SG163442A1 - System and method for inspecting a wafer - Google Patents

System and method for inspecting a wafer

Info

Publication number
SG163442A1
SG163442A1 SG200900229-6A SG2009002296A SG163442A1 SG 163442 A1 SG163442 A1 SG 163442A1 SG 2009002296 A SG2009002296 A SG 2009002296A SG 163442 A1 SG163442 A1 SG 163442A1
Authority
SG
Singapore
Prior art keywords
images
wafer
image
inspection
inspecting
Prior art date
Application number
SG200900229-6A
Other languages
English (en)
Inventor
Ajharali Amanullah
Cheng Ge Han
Original Assignee
Semiconductor Technologies & Instruments
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Technologies & Instruments filed Critical Semiconductor Technologies & Instruments
Priority to SG200900229-6A priority Critical patent/SG163442A1/en
Priority to SG200901109-9A priority patent/SG164292A1/en
Priority to SG200901110-7A priority patent/SG164293A1/en
Priority to JP2011545325A priority patent/JP5672240B2/ja
Priority to CN201010004815.9A priority patent/CN101924053B/zh
Priority to CN201010004240.0A priority patent/CN101853797B/zh
Priority to EP10731444.5A priority patent/EP2387794A4/en
Priority to EP10731445.2A priority patent/EP2387795A4/en
Priority to CN201010004722.6A priority patent/CN101783306B/zh
Priority to KR1020100003272A priority patent/KR101656045B1/ko
Priority to TW099100872A priority patent/TWI658524B/zh
Priority to US12/657,076 priority patent/US8885918B2/en
Priority to MYPI2010000166A priority patent/MY169618A/en
Priority to KR1020100003273A priority patent/KR101646743B1/ko
Priority to EP16207592.3A priority patent/EP3173773A1/en
Priority to MYPI2010000164A priority patent/MY149581A/en
Priority to PCT/SG2010/000006 priority patent/WO2010082902A2/en
Priority to EP14197439.4A priority patent/EP2848923A1/en
Priority to JP2011545327A priority patent/JP5934874B2/ja
Priority to PT107314460T priority patent/PT2387796T/pt
Priority to EP10731446.0A priority patent/EP2387796B1/en
Priority to PCT/SG2010/000005 priority patent/WO2010082901A2/en
Priority to KR1020100003271A priority patent/KR101638883B1/ko
Priority to EP18189616.8A priority patent/EP3431968B1/en
Priority to TW102106188A priority patent/TWI575626B/zh
Priority to CN201410258203.0A priority patent/CN104091766B/zh
Priority to MYPI2010000165A priority patent/MY188165A/en
Priority to JP2011545326A priority patent/JP6103171B2/ja
Priority to TW099100874A priority patent/TWI575625B/zh
Priority to US12/657,068 priority patent/US10161881B2/en
Priority to CN201310283291.5A priority patent/CN103630549B/zh
Priority to PCT/SG2010/000004 priority patent/WO2010082900A2/en
Priority to TW099100877A priority patent/TWI551855B/zh
Priority to US12/657,089 priority patent/US9863889B2/en
Publication of SG163442A1 publication Critical patent/SG163442A1/en
Priority to HK11103452.2A priority patent/HK1149367A1/zh
Priority to HK11103913.5A priority patent/HK1149632A1/zh
Priority to IL214512A priority patent/IL214512A0/en
Priority to IL213915A priority patent/IL213915B/en
Priority to IL213946A priority patent/IL213946A/en
Priority to KR1020130019364A priority patent/KR101612535B1/ko
Priority to IL225929A priority patent/IL225929A0/en
Priority to JP2013192270A priority patent/JP2014016358A/ja
Priority to US13/998,046 priority patent/US20150233840A1/en
Priority to PH12013000288A priority patent/PH12013000288B1/en
Priority to HK15101274.8A priority patent/HK1201982A1/zh
Priority to JP2016140885A priority patent/JP2016183978A/ja
Priority to IL259567A priority patent/IL259567B/en
Priority to US16/119,340 priority patent/US10876975B2/en
Priority to JP2018179667A priority patent/JP6820891B2/ja

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8822—Dark field detection
    • G01N2021/8825—Separate detection of dark field and bright field
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10141—Special mode during image acquisition
    • G06T2207/10152—Varying illumination
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20212—Image combination
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
SG200900229-6A 2009-01-13 2009-01-13 System and method for inspecting a wafer SG163442A1 (en)

Priority Applications (49)

Application Number Priority Date Filing Date Title
SG200900229-6A SG163442A1 (en) 2009-01-13 2009-01-13 System and method for inspecting a wafer
SG200901109-9A SG164292A1 (en) 2009-01-13 2009-02-16 System and method for inspecting a wafer
SG200901110-7A SG164293A1 (en) 2009-01-13 2009-02-16 System and method for inspecting a wafer
JP2011545325A JP5672240B2 (ja) 2009-01-13 2010-01-13 ウェーハを検査するためのシステム及び方法
CN201010004815.9A CN101924053B (zh) 2009-01-13 2010-01-13 检测晶片的系统和方法
CN201010004240.0A CN101853797B (zh) 2009-01-13 2010-01-13 用于检测晶片的系统和方法
EP10731444.5A EP2387794A4 (en) 2009-01-13 2010-01-13 System and method for inspecting a wafer
EP10731445.2A EP2387795A4 (en) 2009-01-13 2010-01-13 System and method for inspecting a wafer
CN201010004722.6A CN101783306B (zh) 2009-01-13 2010-01-13 检测晶片的系统和方法
KR1020100003272A KR101656045B1 (ko) 2009-01-13 2010-01-13 웨이퍼 검사 시스템 및 방법
TW099100872A TWI658524B (zh) 2009-01-13 2010-01-13 檢測晶圓之系統及方法
US12/657,076 US8885918B2 (en) 2009-01-13 2010-01-13 System and method for inspecting a wafer
MYPI2010000166A MY169618A (en) 2009-01-13 2010-01-13 System and method for inspecting a wafer
KR1020100003273A KR101646743B1 (ko) 2009-01-13 2010-01-13 웨이퍼 검사 시스템 및 방법
EP16207592.3A EP3173773A1 (en) 2009-01-13 2010-01-13 System and method for inspecting a wafer
MYPI2010000164A MY149581A (en) 2009-01-13 2010-01-13 System and method for inspecting a wafer
PCT/SG2010/000006 WO2010082902A2 (en) 2009-01-13 2010-01-13 System and method for inspecting a wafer
EP14197439.4A EP2848923A1 (en) 2009-01-13 2010-01-13 System and method for inspecting a wafer
JP2011545327A JP5934874B2 (ja) 2009-01-13 2010-01-13 ウェーハを検査するためのシステム及び方法
PT107314460T PT2387796T (pt) 2009-01-13 2010-01-13 Sistema e método para inspecionar uma pastilha de semicondutor
EP10731446.0A EP2387796B1 (en) 2009-01-13 2010-01-13 System and method for inspecting a wafer
PCT/SG2010/000005 WO2010082901A2 (en) 2009-01-13 2010-01-13 System and method for inspecting a wafer
KR1020100003271A KR101638883B1 (ko) 2009-01-13 2010-01-13 웨이퍼 검사 시스템 및 방법
EP18189616.8A EP3431968B1 (en) 2009-01-13 2010-01-13 System and method for inspecting a wafer
TW102106188A TWI575626B (zh) 2009-01-13 2010-01-13 檢測晶圓之系統及方法
CN201410258203.0A CN104091766B (zh) 2009-01-13 2010-01-13 检测晶片的系统和方法
MYPI2010000165A MY188165A (en) 2009-01-13 2010-01-13 System and method for inspecting a wafer
JP2011545326A JP6103171B2 (ja) 2009-01-13 2010-01-13 ウェーハを検査するためのシステム及び方法
TW099100874A TWI575625B (zh) 2009-01-13 2010-01-13 檢測晶圓之系統及方法
US12/657,068 US10161881B2 (en) 2009-01-13 2010-01-13 System and method for inspecting a wafer
CN201310283291.5A CN103630549B (zh) 2009-01-13 2010-01-13 检测晶片的系统和方法
PCT/SG2010/000004 WO2010082900A2 (en) 2009-01-13 2010-01-13 System and method for inspecting a wafer
TW099100877A TWI551855B (zh) 2009-01-13 2010-01-13 檢測晶圓之系統與方法以及由該系統讀取的程式儲存裝置
US12/657,089 US9863889B2 (en) 2009-01-13 2010-01-13 System and method for inspecting a wafer
HK11103452.2A HK1149367A1 (zh) 2009-01-13 2011-04-06 用於檢測晶片的系統和方法
HK11103913.5A HK1149632A1 (zh) 2009-01-13 2011-04-19 檢測晶片的系統和方法
IL214512A IL214512A0 (en) 2009-01-13 2011-06-28 System and method for inspecting a wafer
IL213915A IL213915B (en) 2009-01-13 2011-07-04 System and method for substrate testing
IL213946A IL213946A (en) 2009-01-13 2011-07-05 A system and method for examining slices
KR1020130019364A KR101612535B1 (ko) 2009-01-13 2013-02-22 웨이퍼 검사 시스템 및 방법
IL225929A IL225929A0 (en) 2009-01-13 2013-04-24 System and method for monitoring chunk splitting
JP2013192270A JP2014016358A (ja) 2009-01-13 2013-09-17 ウェーハを検査するためのシステム及び方法
US13/998,046 US20150233840A1 (en) 2009-01-13 2013-09-25 System and method for inspecting a wafer
PH12013000288A PH12013000288B1 (en) 2009-01-13 2013-09-25 System and method for inspecting a wafer
HK15101274.8A HK1201982A1 (zh) 2009-01-13 2015-02-05 檢測晶片的系統和方法
JP2016140885A JP2016183978A (ja) 2009-01-13 2016-07-15 ウェーハを検査するためのシステム及び方法
IL259567A IL259567B (en) 2009-01-13 2018-05-23 A system and method for testing a substrate
US16/119,340 US10876975B2 (en) 2009-01-13 2018-08-31 System and method for inspecting a wafer
JP2018179667A JP6820891B2 (ja) 2009-01-13 2018-09-26 ウェーハの検査システム及び方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200900229-6A SG163442A1 (en) 2009-01-13 2009-01-13 System and method for inspecting a wafer

Publications (1)

Publication Number Publication Date
SG163442A1 true SG163442A1 (en) 2010-08-30

Family

ID=54196599

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200900229-6A SG163442A1 (en) 2009-01-13 2009-01-13 System and method for inspecting a wafer

Country Status (11)

Country Link
US (1) US9863889B2 (zh)
EP (1) EP2387794A4 (zh)
JP (1) JP5672240B2 (zh)
KR (1) KR101638883B1 (zh)
CN (2) CN104091766B (zh)
HK (2) HK1149632A1 (zh)
IL (1) IL214512A0 (zh)
MY (1) MY149581A (zh)
SG (1) SG163442A1 (zh)
TW (1) TWI658524B (zh)
WO (1) WO2010082900A2 (zh)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8945361B2 (en) * 2005-09-20 2015-02-03 ProteinSimple Electrophoresis standards, methods and kits
US8681215B2 (en) * 2011-04-29 2014-03-25 ProteinSimple Method and particle analyzer for determining a broad particle size distribution
KR101877468B1 (ko) 2011-12-29 2018-07-12 삼성전자주식회사 광원 장치 및 광 생성 방법
US9553034B1 (en) * 2012-03-27 2017-01-24 Kla-Tencor Corporation Combined semiconductor metrology system
CN103364403A (zh) * 2012-04-06 2013-10-23 鸿富锦精密工业（深圳）有限公司 产品质量自动化控管系统及方法
US9239295B2 (en) 2012-04-09 2016-01-19 Kla-Tencor Corp. Variable polarization wafer inspection
TWI460394B (zh) * 2012-07-20 2014-11-11 Test Research Inc 三維影像量測裝置
CN102854196B (zh) * 2012-09-24 2014-06-25 江苏物联网研究发展中心 Mems结构缺陷的晶圆级自动检测方法
US9194800B2 (en) * 2012-10-29 2015-11-24 Tokitae Llc Systems, devices, and methods employing angular-resolved scattering and spectrally resolved measurements for classification of objects
US9354185B2 (en) * 2012-12-21 2016-05-31 Advanced Micro Devices, Inc. 3D imaging with multiple irradiation frequencies
KR102242514B1 (ko) * 2013-11-20 2021-04-20 세미컨덕터 테크놀로지스 앤드 인스트루먼츠 피티이 엘티디 부품 측벽들을 선택적으로 검사하는 장치 및 방법
TWI489098B (zh) * 2014-03-11 2015-06-21 Utechzone Co Ltd Defect detection method and defect detection device
CN104977306A (zh) * 2014-04-08 2015-10-14 上海微电子装备有限公司 一种表面缺陷检测系统及方法
JP6370177B2 (ja) * 2014-09-05 2018-08-08 株式会社Ｓｃｒｅｅｎホールディングス 検査装置および検査方法
JP6486050B2 (ja) 2014-09-29 2019-03-20 株式会社Ｓｃｒｅｅｎホールディングス 検査装置および検査方法
US9816940B2 (en) * 2015-01-21 2017-11-14 Kla-Tencor Corporation Wafer inspection with focus volumetric method
DE102015207687A1 (de) * 2015-04-27 2016-10-27 Fabryki Mebli "Forte" Sa Verfahren und Vorrichtung zur Überprüfung der Produktqualität von zweidimensionalen Produkten
KR20210099172A (ko) * 2015-06-05 2021-08-11 케이엘에이 코포레이션 반도체 디바이스들의 적어도 측면들의 검사를 위한 장치, 방법 및 컴퓨터 프로그램 제품
EP3113215A1 (en) * 2015-06-30 2017-01-04 IMEC vzw Method and device for inspection of a semiconductor device
TWI598624B (zh) * 2015-08-25 2017-09-11 先進光電科技股份有限公司 光學成像系統
JP6765791B2 (ja) * 2015-08-25 2020-10-07 キヤノン株式会社 パターンマッチング用の基準画像セットの作成方法、パターンマッチング用の基準画像セットの作成装置、ワークの認識方法、プログラム、及び記録媒体
US10127651B2 (en) * 2016-01-15 2018-11-13 Kla-Tencor Corporation Defect sensitivity of semiconductor wafer inspectors using design data with wafer image data
CN106204598B (zh) * 2016-07-13 2019-02-05 东方晶源微电子科技（北京）有限公司 在自动缺陷分类流程中管理缺陷的方法及系统
US11815347B2 (en) 2016-09-28 2023-11-14 Kla-Tencor Corporation Optical near-field metrology
US10887580B2 (en) * 2016-10-07 2021-01-05 Kla-Tencor Corporation Three-dimensional imaging for semiconductor wafer inspection
CN107144577B (zh) * 2016-11-23 2020-04-10 阜宁协鑫光伏科技有限公司 一种硅切片穿孔判定的方法
US10504761B2 (en) * 2017-02-08 2019-12-10 Semiconductor Technologies & Instruments Pte. Ltd. Method system for generating 3D composite images of objects and determining object properties based thereon
TW201918700A (zh) * 2017-05-05 2019-05-16 美商3M新設資產公司 散射測量系統及其使用方法
US11578967B2 (en) * 2017-06-08 2023-02-14 Onto Innovation Inc. Wafer inspection system including a laser triangulation sensor
DE102018106751A1 (de) * 2017-07-31 2019-01-31 Taiwan Semiconductor Manufacturing Co. Ltd. Automatisiertes inspektionswerkzeug
CN109387518B (zh) * 2017-08-02 2022-06-17 上海微电子装备（集团）股份有限公司 自动光学检测方法
CN107741427B (zh) * 2017-11-30 2021-02-19 南京航空航天大学 汽车发动机涡轮壳表面缺陷的机器视觉检测装置及方法
TWI644288B (zh) * 2018-02-08 2018-12-11 力成科技股份有限公司 熱板表面之檢測方法
CN108732189A (zh) * 2018-08-03 2018-11-02 江苏阿瑞斯智能设备有限公司 一种晶圆芯片检测设备
US11138722B2 (en) * 2018-12-21 2021-10-05 Kla-Tencor Corporation Differential imaging for single-path optical wafer inspection
US11276161B2 (en) * 2019-02-26 2022-03-15 KLA Corp. Reference image generation for semiconductor applications
WO2020237105A1 (en) * 2019-05-21 2020-11-26 Applied Materials, Inc. Enhanced cross sectional features measurement methodology
CN110132141B (zh) * 2019-06-13 2021-07-23 上海电气集团股份有限公司 一种硅钢片测量的定位平台及方法
CN110501347A (zh) * 2019-07-03 2019-11-26 深圳市一纳科技有限公司 一种快速自动化光学检测系统及方法
CN110390325B (zh) * 2019-07-30 2021-07-02 深圳市静尚云科技有限公司 一种网络集中式ocr识别系统及方法
US20220292665A1 (en) * 2019-10-02 2022-09-15 Konica Minolta, Inc. Workpiece surface defect detection device and detection method, workpiece surface inspection system, and program
TWI729520B (zh) * 2019-10-04 2021-06-01 致茂電子股份有限公司 電子組件檢測系統
CN111107324A (zh) * 2019-12-31 2020-05-05 上海陛通半导体能源科技股份有限公司 晶圆传输系统的监控装置及其监控方法
CN111370346B (zh) * 2020-03-19 2023-07-21 长江存储科技有限责任公司 晶圆翘曲度测量装置及方法
CN111916366B (zh) * 2020-07-29 2024-04-12 上海果纳半导体技术有限公司 晶圆检测设备
TWI745144B (zh) * 2020-10-30 2021-11-01 致茂電子股份有限公司 用於檢測晶圓吸盤殘留異物之線掃描光學檢測系統
CN113945572B (zh) * 2021-10-18 2023-08-01 郑州大学 一种基于机器学习的气缸套表面缺陷智能标注装置
CN114115666B (zh) * 2021-11-26 2024-04-16 长江存储科技有限责任公司 半导体结构检测方法及装置
US11913772B2 (en) * 2022-03-17 2024-02-27 Intel Corporation Non-destructive gap metrology
CN115082391A (zh) * 2022-06-13 2022-09-20 昂坤视觉(北京)科技有限公司 一种晶圆反射率确定方法及相关设备
CN115266758B (zh) * 2022-09-27 2022-12-23 苏州高视半导体技术有限公司 晶圆检测系统、晶圆检测方法、电子设备及存储介质
CN116183623B (zh) * 2023-01-04 2024-04-26 天津大学 一种晶圆表面缺陷智能检测方法、装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5822055A (en) * 1995-06-06 1998-10-13 Kla Instruments Corporation Optical inspection of a specimen using multi-channel responses from the specimen using bright and darkfield detection
US6222624B1 (en) * 1997-12-26 2001-04-24 Nidek Co., Ltd. Defect inspecting apparatus and method
US6324298B1 (en) * 1998-07-15 2001-11-27 August Technology Corp. Automated wafer defect inspection system and a process of performing such inspection
US20050168729A1 (en) * 2004-01-30 2005-08-04 Leica Microsystems Semiconductor Gmbh Method for inspecting a wafer

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4806774A (en) * 1987-06-08 1989-02-21 Insystems, Inc. Inspection system for array of microcircuit dies having redundant circuit patterns
JPH02170279A (ja) 1988-12-23 1990-07-02 Hitachi Ltd 被検査対象パターンの欠陥検出方法及びその装置
US6288780B1 (en) * 1995-06-06 2001-09-11 Kla-Tencor Technologies Corp. High throughput brightfield/darkfield wafer inspection system using advanced optical techniques
JP4001653B2 (ja) * 1996-08-29 2007-10-31 ケーエルエー・インストルメンツ・コーポレーション 試料からの多重チャネル応答を用いた試料の光学的検査
US5917588A (en) * 1996-11-04 1999-06-29 Kla-Tencor Corporation Automated specimen inspection system for and method of distinguishing features or anomalies under either bright field or dark field illumination
IL126866A (en) * 1998-11-02 2003-02-12 Orbotech Ltd Apparatus and method for fabricating flat workpieces
US6806951B2 (en) * 2000-09-20 2004-10-19 Kla-Tencor Technologies Corp. Methods and systems for determining at least one characteristic of defects on at least two sides of a specimen
US7009704B1 (en) * 2000-10-26 2006-03-07 Kla-Tencor Technologies Corporation Overlay error detection
US6768543B1 (en) * 2001-11-01 2004-07-27 Arun Ananth Aiyer Wafer inspection apparatus with unique illumination methodology and method of operation
US7359045B2 (en) * 2002-05-06 2008-04-15 Applied Materials, Israel, Ltd. High speed laser scanning inspection system
US7525659B2 (en) * 2003-01-15 2009-04-28 Negevtech Ltd. System for detection of water defects
US7924892B2 (en) * 2004-08-25 2011-04-12 Kla-Tencor Technologies Corporation Fiber amplifier based light source for semiconductor inspection
JP4374303B2 (ja) * 2004-09-29 2009-12-02 株式会社日立ハイテクノロジーズ 検査方法及びその装置
KR20070002249A (ko) * 2005-06-30 2007-01-05 삼성전자주식회사 웨이퍼 결함 검출 방법
JP4734135B2 (ja) * 2005-10-19 2011-07-27 株式会社日立ハイテクノロジーズ 荷電粒子線装置、それに用いられるコンピュータプログラム、及び試料像観察方法
US7747062B2 (en) * 2005-11-09 2010-06-29 Kla-Tencor Technologies Corp. Methods, defect review tools, and systems for locating a defect in a defect review process
US7567344B2 (en) * 2006-05-12 2009-07-28 Corning Incorporated Apparatus and method for characterizing defects in a transparent substrate
JP4760564B2 (ja) * 2006-06-20 2011-08-31 日本電気株式会社 パターン形状の欠陥検出方法及び検出装置
CN101236164B (zh) * 2006-07-31 2012-09-05 以色列商·应用材料以色列公司 用于缺陷检测的方法及系统
KR100769790B1 (ko) * 2006-09-29 2007-10-25 주식회사 하이닉스반도체 다크 필드 장비에서의 결함 검출 방법
US20100118136A1 (en) * 2007-06-13 2010-05-13 Riet Jan Arie Pieter Van Surface inspection device and an arrangement for inspecting a surface
US7782452B2 (en) * 2007-08-31 2010-08-24 Kla-Tencor Technologies Corp. Systems and method for simultaneously inspecting a specimen with two distinct channels

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5822055A (en) * 1995-06-06 1998-10-13 Kla Instruments Corporation Optical inspection of a specimen using multi-channel responses from the specimen using bright and darkfield detection
US6222624B1 (en) * 1997-12-26 2001-04-24 Nidek Co., Ltd. Defect inspecting apparatus and method
US6324298B1 (en) * 1998-07-15 2001-11-27 August Technology Corp. Automated wafer defect inspection system and a process of performing such inspection
US6826298B1 (en) * 1998-07-15 2004-11-30 August Technology Corp. Automated wafer defect inspection system and a process of performing such inspection
US20050168729A1 (en) * 2004-01-30 2005-08-04 Leica Microsystems Semiconductor Gmbh Method for inspecting a wafer

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