (en) | 2010-07-15 |
| US9887069B2 (en) | 2018-02-06 |
| KR20110112804A (ko) | 2011-10-13 |
| WO2010080421A3 (en) | 2010-08-26 |
| JP2012513124A (ja) | 2012-06-07 |
| CN102257886B (zh) | 2014-09-17 |
| WO2010080421A4 (en) | 2010-10-07 |
| EP2380413A4 (en) | 2015-12-02 |
| JP2015029104A (ja) | 2015-02-12 |
| EP2380413A2 (en) | 2011-10-26 |
| KR20150103304A (ko) | 2015-09-09 |
| US20100154994A1 (en) | 2010-06-24 |
| CN102257886A (zh) | 2011-11-23 |
| TW201603651A (zh) | 2016-01-16 |
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